KTS1671 KINETIC | Alldatasheet
Document overview
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Technical content
Features
Wide Input voltage range: 2.7V to 28V Up to 3.0A current capability Integrated 60mΩ (typ) N-Channel MOSFET Fast OVP turn-off response time: 100ns Flexible trip-point options Fixed 6.15V(KTS1671) Fixed 9.98V(KTS1672) Fixed 13.5V(KTS1673) Adj. 4V to 20V Auto-enabled switch with 18ms debounce time Under voltage (UVLO), Short-circuit and thermal shutdown protection Compliance to IEC61000-4-2 (level 4) Contact: ±8kV Air Gap: ±15kV ESD Protection Human Body Model: ±2.5kV Pb-free WLCSP-6 package -40°C to +85°C Temperature Range
Applications
Smartphones Mobile Internet Devices Tablet Computers Peripherals Brief Description The KTS1671 over-voltage protection device features an ultra-low 60mΩ (typical) on -resistance high current integrated MOSFET which actively protects low -voltage systems from voltage supply faults up to +28V. An input voltage exceeding the over -voltage threshold will cause the internal MOSFET to turn off, preventing excessive voltage from damaging downstream devices. When the OVLO input is connected to GND, the KTS1671 automatically chooses the internal fixed OVLO threshold, preset to 6.15V (typical). The over -voltage protection threshold can be adjusted with an optional external resistor divider to a voltage between 4V and 20V. In case the device temperature exceed s the maximum junction temperature, the device switches off. The KTS1671 is available in a RoHS and Green compliant 6-Bump 1.20 x 1.00mm WLCSP. Typical Application Adapter/USB OVLO IN OUT GND COUT 1µF CIN 0.1µF Battery Charger Battery PMIC KTS1671TVS Adjustable Over-Voltage Protection Switch
September 2016 - Revision 03f Page 2 Company Confidential Pin Descriptions Pin # Name Function A2, B2 IN Voltage Input. Bypass IN with 0.1µF capacitor as close as possible to the device. C2 OVLO External OVLO adjustment. Connect OVLO to GND when using the internal threshold. Connect a resistor-divider to OVLO to set a different OVLO threshold. C1 GND Ground. A1, B1 OUT Output Voltage WLCSP-6 6-Bump 1.20mm x 1.00mm x 0.6mm (Top Mark) XX = Device Code YY = Date Code, ZZ = Assembly Code TOP VIEW TOP VIEW XX YYZZ C B A 1 2 OUT OUT GND IN IN OVLO
September 2016 - Revision 03f Page 3 Company Confidential Absolute Maximum Ratings1 (TA = 25C unless otherwise noted) Symbol Description Value Units IN Input voltage -0.3 to 30 V OUT Output voltage -0.3 to VIN+0.3 V OVLO OVLO Pin -0.3 to 7 V IN, OUT Current Continuous Current 3.0 A TJ Operating Temperature Range -40 to 150 C Ts Storage Temperature Range -65 to 150 C TLEAD Maximum Soldering Temperature (at leads, 10 sec) 260 C Thermal Capabilities Symbol Description Value Units θJA Thermal Resistance – Junction to Ambient2 107 C/W PD Maximum Power Dissipation at TA ≤ 25°C 1170 mW ΔPD/ΔT Derating Factor Above TA = 25°C -9.4 mW/°C
Ordering Information
Part Number Marking3 Operating Temperature Package KTS1671EUN-TR JOYYZZ -40°C to +85°C WLCSP-6 Recommended Operating Range4 Description Value Input voltage range 2.7V to 28V Output capacitance range Up to 100µF 1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional operation at conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one time. 2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when soldered to an EV board. 3. “JOYYZZ” is the device code, date code and assembly code respectively. 4. The device is not guaranteed to function outside of recommended operating condition.
September 2016 - Revision 03f Page 4 Company Confidential Electrical Characteristics5 Unless otherwise noted, t he Min and Max specs are applied over the full operation temp erature range of –40°C to +85°C, while Typ values are specified at room temperature (25°C). VIN = 5.0V, IIN ≤ 3A Symbol Description Conditions Min Typ Max Units INPUT Operation VIN Input operating range 2.5 28 V IIN Input supply current VIN = 5V, VIN < VIN_OVLO 120 A VIN_UVLO Under voltage lockout threshold VIN rising 2.3 V VUVLO_HYST Under voltage lockout hysteresis 0.1 V OVP VIN_OVLO Internal over voltage trip level VIN rising 5.95 6.15 6.35 V VIN_OVLO_HYS OVLO Hysteresis VIN falling 0.10 V VOVLO_TH OVLO preset threshold range 1.10 1.20 1.30 V Adjustable OVLO threshold range 4 20 V VOVLO_SEL External OVLO select threshold 0.2 0.3 V RDS(ON) Switch On-Resistance VIN = 5V, IIN = 1.0A, TA = +25℃ 60 mΩ IOVLO OVLO input leakage current VOVLO = VOVLO_TH -120 120 nA TIMING – Figure 1 tDEB Debounce time Time from 2.5V < VIN < VIN_OVLO to VOUT = 10% of VIN 18 ms tON Switch turn-on time VIN = 5V, RL = 100Ω, CLOAD = 100F VOUT from 10%, VIN to 90% VIN 2 ms tOFF Switch turn-off time VIN > VIN_OVLO to VOUT stop rising 100 ns ESD PROTECTION VESD IEC61000-4-2 Contact discharge IN and OUT pins. CIN = COUT = 1µF ±8 kV IEC61000-4-2 Air gap discharge IN and OUT pins. CIN = COUT = 1µF ±15 kV All pins Human Body Model(HBM) Model = 2 ±2.5 kV THERMAL SHUTDOWN tJ-TH IC junction thermal shutdown threshold 145 C IC junction thermal shutdown hysteresis 20 C 5. KTS1671 is guaranteed to meet performance specifica tions over the –40°C to +85°C operating temperature range by design, characterization and correlation with statistical process controls.
Figure 1. Timing Diagram
September 2016 - Revision 03f Page 6 Company Confidential Typical Characteristics VIN = 5V, CIN = 0.1µF, COUT = 1µF, OVLO pin = GND, Temp = 25°C unless otherwise specified. Normalized RDSON vs. Output Current Normalized RDSON vs. Temperature Input Supply Current vs. Input Voltage (no load) Normalized Debounce Time vs. Temperature Normalized Fixed OVLO vs. Temperature (OVLO pin GND) Normalized Adjustable OVLO Threshold vs. Temperature 0.0 0.5 1.0 1.5 2.0 0 1 2 3 Normalized RDS_ON Ouput Current (A) Normalized to 1A 0.0 0.5 1.0 1.5 2.0 -40 -15 10 35 60 85 Normalized RDS_ON Temperature (°C) IOUT = 1A Normalized to TA = +25°C 120 160 200 0 4 8 12 16 20 24 28 Input Supply Current (uA) Input Voltage (V) 0.0 0.5 1.0 1.5 2.0 -40 -15 10 35 60 85 Normalized Debounce Time Temperature (°C) Normalized to TA = +25°C 0.90 0.95 1.00 1.05 1.10 -40 -15 10 35 60 85 Normalized Threshold Voltage Temperature (°C) Normalized to TA = +25°C 0.90 0.95 1.00 1.05 1.10 -40 -15 10 35 60 85 Normalized Threshold Voltage Temperature (°C) Normalized to TA = +25°C
September 2016 - Revision 03f Page 7 Company Confidential Typical Characteristics (continued) VIN = 5V, CIN = 0.1µF, COUT = 1µF, OVLO pin = GND, Temp = 25°C unless otherwise specified. Power-up (COUT = 10µF, 1A load) OVP Transient (VIN step from 5V to 8V) Iout 1A / div 4ms / div Vout 5V / div Vin 5V / div Iout 100mA / div 10µs / div Vout 5V / div Vin 5V / div
September 2016 - Revision 03f Page 8 Company Confidential Functional Block Diagram Functional Description The KTS1671 is inserted between the power supply or charger source and the load to be protected. The KTS1671 consists of a slew-rate controlled, low resistance OVP switch, under -voltage lockout protection (UVLO), and over-voltage monitor and protection (OVLO). The KTS1671 overvoltage protection device features a low on-resistance (RDSON) internal FET and protects low- voltage systems against voltage faults up to + 28V. If the input voltage exceeds the overvoltage threshold, the internal FET is turned off to prevent dama ge to upstream components. The 18ms debounce time built into the device prevents false turn on of the internal FET during startup. In normal operation the OVP switch acts as a slew -rate controlled load switch, connecting and disconnecting the power supply from IN to OUT. A low resistance N -Channel MOSFET is used to minimize the voltage drop between the voltage source and the load and to reduce power dissipation. When the voltage at the input exceeds the programmed over-voltage trip point, the device immediately turns off the internal switch disconnecting the load from the abnormal voltage, preventing damage to downstream components. In the event that the power dissipation causes the chip temperature to exceed its maximum temperature setting, the KTS1671 will switch off protecting the device. Once the chip temperature has cooled to below the hysteresis temperature, KTS1671 will re-initiate. Should the over-temperature condition persist, then KTS1671 will continue to thermally cycle on and off, until the input power is removed.. OVLO VIN / OVLO Detection and OVP Control OUT GND Internal Band Gap Reference Thermal Detection IN Charge Pump Logic Control
September 2016 - Revision 03f Page 9 Company Confidential USB ON-The-Go (OTG) Operation When used in an OTG application the KTS1671 can provide power from OUT to IN . Initially, the OTG voltage applied at OUT will forward bias the power switch bulk diode and present a voltage drop of approximately 0.7V between OUT and IN. The maximum current in this mode is limited by the thermal performance of the device and at an ambient temperature of 25°C IMAX = 1.17W/0.7V = 1.67A This is purely a transitionary condition as once the voltage at IN exceeds the UVLO voltage of 2.3V and the debounce time of 18ms has elapsed, the main power switch will turn fully ON, significantly reducing the voltage drop from OUT to IN. UVLO (Under Voltage Lockout) The device has a built−in under voltage lock out (UV LO) circuit. When VIN is rising , the output remains disconnected from the input until V IN voltage is above 2.3V (nominal). This circuit has a 100mV hysteresis to provide noise immunity to transient conditions. OVLO (Over Voltage Lockout) The KTS1671 adjustable version has a 1. 2V (typ) overvoltage trip threshold on the OVP pin. With a resistor divider on OVLO pin from IN to GND, the over -voltage protection point of IN can be adjusted between 4V and 20V. Fixed OVP products are available with an internal resistor divider providing 6.15V(typ), 9.98V (typ), or 13.5V (typ) OVLO threshold trip voltage. To activate the internal Fixed OVP, the OVLO pin should be connected to GND. Internal MOSFET Switch The KTS1671 incorporates an internal MOSFET with a 60mΩ (typ) RDS(ON). The MOSFET gate is driven by an integrated charge pump which generates the necessary voltage above IN. Thermal Protection The internal FET turns off when the junction temperature exceeds +1 45°C (typ). The device exits thermal shutdown after the junction temperature cools down by 20°C (typ).
Application Information
A 0.1μF or larger capacitor is typically recommended for CIN. CIN should be located close to the device IN pin . Ceramic capacitors are recommended for CIN . Select capacitors with a voltage rating at least 5V higher than the maximum possible voltage during surge. 50V rated capacitors are ideal for most applications. Output Capacitor In order to ensure stability while the current limit is active, a small output capacitance of approximately 1μF is required at the output. The output capacitor has no specific capacitor ESR requirement. If desired, COUT may be increased to accommodate any load transient condition. External OVLO Adjustment If OVLO is connected to ground, the internal OVLO comparator uses the internally set OVLO value. The adjustable threshold uses a 1.20V (typical) overvoltage trip threshold on the OVLO pin. With a resistor divider on the OVLO pin from IN to GND, the over-voltage protection point of IN can be adjusted between 4V and 20V. Once the OVLO pin voltage exceeds the OVLO select voltage, VOVLO_SELECT (0.25V typical), the comparator reads the OVLO pin voltage (a fraction of IN) set by the external resistor divider (R1, R2). R1 = 1MΩ is a good starting value for minimum current consumption. Since V IN_OVLO, VOVLO_THRESH, and R1 are known, R2 can be calculated from the following formula: VIN_OVLO = VOVLO_TH x (1+R1/R2) = 1.20V x (1+R1/R2) This external resistor-divider is completely independent from the internal resistor-divider.
September 2016 - Revision 03f Page 10 Company Confidential Packaging Information WLCSP–6, 1.2mm x 1.0mm Package Recommended Footprint Kinetic Technologies cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Kinetic Technologies product. No intellectual property or circuit patent licenses are implied. Kinetic Technologies reserves the right to change the circuitry and specifications without notice at any time WLCSP 1.0 x 1.5 1 X 0.400mm A1 Corner Top Side Die Coating Top View Bottom ViewSide View 0.620 ± 0.045mm 0.025 ± 0.003mm 1.00 ± 0.030mm 1.20mm ± 0.030mm
6 X Ø
0.250 ± 0.025mm 2 X 0.400mm 0.22 ± 0.022mm (NSMD Pad Type) * Dimensions are in millimeters. 0.40mm 0.40mm 0.22mm Copper Pad Diameter 0.32mm Solder Mask Opening 0.80mm