KSDELPS1.22 OSRAM | Alldatasheet

Document overview

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Technical content

KS DELPS1.22 DATASHEETDATASHEET 1 | Version 1.12 | 2024-06-20 www.osram-os.com KS DELPS1.22 Datasheet Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved

KS DELPS1.22 DATASHEETDATASHEET 2 | Version 1.12 | 2024-06-20 TOPLED® E1608 KS DELPS1.22 The TOPLED E1608 expands ams OSRAM’s low power port- folio to meet the requirements in the field of illumination of switches and buttons in automotive interior applications. It offers one of the smallest LED industry standard footprints in a highly reliable and well proved package concept. The TOPLED E1608 is available in different colors and brightness levels. Its outstanding performance is suitable for a huge variety of appli- cations where a small package design with excellent reliability is needed.

Applications

  • Ambient Lighting - Appliances & Tools - Automotive Aftermarket - Functional Illumination

Features

  • Package: white SMT package, colorless clear resin - Chip technology: Thinfilm - Typ. Radiation: 120° (Lambertian emitter) - Color: λdom = 628 nm (● super red) - Corrosion Robustness Class: 2B - Qualifications: AEC-Q102 Qualified - ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

KS DELPS1.22 DATASHEETDATASHEET 3 | Version 1.12 | 2024-06-20

Ordering Information

Type Luminous Intensity 1) Ordering Code IF = 20 mA Iv KS DELPS1.22-TIVH-68-H3Q4 390 ... 970 mcd Q65112A4763

KS DELPS1.22 DATASHEETDATASHEET 4 | Version 1.12 | 2024-06-20 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. max. -40 °C 110 °C Storage Temperature Tstg min. max. -40 °C 110 °C Junction Temperature Tj max. 125 °C Forward current TS = 25 °C IF max. 30 mA Surge current t ≤ 10 µs; D = 0.005 ; TS = 25 °C IFS max. 70 mA Reverse voltage 2) TS = 25 °C VR max. 12 V ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 kV

KS DELPS1.22 DATASHEETDATASHEET 5 | Version 1.12 | 2024-06-20 Characteristics IF = 20 mA; TS = 25 °C Parameter Symbol Values Peak Wavelength λpeak typ. 643 nm Dominant Wavelength 3) IF = 20 mA λdom min. typ. max. 627 nm 628 nm 637 nm Viewing angle at 50% IV 2φ typ. 120 ° Forward Voltage 4) IF = 20 mA VF min. typ. max. 1.95 V 2.15 V 2.50 V Reverse current 2) VR = 12 V IR typ. max. 0.01 µA 10 µA Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C TCλpeak typ. 0.15 nm / K Real thermal resistance junction/ambient 5)6) RthJA real max. 510 K / W Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

120 K / W

150 K / W

KS DELPS1.22 DATASHEETDATASHEET 6 | Version 1.12 | 2024-06-20 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) IF = 20 mA IF = 20 mA IF = 20 mA min. max. typ. Iv Iv ΦV TI 390 mcd 450 mcd 1386 mlm UG 450 mcd 520 mcd 1601 mlm UH 520 mcd 610 mcd 1865 mlm UI 610 mcd 710 mcd 2178 mlm VG 710 mcd 820 mcd 2525 mlm VH 820 mcd 970 mcd 2954 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) IF = 20 mA IF = 20 mA min. max. VF VF H3 1.95 V 2.10 V L4 2.10 V 2.30 V Q4 2.30 V 2.50 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) IF = 20 mA IF = 20 mA min. max. λdom λdom 6 627 nm 630 nm 7 630 nm 634 nm 8 634 nm 637 nm

KS DELPS1.22 DATASHEETDATASHEET 7 | Version 1.12 | 2024-06-20 Group Name on Label Example: TI-6-H3 Brightness Wavelength Forward Voltage TI 6 H3

KS DELPS1.22 DATASHEETDATASHEET 8 | Version 1.12 | 2024-06-20 Relative Spectral Emission 7) Irel = f (λ); IF = 20 mA; TS = 25 °C KS DELPS1.22 350 400 450 500 550 600 650 700 750 800 λ / 0.0 0.2 0.4 0.6 0.8 1.0 I :V λ :s uper red Radiation Characteristics 7) Irel = f (ϕ); TS = 25 °C KS DELPS1.22 -100° -90° -80° -70° -60° -50° -40° -30° -20° ϕ / 0.0 0.2 0.4 0.6 0.8 1.0 I :0 ° : 90°

KS DELPS1.22 DATASHEETDATASHEET 9 | Version 1.12 | 2024-06-20 Forward current 7) IF = f(VF); TS = 25 °C KS DELPS1.22 VF /V 70IF /m A Relative Luminous Intensity 7), 8) Iv/Iv(20 mA) = f(IF); TS = 25 °C KS DELPS1.22 1 10 20 30 40 50 60 70 IF /m A 0.0 0.5 1.0 1.5 2.0 2.5 3.0 IV IV(20mA)

KS DELPS1.22 DATASHEETDATASHEET 10 | Version 1.12 | 2024-06-20 Forward Voltage 7) ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA KS DELPS1.22 -40- 20 02 04 06 08 0 100 120 Tj /° C -0.3 -0.2 -0.1 0.0 0.1 0.2 0.3∆VF /V Relative Luminous Intensity 7) Iv/Iv(25 °C) = f(Tj); IF = 20 mA KS DELPS1.22 -40- 20 02 04 06 08 0 100 120 Tj /° C 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6Iv Iv(25°C) Dominant Wavelength 7) λdom = f(Tj); IF = 20 mA KS DELPS1.22 -40- 20 02 04 06 08 0 100 120 Tj /° C /g39/g79dom /n m

KS DELPS1.22 DATASHEETDATASHEET 11 | Version 1.12 | 2024-06-20 Max. Permissible Forward Current 5) IF = f(T) 02 04 06 08 0 100 T /° C IF /m A :T a :T s Permissible Pulse Handling Capability IF = f(tp); D: Duty cycle 10-6 10-5 10-4 10-3 0,01 0,11 10 Pulset ime [s] IF [mA] TS =0 °C ... 110°C KS DELPS1.22 :D =1 .0 :D =0 .5 :D =0 .2 :D =0 .1 :D =0 .05 :D =0 .02 :D =0 .01 :D =0 .005

KS DELPS1.22 DATASHEETDATASHEET 12 | Version 1.12 | 2024-06-20 Dimensional Drawing 9) Further Information: Approximate Weight: 2.0 mg Package marking: Anode Corrosion test: Class: 2B Test condition: 25°C / 75 % RH / 10 ppm H2S / 21 days (IEC 60068-2-43)

KS DELPS1.22 DATASHEETDATASHEET 13 | Version 1.12 | 2024-06-20 Electrical Internal Circuit

KS DELPS1.22 DATASHEETDATASHEET 14 | Version 1.12 | 2024-06-20 Recommended Solder Pad 9) All products are packed in a dry pack bag (Moisture Barrier Bag, MBB) according MIL-PRF-81705, after opening the MBB the products should go to reflow soldering process. Unused remaining LEDs should be protected from environment due to silver plated soldering terminal. In order to maintain solderability it is recommended to protect the silver plated solder terminals from corrosive environment before soldering. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.

KS DELPS1.22 DATASHEETDATASHEET 15 | Version 1.12 | 2024-06-20 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* TP to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

KS DELPS1.22 DATASHEETDATASHEET 16 | Version 1.12 | 2024-06-20 Taping 9)

KS DELPS1.22 DATASHEETDATASHEET 17 | Version 1.12 | 2024-06-20 Tape and Reel 10) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 9000

KS DELPS1.22 DATASHEETDATASHEET 18 | Version 1.12 | 2024-06-20 Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

KS DELPS1.22 DATASHEETDATASHEET 19 | Version 1.12 | 2024-06-20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit https://ams-osram.com/support/application-notes

KS DELPS1.22 DATASHEETDATASHEET 20 | Version 1.12 | 2024-06-20 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on our website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product and functional safety devices/applications or medical devices/applications Our components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. Our products are not qualified at module and system level for such application. In case buyer – or customer supplied by buyer – considers using our components in product safety devices/ applications or medical devices/applications, buyer and/or customer has to inform our local sales partner immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request between us and buyer and/or customer.

KS DELPS1.22 DATASHEETDATASHEET 21 | Version 1.12 | 2024-06-20 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: This product is intended to be operated applying a forward current within the specified range. Applying any continuous reverse bias or forward bias below the voltage range of light emission shall be avoided because it may cause migration which can change the electro-optical char- acteristics or damage the LED. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro- ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ) used for Derating. 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic- es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif- fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ- ences between single devices within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

KS DELPS1.22 DATASHEETDATASHEET 22 | Version 1.12 | 2024-06-20

Revision History

1.5 2019-03-18 Maximum Ratings 1.5 2019-05-20 Maximum Ratings 1.5 2019-05-20 Maximum Ratings 1.6 2020-03-05 Derating (Diagrams) 1.7 2020-03-09 Schematic Transportation Box Dimensions of Transportation Box 1.8 2020-06-04 Further Information 1.9 2022-11-08 Tape and Reel Reel Dimensions 1.10 2023-05-15 Characteristics Electro - Optical Characteristics (Diagrams) Glossary 1.11 2023-12-13 Brightness Groups 1.12 2024-06-20 Applications

KS DELPS1.22 DATASHEETDATASHEET 23 | Version 1.12 | 2024-06-20 Published by ams-OSRAM AG Tobelbader Strasse 30, 8141 Premstaetten, Austria Phone +43 3136 500-0 ams-osram.com © All rights reserved