KTS1696A KINETIC | Alldatasheet

Document overview

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  • PDF pages: 19

Technical content

Features

  • 3V to 23V Operating Voltage Range
  • 29V Abs. Max. Rating at IN and OUT
  • 7A Continuous Current Rating  15A Pulse Current Rating (duration Pd limited)
  • 11m typ. On-Resistance from IN to OUT
  • Soft-Start (SS) Limits Inrush Current
  • Over-Voltage Protection (OVP) at IN  23V Internally Fixed  4V to 23V External Resistor Programmable
  • “Ideal Diode” Reverse-Current Protection (RCP)
  • Short-Circuit Protection (SCP) at OUT
  • Over-Current Protection (OCP)
  • Over-Temperature Protection (OTP)
  • Transient Voltage Suppression (TVS) at IN  ±90V Surge Protection (IEC61000-4-5)  ±8kV ESD Contact Discharge (IEC61000-4-2)  ±15kV ESD Air Gap Discharge (IEC61000-4-2)
  • EN Active-High Enable Logic Input
  • Auto-Retry after All Faults
  • -40°C to 85°C Operating Temperature Range
  • 25-bump WLCSP 2.70 x 2.70mm (0.5mm pitch) Brief Description The KTS1696A is a low-resistance, high -current load switch with soft -start, over -voltage protection, “ideal diode” reverse-current protection, short-circuit protection, over-current protection, over-temperature protection, and integrated TVS. It is optimized to protect systems with USB Type -C PD ports and barrel connectors that sink up to 1 40W at 20V and must withstand up to 29V on VBUS. Automatic reverse-current protection acts as an “ideal diode” and isolates VBUS when charging or powering the system via another port , regardless of the enable status. Soft-start limits inrush current when turning on with large capacitors at the output. The integrated TVS provides IEC industry standard ESD and ±90V surge ratings. The KTS1696A is packaged in advanced, fully “green” compliant, 2.70 x 2.70mm, 25-bump Wafer-Level Chip- Scale Package (WLCSP).

Applications

  • Notebooks, Netbooks, Ultra-Books, Tablets
  • Mini Desktop PCs, Docking Stations, Monitors Typical Application

November 2021 – Revision 04b Page 2 of 19 Kinetic Technologies Confidential Pin Descriptions Pin # Name Function A1, A2, A3, A4, A5, B1, B2, B3, B4, B5 OUT Power Switch Output – connect to battery charger input (or Vsys in systems without rechargeable batteries). C1, C2, C3, C4, C5, D2, D3, D4, D5 IN Power Switch Input – connect to power input port (VBUS on USB port). D1 ACOK̅̅̅̅̅̅̅̅̅ Power Good Flag – active-low, open-drain logic output E1 EN Enable – active-high logic input E2 OVLO External OVLO Adjustment – connect to GND to use the internally fixed OVLO threshold. Connect an external resistive voltage divider from IN to OVLO to GND to set an adjustable the OVLO threshold. E3, E4, E5 GND Ground Pinout Diagram WLCSP-25 25-bump 2.70mm x 2.70mm x 0.62mm Top Mark WW = Device ID, XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number

November 2021 – Revision 04b Page 3 of 19 Kinetic Technologies Confidential Absolute Maximum Ratings1 Symbol Description Value Units VIN IN to GND (continuous) -0.3 to 29 V IN to GND (during IEC61000-4-5 surge event) -5 to 36 VOUT OUT to GND -0.3 to 29 V VIN-OUT IN to OUT -29 to 29 V VEN EN to GND -0.3 to 29 V VOVLO OVLO to GND -0.3 to VIN V ISW Maximum Switch Current (continuous) 7 A Peak Switch Current (5ms, OCP and Pd limited) 15 TJ Die Junction Operating Temperature Range -40 to 150 °C TS Storage Temperature Range -55 to 150 °C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 260 °C ESD and Surge Ratings2 Symbol Description Value Units VESD_HBM JEDEC JS-001-2017 Human Body Model (all pins) ±2 kV VESD_CD IEC61000-4-2 Contact Discharge (IN) ±8 kV VESD_AGD IEC61000-4-2 Air Gap Discharge (IN) ±15 kV VSURGE IEC61000-4-5 Surge (VIN = 5VDC+Surge, CIN = 10µF, RLOAD = 100) ±90 V IEC61000-4-5 Surge (VIN = 20VDC+Surge, CIN = 10µF, RLOAD = 100) ±80 Thermal Capabilities3 Symbol Description Value Units ΘJA Thermal Resistance – Junction to Ambient 60 °C/W PD Maximum Power Dissipation at TA  25°C (TJ = 125°C) 1.67 W ΔPD/ΔT Derating Factor Above TA = 25°C -16.7 mW/°C

Ordering Information

Part Number Marking4 Operating Temperature Package KTS1696AEOAB-TR QRXXYYZZZZ -40°C to +85°C WLCSP-25 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time. 2. ESD and Surge Ratings conform to JEDEC and IEC industry standards. Some pins may actually have higher performa nce. Surge ratings apply with chip enabled, disabled, or unpowered, unless otherwise noted. 3. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the devi ce when soldered to an EV board. 4. XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number.

November 2021 – Revision 04b Page 4 of 19 Kinetic Technologies Confidential Recommended Operating Conditions5 Symbol Description Value Units VIN Supply Voltage 3 to 23 V VOUT Output Voltage 3 to 23 V VACOK̅̅̅̅̅̅̅̅̅ Power Good Flag Output Voltage6 0 to 5.5 V VOVLO OVLO Adjust Input Bias Voltage 0 to 5.5 V VEN Enable Logic Input Voltage 0 to 20 V TA Ambient Operating Temperature Range -40 to 85 °C TJ Die Junction Operating Temperature Range -40 to 125 °C CIN Input Capacitance 1 to 10 µF COUT Output Capacitance 10 to 450 µF Electrical Characteristics7 Unless otherwise noted, the Min and Max specs are applied over the full operation range of TA = -40°C to +85°C and VIN = 3V to 23V. Typical values are specified at TA = +25°C with VIN = 5V. Supply Specifications Symbol Description Conditions Min Typ Max Units VIN Input Voltage Operating Range 3 23 V VUVLO Under-Voltage Lockout VIN rising threshold 2.7 2.9 V Hysteresis 150 mV IQ No-Load Supply Current Enabled, VIN = 5V, OUT = open 235 µA Enabled, VIN = 20V, OUT = open 300 ISHDN Shutdown Supply Current Shutdown, VIN = 5V, OUT = open 0.65 µA Shutdown, VIN = 20V, OUT = open 2.4 VOUT Output Voltage Operating Range 3 23 V IOUT_RCP Output Supply Current in RCP Enabled, VIN = 0V, VOUT = 5V 130 µA Transient Voltage Suppression (TVS) Specifications Symbol Description Conditions Min Typ Max Units VTVS TVS Clamp Voltage 32.5 V (continued next page) 5. The recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditi ons are specified to ensure optimal performance to the datasheet spec ifications. Kinetic does not recommend exceeding them or designing to Absolute Maximum Rating. 6. ACOK̅̅̅̅̅̅̅̅̅ is an open-drain output flag. Use external pull-up resistor to a suitable I/O voltage. If unused, leave floating or connect to ground. 7. Device is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range by design, characterization, and correlation with statistical process controls.

November 2021 – Revision 04b Page 5 of 19 Kinetic Technologies Confidential Electrical Characteristics (continued)8 Unless otherwise noted, the Min and Max specs are applied over the full operation range of T A = -40°C to +85°C and VIN = 3V to 23V. Typical values are specified at TA = +25°C with VIN = 5V. Logic Pin Specifications Symbol Description Conditions Min Typ Max Units VIH Input Logic High (EN) 1.2 V VIL Input Logic Low (EN) 0.4 V II_LK Input Logic Leakage (EN) VI = 5V VI = 20V -1 1 µA µA VOL Output Logic Low (ACOK̅̅̅̅̅̅̅) IO_SINK = 1mA 0.01 0.2 V IO_LK Output Logic High-Z Leakage (ACOK̅̅̅̅̅̅̅) VO = 5V -1 1 µA Switch Specifications Symbol Description Conditions Min Typ Max Units RON Switch On-Resistance VIN = 5V, IOUT = 1A9 10 20 30 m VIN = 5V, IOUT > 2A 11 VIN = 20V, IOUT > 2A 5 11 17 IIN_OFF Switch Off-Leakage at IN Shutdown, VIN = 5V, VOUT = 0V 0.65 µA Shutdown, VIN = 20V, VOUT = 0V 2.4 Shutdown, VIN = 29V, VOUT = 0V 3.3 10 IOUT_OFF Switch Off-Leakage at OUT Shutdown, VIN = 0V, VOUT = 5V 0.7 µA Shutdown, VIN = 0V, VOUT = 20V 2.8 Shutdown, VIN = 0V, VOUT = 29V 3.9 10 Soft-Start (SS) Specifications (see Figure 1) Symbol Description Conditions Min Typ Max Units tDEB Soft-Start Debounce Time10 RL=100, COUT=300µF, VIN=5V 10 17 25 ms tR Soft-Start VOUT Rising Slew-Rate Ramp Time11 RL=100, COUT=300µF, VIN=5V 1 3 5 ms RL=100, COUT=300µF, VIN=20V 1.8 3 4.5 ILIM_SS Soft-Start Current Limit VIN = 5V to 20V 2 A tLIM_SS Soft-Start Current Limit Done Time VIN = 5V to 20V 7 ms tACOK̅̅̅̅̅̅̅̅̅ Power Good Flag Delay after tLIM_SS VIN = 5V to 20V 3 ms tDOFF Turn-Off Delay Time12 VIN = 5V to 20V 0 3 10 µs (continued next page) 8. Device is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range by design, characterization, and correlation with statistical process controls. 9. When tested at 1A, the RON is limited by the VRCP specification. 10. tDEB is time from enabled logic and VUVLO < VIN < VOVP until VOUT = 10%*VIN. 11. tR is time from VOUT = 10%*VIN until VOUT = 90%*VIN. 12. tDOFF is time from enable logic until VOUT begins to fall.

November 2021 – Revision 04b Page 6 of 19 Kinetic Technologies Confidential Electrical Characteristics (continued)13 Unless otherwise noted, the Min and Max specs are applied over the full operation range of T A = -40°C to +85°C and VIN = 3V to 23V. Typical values are specified at TA = +25°C with VIN = 5V. Over-Voltage Protection (OVP) Specifications Symbol Description Conditions Min Typ Max Units VOVP Internally Fixed Over-Voltage Protection VIN rising OVP threshold 22 23 25 V Hysteresis, VOVLO = 0V 300 mV tOVP OVP Response Time14 RL = 100, COUT = 0µF, VIN > VOVP, VOVLO = 0V 90 ns tOVP_REC OVP Recovery Time15 tDEB+tR ms VOVLO Externally Adjustable Over-Voltage Lockout VOVLO enable threshold 0.2 0.25 0.3 V VOVLO rising OVP threshold 1.10 1.227 1.34 V Hysteresis 25 mV tOVLO OVLO Response Time16 RL = 100, COUT = 0µF 300 ns tOVLO_REC OVLO Recovery Time tDEB+tR ms Reverse-Current Protection (RCP) Specifications Symbol Description Conditions Min Typ Max Units VRCP RCP Droop Regulation Voltage VRCP = VIN – VOUT, IOUT = 100mA 10 20 30 mV tRCP_REC RCP Recovery Time17 tDEB+tR ms Over-Current Protection (OCP) Specifications Symbol Description Conditions Min Typ Max Units tOCP OCP Response Time18 100 ns tOCP_REC OCP Recovery Time tDEB+tR ms Over-Temperature Protection (OTP) Specifications Symbol Description Conditions Min Typ Max Units TOTP IC Junction Over-Temperature Protection TJ rising threshold 150 °C Hysteresis 20 °C tOTP_REC OTP Recovery Time tDEB+tR ms 13. Device is guaranteed to meet performance specifications over the -40°C to +85°C operating temperature range by design, characterization and correlation with statistical process controls. 14. tOVP is time from VIN > VOVP until VOUT stops rising. 15. tOVP_REC is time from VIN < VOVP until VOUT = 90%*VIN. 16. tOVLO is time from VOVLO rises above its OVP threshold until VOUT stops rising. 17. tRCP_REC is time from VOUT < VIN – 80mV until switch turns back on. Before measuring, first raise VOUT >> VIN + 270mV. 18. tOCP is time from IOUT >> 20A until switch turns off.

Figure 5. OCP and SCP Timing Diagram

November 2021 – Revision 04b Page 10 of 19 Kinetic Technologies Confidential Typical Characteristics CIN = 10µF, COUT = 44µF, Load = 100, and TA = +25°C unless otherwise noted. (continued next page)

November 2021 – Revision 04b Page 11 of 19 Kinetic Technologies Confidential Typical Characteristics (continued) CIN = 10µF, COUT = 44µF, Load = 100, and TA = +25°C unless otherwise noted. (continued next page)

November 2021 – Revision 04b Page 12 of 19 Kinetic Technologies Confidential Typical Characteristics (continued) CIN = 10µF, COUT = 44µF, Load = 100, and TA = +25°C unless otherwise noted.

Figure 6. Functional Block Diagram between a power source and a load to isolate and protect against abnormal voltage and current conditions. KTS1696A parts can be used in parallel to support systems that may be charged or powered from multiple ports.

November 2021 – Revision 04b Page 14 of 19 Kinetic Technologies Confidential EN Input The KTS1696A has EN active-high input logic. EN = L disables the power switch and places the device into low power mode. EN = H enables the protection circuits and the power switch. A 17ms de-bounce time deploys before device turn-on and the soft-start ramp. Under-Voltage Lockout (UVLO) When VIN < VUVLO, the power switch is disabled. Once VIN exceeds VUVLO, the power switch is co ntrolled by the enable pin and fault detection circuits. Soft-Start (SS) The internal soft-start function allows the KTS1696A to charge a total output capacitance of 450μF to 20V without excessive in-rush current. Soft -start controls the output voltage slew-rate ramp time. Use the below formula to calculate the current required to charge COUT: 𝐼𝐼𝑁_𝑆𝑆 = 𝐼𝐿𝑂𝐴𝐷 +𝐶𝑂𝑈𝑇 (𝑉𝐼𝑁 𝑡𝑅 where tR = 3ms. In either case, the soft-start time is somewhat fast to reduce power dissipation in the KTS1696A during soft-start. Note that in addition to the soft-start voltage ramp, the soft-start current limit is 2A to prevent excessive heat when starting into an output short-circuit condition or a large total output capacitance. This current limit is turned off after 7ms. After an additional 3ms delay, if VOUT is near VIN, the ACOK̅̅̅̅̅̅̅̅̅ flag indicates a power good condition. Over-Voltage Protection (OVP) When EN = H, the switch is logically enabled. However, if VIN > VOVP, the power switch is disabled due to an OVP fault. Once V IN drops below VOVP, no other fault is detected, and EN = H, the power switch is re-enabled via the soft-start debounce and ramp time. The OVLO pin is used to adjust the over-voltage threshold externally. The default internal over-voltage threshold is 23V when the OVLO pin is tied to GND. Biasing the OVLO pin with a resistive voltage divider adjusts the over voltage threshold from 4V to 23V as in the below formula: 𝑉𝑂𝑉𝑃 = 𝑉𝑂𝑉𝐿𝑂 (1+𝑅1 𝑅2) where VOVLO = 1.227V. Connect R1 from IN to OVLO. Connect R2 from OVLO to ground. “Ideal Diode” Reverse-Current Protection (RCP) The KTS1696A offers reverse-current protection regardless of the enable logic level. When disabled, all current flow is blocked. When enabled, t he RCP acts as a voltage droop regulator. Once the voltage on V OUT is higher than VIN minus 20mV, the RCP circuit reduces the MOSFET gate drive to try and maintain the regulated 20mV droop, thereby acting as an “ideal diode” w ith Vf = 20mV. See Figure 7. This control method blocks all reverse current. The RCP circuit makes it possible to connect two or more USB charging ports to a single c harger input in a “diode-OR” configuration with autonomous reverse-current blocking.

Figure 7. “Ideal Diode” Reverse-Current Protection V-I Curve the soft-start debounce and ramp time. not ramping up. The KTS1696A remains undamaged during continuous SCP events. enabled via the soft-start debounce and ramp time. always active, whether the KTS1696A is enabled or disabled. ramp time. If any fault or the same fault is detected ag ain, the switch will open again, and auto-retry will repeat. This continues until the fault is removed (normal operation) or EN = L (shutdown) or VIN is removed (UVLO).

recommended. For optimal surge and ESD performance, 10µF is preferred. lower over-voltage protection threshold. Protection (OTP) threshold of TJ(MAX) = 150°C. Figure 8. Safe Operating Area (SOA)

The KTS1696A is rated for 7A continuous load current; however, it can support short load pulses at higher currents. PCB design is required. See the Recommended PCB Layout section in this datasheet. loaded at 7A continuous with a 10% duty-cycle pulse (10ms pulse duration) to 10A at 10Hz (100ms) repetition rate. Figure 9. Package Power Dissipation Rating Curves

pin to the adjacent GND pins (not shown in Figure 10). Figure 10. Recommended PCB Layout

November 2021 – Revision 04b Page 19 of 19 Kinetic Technologies Confidential Packaging Information WLCSP55-25 (2.70mm x 2.70mm x 0.62mm) 0.500mm typ. 0.500mm typ. 25 x 0.31mm Ø ±0.031mm 2.70mm ±0.03mm 2.70mm ±0.03mm 0.270mm ±0.027mm 0.620mm ±0.050mm 0.025mm ±0.003mm Bottom ViewSide ViewTop View Top Side Die Coating A1 Corner Recommended Footprint 0.50mm 2.0mm0.225mm Copper Pad Diameter 0.50mm 2.0mm (NSMD Pad Type) 0.325mm Solder Mask Opening * Dimensions are in millimeters. Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and specifications without notice at any time.