KTBCD430-D1 KENTECDISPLAY | Alldatasheet
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Product Bi-stable Cholesteric Display Module 128 x 64 Dots Matrix Build In Voltage Booster KTBCD430-D1 Kentec Electronics (Displays) Limited URL: http://www.kentec.com.hk
- Document revision history : DOCUMENT REVISION DATE DESCRIPTION PREPARED BY APPROVED BY 2011.10.10 First Release. XW Li
- General Description
- 128 x 64 dots, Reflective.
- Wide viewing angle.
- 4-Wire SPI interface.
- Logic voltage: 2.8V (typ.). 3. Mechanical Specifications The mechanical detail is shown in Fig. 1 and summarized in Table 1 below. Table 1 Parameter Specifications Unit Outline dimensions 65.0W) x 43.4(H) x 3.15(D) (Exclude FPC cables and pin header) mm View area 61.0(W) x 31.4 (H) mm TP active area - mm LCD active area 55.025(W) x 27.505(H) mm Display format 128 x 64 dot matrix dots 128x64 Dot Matrix Dot pitch 0.43(RGB)(W) x 0.43(H) mm Weight TBD grams
Bi-stable Cholesteric Display Figure 1: Outline Drawing
- Interface signals Table 2: Pin assignment Pin No. Symbol Description 1 VCC Power supply voltage (3.3V) 2-5 NC No connection
6 RS Data/Register select, set high for data input and low for register input
7 CS Chip select, low active
14 RESET Reset signal input, low active
15 SCLK Serial clock input
18 SDA Serial data input
19 BUSY Chip busy signal output, output high level indicates busy status
20 GND Ground (0V)
- Absolute Maximum Ratings
5.1 Electrical Maximum Ratings
Table 3: Electrical Maximum Ratings – for IC Parameter Symbol Min. Max. Unit Note Power supply voltage VCC -0.3 +3.6 V 1 Input voltage Vin -0.3 +3.9 V 1 Note: 1.VCC, GND must be maintained. 2.The modules may be destroyed if they are used beyond the absolute maximum ratings.
5.2 Environmental Condition
(Topr) Storage temperature (Tstg) (Note 1) Item Min. Max. Min. Max. Remark Ambient temperature -0°C +50°C -20°C +70°C Dry Humidity (Note 1) 90% max. RH for Ta ≤ 40 °C < 50% RH for 40°C < Ta ≤ Maximum operating temperature No condensation Note 1: Product cannot sustain at extreme storage conditions for long time.
- Electrical Specifications Typical Electrical Characteristics At Ta = 25 °C, VCC = 3.3V, GND=0V. Table 5 Parameter Symbol Conditions Min. Typ. Max. Unit Input voltage low VIL 0 - 0.2VCC V Input voltage high VIH 0.8VCC - VCC V Supply current (Logic & LCD) ICC VCC=3.3V - 2 3 mA 7. Optical Characteristics Table 6: Optical specifications Specifications Items Symbol Condition Min. Typ. Max. Unit Image refresh time - VCC=3.3V, VLCD=24V, @25°C - 1.8 - s Contrast Ratio CR - 6 - - φ 1(3 o’clock) - 80 - Hor. φ 2(9 o’clock) - 80 - θ 2(12 o’clock) - 80 - Viewing angle CR≧2 Ver. θ 1(6 o’clock) VLCD= optimum voltage - 80 - deg. Note 1: Contrast Ratio B1 = Pixel luminance at stable dark state B2 = Pixel luminance at stable bright state Contrast Ratio = B1/B2. Note 2: Viewing Angle Figure 2
- Timing Characteristics
8.1 SPI write timing
Figure 3: 4-Wire SPI write procedure Table 7: 4-Wire SPI write timing
8.2 Command table
RS Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description 0 10-1F 0 0 0 1 A3 A2 A1 A0 Set the higher nibble of the column address register using A3A2A1A0 as data bits. The higher nibble of column address is reset to 0000b after POR. 0 0 0 0 B3 B2 B1 B0 Set column address Set the lower nibble of the column address register using B3B2B1B0 as data bits. The lower nibble of column address is reset to 0000b after POR. 0 2A-2F 0 0 1 0 1 X2 1 X0 Set Power Control Register X2: 0: turns off the internal voltage booster (POR) 1: turns on the internal voltage booster X0: 0: turns off the Bias Voltage buffer (POR) 1: turns on the Bias Voltage buffer 0 31 0 0 1 1 0 0 0 1 Driving update Update RAM content to the screen through segment and common pins. Driving sequence is always in: VA clearing phase ? VA Idle phase ? AA clearing phase ? AA Idle phase ? Driving phase 0 32 0 0 1 1 0 0 1 0 Driving Scheme X6: Segment value at active clearing 1: All segment (exclude DSEG) are zero at active clear 0: All segment (exclude DSEG) are one at active clear (POR=0) X5X4: 00: SEG_D and COM_D are in Hi-Z 01: NA 10: SEG_D as data 0, COM_D scanning (POR) 11: SEG_D as data 1, COM_D scanning X3: drive polarity 0: M starts as 1 at Drive phase for Scheme A (POR) 1: M starts as 0 at Drive phase for Scheme A X2: view area and active area clearing polarity 0: M starts as 1 at Clear phase for Scheme A (POR) 1: M starts as 0 at Clear phase for Scheme A Refer to the Table 8-2 : Polarity Setting in Scheme B for Scheme B setting X1: All segment data in viewing area clear phase 0: Data = 0 (POR) 1: Data = 1 X0: Driving Scheme 0: Scheme A (POR) 1: Scheme B – Frame Inversion Display start line register is reset to 000000 after POR for all MUX modes. 0 0 X6 X5 X4 X3 X2 X1 X0 0 40-4F 0 1 X5 X4 X3 X2 X1 X0 Set Display Start Line Display start line register is reset to 000000 after POR for all MUX modes.
RS Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description 0 80 1 0 0 0 0 0 0 0
0 A[6:0] * 0 0 0 0 0 0 0
0 B[4:0] * * B5 B4 B3 B2 B1 B0
0 C[4:0] * * C5 C4 C3 C2 C1 C0
0 D[4:0] * * D5 D4 D3 D2 D1 D0
0 E[4:0] * * E5 E4 E3 E2 E1 E0
0 F[4:0] * * F5 F4 F3 F2 F1 F0
0 G[6:0] * G6 G5 G4 G3 G2 G1 G0
0 H[6:0] * H6 H5 H4 H3 H2 H1 H0
Set the table data by sending the command 0x80 and then 8 byte data. A[6:0] : 0X00 B[4:0] : View Area Clearing Duration C[4:0] : View Area Idle Duration D[4:0] : Active Area Clearing Duration E[4:0] : Active Area Idle Duration F[4:0] : Driving Duration G[6:0] : Clearing Voltage H[6:0] : Driving Voltage 0 93 1 0 0 1 0 0 1 1 0 0 0 0 0 X3 X2 X1 X0 Set VA clearing phase repeat times Repeat times is X3X2X1X0 (POR=0001) *Remark: If VA clearing phase repeat time is set to 0, it is also needed to set the idle1 phase repeat time to 0. 0 94 1 0 0 1 0 1 0 0 0 0 0 0 0 X3 X2 X1 X0 Set idle1 phase repeat times Repeat times is X3X2X1X0 (POR=0001) *Remark: If Idle1 phase repeat time is set to 0, it is also needed to set the VA clearing phase repeat time to 0. 0 95 1 0 0 1 0 1 0 1 0 0 0 0 0 X3 X2 X1 X0 Set AA clearing phase repeat times Repeat times is X3X2X1X0 (POR=0001) *Remark: If AA clearing phase repeat time is set to 0, it is also needed to set the idle2 phase repeat time to 0. 0 96 1 0 0 1 0 1 1 0 0 0 0 0 X3 X2 X1 X0 Set idle2 phase repeat times Repeat times is X3X2X1X0 (POR=0001) *Remark: If Idle2 phase repeat time is set to 0, it is also needed to set the AA clearing phase repeat time to 0. 0 97 1 0 0 1 0 1 1 1 0 0 0 0 0 X3 X2 X1 X0 Set drive phase repeat times Repeat times is X3X2X1X0 (POR=0001)
0 A0-A1 1 0 1 0 0 0 0 X0
X0: 0: Column address 00h is mapped to SEG0 (POR) 1: Column address 83h is mapped to SEG0
0 A2 1 0 1 0 0 0 1 0
X2X1X0: 000: 1/9 001: 1/8, 010: 1/7, (POR) 011: 1/6, 100: 1/5, 101: 1/ 4.6, 110: 1/ 4.3, 111: 1/4
0 A3 1 0 1 0 0 0 1 1
X4X3 = 00: Disable X4X3 = 11: Enable X1 = 0: Standard BIAS VOLTAGE Buffer Setting X1 = 1: Extra BIAS VOLTAGE Buffer Setting
0 A4-A5 1 0 1 0 0 1 0 X0
X0=0: normal display (POR) X0=1: entire display on
0 A6-A7 1 0 1 0 0 1 1 X0
X0=0: normal display (POR) X0=1: reverse display
0 A8 1 0 1 0 1 0 0 0
To select multiplex ratio N MUX N = X6X5X4X3X2X1X0 from 2 to 64(POR)
RS Hex D7 D6 D5 D4 D3 D2 D1 D0 Command Description
0 A9 1 0 1 0 1 0 0 1
X0: 0: OFF (POR) 1: ON
0 AD 1 0 1 0 1 1 0 1
X0: 0: RAM read/write horizontal (POR) 1: RAM read/write vertical
0 B0-B7 1 0 1 1 0 X2 X1 X0
Set GDDRAM Page Address (0-7) for read/write using X2X1X0 (POR=000) C0 – C8 1 1 0 0 X3 0 0 0 Set COM Output Scan Direction X3=0: normal mode (POR) X3=1: remapped mode COM0 to COM [N-1] becomes COM [N-1] to COM0 when Multiplex ratio is equal to N.
0 D3 1 1 0 1 0 0 1 1
After POR, X5X4X3X2X1X0 = 0 After setting MUX ratio less than default value, data will be displayed at the beginning/towards the end of display matrix. To move display towards Row 0 by L, X5X4X3X2X1X0 = L To move display away from Row 0 by L, X5X4X3X2X1X0 = Y - L Note: max value of L = Y – display MUX Y represents POR default MUX
0 E2 1 1 1 0 0 0 1 0
Reset Initialize internal status registers.
0 E3 1 1 1 0 0 0 1 1 NOP No operation
0 E9 1 1 1 0 1 0 0 1
0 X7 0 0 0 0 1 0 0
X7: Bias Resistor Ladder Enable 0: Disable (POR) 1: Enable
0 F6 1 1 1 1 0 1 1 0
X6: Oscillator Enable 0: Disable (POR) 1: Enable 9. Reliability Test Item Test Item Test Condition Test result determinant gist High temperature storage 70±3℃; 240H Low temperature storage -20±3 ;℃ 240H High temperature /humidity storage 96H the inspection of appearance and function character. High temperature operation 50±3 ;℃ 240H Low temperature operation 0±3 ;℃ 240H no objection of the function character; no fatal objection of the appearance. Temperature Shock -0±3℃, 30min? 50±3℃, 30min; 10cycle inspect the objections appearance、 function & the whole structure
- Suggestions for using LCD modules
10.1 Handling of LCM
- The LCD screen is made of glass. Don't give excessive external shock, or drop from a high place. 2. If the LCD screen is damaged and the liquid crystal leaks out, do not lick and swallow. When the liquid is attach to your hand, skin, cloth etc, wash it off by using soap and water thoroughly and immediately. 3. Don't apply excessive force on the surface of the LCM. 4. If the surface is contaminated ,clean it with soft cloth. If the LCM is severely contaminated , use Isopropyl alcohol/Ethyl alcohol to clean. Ot her solvents may damage the polarizer . The following solvents is especially prohibited: water , ketone Aromatic solvents etc. 5. Exercise care to minimize corrosion of the electrode. Corrosion of the electrodes is accelerated by water droplets, moisture condensation or a current flow in a high-humidity environment. 6. Install the LCD Module by using the mounting holes. When mounting the LCD module make sure it is free of twisting, warping and distortion. In particular, do not forcibly pull or bend the I/O cable or the backlight cable. 7. Don’t disassemble the LCM. 8. To prevent destruction of the elements by static electricity, be careful to maintain an optimum work environment. - Be sure to ground the body when handling the LCD modules. - Tools required for assembling, such as soldering irons, must be properly grounded. - To reduce the amount of static electricity generated, do not conduct assembling and other work under dry conditions. - The LCD module is coated with a film to protect the display surface. Exercise care when peeling off this protective film since static electricity may be generated. 9. Do not alter, modify or change the the shape of the tab on the metal frame. 10. Do not make extra holes on the printed circuit board, modify its shape or change the p ositions of components to be attached.
- Do not damage or modify the pattern writing on the printed circuit board. 12. Absolutely do not modify the zebra rubber strip (conductive rubber) or heat seal connector 13. Except for soldering the interface, do not make any alterations or modifications with a soldering iron. 14. Do not drop, bend or twist LCM.
10.2 Storage
- Store in an ambient temperature of 5 to 45 °C, and in a relative humidity of 40% to 60%. Don't expose to sunlight or fluorescent light. 2. Storage in a clean environment, free from dust, active gas, and solvent. 3. Store in antistatic container. 11. Inspection Standard SAMPLING METHOD SAMPLING PLAN: MIL-STD 105E CLASS OF AQL: LEVEL II/ SINGLE SAMPLING MAJOR-0.65% MINOR – 1.5% QUALITY STANDARD DEFECT CRITERIA TYPE FIGURE SHORT CIRCUIT - MAJOR - MISSING SEGMENT - MAJOR - UNEVEN / POOR CONTRAST - MAJOR - CROSS TALK - MAJOR - PIN HOLE MAX(a,b) ≤ 1 / 4 W MINOR 1 EXCESS SEGMENT MAX(c,d) ≤ 1 / 4 T MINOR 1 BUBBLES d* ≥ 0.2 QTY=0 MINOR 2 BLACKS SPOTS d ≤ 0.3 N.A.** 0.3<d≤ 0.4 QTY ≤ 1 0.4<d QTY=0 MINOR 2 LINE SCRATCHES x≥ 0.7 y ≥ 0.05 QTY=0 MINOR 3 BLACK LINE x≥ 0.7 y ≥ 0.05 QTY=0 MINOR 3 *d = MAX (d 1,d2) ** N. A . = NOT APPLICABLE DEF ECT TABLE : B
QUALITY STANDARD ( CONT .) DEFECT CRITERIA TYPE FIGURE CONTACT EDGE e ≤ 1/2T f ≤ 1/3W g ≤ 3.5 4 CHIPS BOTTOM GLASS p ≤ 1.0 q ≤ 3.5 r ≤ 1/2T MINOR 4 CORNER a ≤ 1.5 b ≤ W 4 TOP GLASS a ≤ 3.0 b ≤ 1/3T c ≤ 1/2W 5 GLASS PROTRUSION a ≤ 1/4 W MINOR 6 RAINBOW - MINOR - UNLESS STATE OTHERWISE , ALL UNIT ARE IN MILLIMETER . DEFE CT TABLE : B 11. Packing (Reference only) T.B.D - END -