KP464

KP464 INFINEON | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 36

Technical content

Features

• High accuracy pressure sensing (±1.0 kPa), pressure range 40 to 115 kPa
• Operating ambient temperature range -40°C to 125°C
• Best in class low power consumption with dedicated power-down mode for energy saving
• 10-, 12- or 14-bit resolution pressure and temperature values via SPI Interface
• Integrated signal path diagnosis features
• Green, small 4.5 mm x 5.1 mm 8-pin DFN package Potential applications
• Automotive barometric air pressure sensor (BAP)
• Automotive manifold air flow sensor (MAF)
• Automotive battery monitoring system (BMS)
• Automotive seat comfort system
• Industrial control
• Weather stations
• Altimeters Product validation Product validation according to AEC-Q103-002. Qualified for automotive applications.

Description

The KP464 is a high-performance, high-precision miniaturized digital absolute pressure sensor based on a capacitive sensing principle. It is surface micromachined with a monolithic integrated signal conditioning circuit. The device converts a physical pressure into a 10-, 12- or 14-bit digital value and transmits the information via the SPI interface. In addition, a temperature sensor is integrated on chip. Based on the received SPI command, the 10-, 12- or 14-bit temperature information will also be transmitted via the SPI interface. The device has implemented a particular Power-Down Mode which allows the user to even reduce the power consumption of the device. A special reliability feature are the integrated diagnostics, which allows testing the sensor cells as well as the signal path. This diagnosis can be triggered with a SPI command. Product type Package Marking Ordering code KP464 PG-DFN-8-1 KP464 SP005430033 KP464 Datasheet Datasheet Please read the sections "Important notice" and "Warnings" at the end of this document Rev. 1.0.0 www.infineon.com 2022-11-25

Datasheet 2 Rev. 1.0.0 2022-11-25

Datasheet 3 Rev. 1.0.0 2022-11-25

1 Block diagram

P_ADC Tj_ADC Digital Signal Processing SPI Interface NCS CLK SDI SDO V PROG NC GND V DD Pressure Cells EEPROM Figure 1 Functional block diagram KP464 Datasheet Datasheet 4 Rev. 1.0.0 2022-11-25

2 Pin configuration

The figure below defines the pin configuration of the device. GND NC V PROG V DD SDI NCS CLK SDO Figure 2 Pin configuration (top view, figure not to scale) The table below shows the pin description. Table 1 Pin description Pin No. Name Function Comment

1 NCS Not-Chip-Select (active-low) Communication is enabled when NCS is low

2 CLK Serial Clock External clock for serial communication

3 SDI Serial Data In Serial data input (e.g. from a controller)

4 SDO Serial Data Out Tri-state serial data output

5 VDD Supply voltage –

6 VPROG Programming Voltage Only required during EEPROM programming and

7 NC Not connected Pin is not bonded

8 GND Ground –

Datasheet 5 Rev. 1.0.0 2022-11-25

3 General product characteristics

3.1 Absolute maximum ratings

Table 2 Absolute maximum ratings Parameter Symbol Values Unit Note or condition Min. Typ. Max. Maximum supply voltage range VDD_max -0.3 - 5.5 V Maximum voltage range on any pin Vin_max -0.3 – 5.5 V Maximum voltage range on any pin (short term) Vin_max_short -0.3 – 6.0 V Limited time: Max. 300s Maximum voltage range at output pins Vout_max -0.3 – VDD+ 0.3 V Storage temperature TS -40 – 150 °C Maximum operating temperature range Ta_max -40 - 140 °C Limited time: Max. 200h Maximum input pressure range Pamb_max 10 – 300 kPa Maximum input pressure range (short term) Pamb_max_short 10 – 600 kPa Limited time: Max. 300s ESD robustness - HBM VESD_HBM -2000 - 2000 V According to ANSI/ESDA/JEDEC JS-001 ESD robustness pins 1, 4, 5, 8 - CDM VESD_CDMc -750 - 750 V According to ANSI/ESDA/JEDEC JS-002 ESD robustness pins 2, 3 ,6, 7 - CDM VESD_CDMo -500 - 500 V According to ANSI/ESDA/JEDEC JS-002 Attention: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the section "functional range" of this data sheet is not implied. Furthermore, only single error cases are assumed. More than one stress/error case may also damage the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions the voltage on VDD pins with respect to ground (GND) must not exceed the values defined by the absolute maximum ratings. Lifetime statements are an anticipation based on an extrapolation of Infineon’s qualification test results. The actual lifetime of a component depends on its form of application and type of use etc. and may deviate from such statement. Lifetime statements shall in no event extend the agreed warranty period. KP464 Datasheet Datasheet 6 Rev. 1.0.0 2022-11-25

3.2 Functional range

The following functional range must not be exceeded in order to ensure correct operation of the device. All parameter specified in the following sections refer to these operation conditions unless otherwise indicated. Table 3 Functional range Parameter Symbol Values Unit Note or condition Min. Typ. Max. Supply voltage VDD 3.0 – 5.25 V Supply undervoltage VDD_UV VUVR_max – VDD_min V Undervoltage range, reduced performance (see Characteristics in Undervoltage Range) Supply voltage power up/power down gradient Vgrad 1E-5 – 1E4 V/ms Input voltage for high level at pins NCS, CLK & SDI Vhigh_in 1.8 – VDD + 0.3 V Not valid in Power-Down mode Input voltage for high level at pins NCS, CLK & SDI (Power-Down mode) Vhigh_in_pd 2.3 – VDD + 0.3 V Not valid during normal operation Input voltage for low level at pins NCS, CLK & SDI Vlow_in -0.3 – 0.8 V Output voltage for low level at pin SDO Vlow_out – – 0.4 V Test current (sink) at pin SDO is 2.0mA Output voltage for high level at pin SDO Vhigh_out VDD - 0.4 – VDD V Test current (source) at pin SDO is 2.0mA Ambient operating temperature range Ta -40 – 125 °C Thermal resistance (junction-ambient) RthJA 250 – 350 K/W Thermal resistance between die and Tamb (measured acc. JESD51-2) KP464 Datasheet Datasheet 7 Rev. 1.0.0 2022-11-25

4 Product features

4.1 Characteristics

4.1.1 Electrical characteristics

Table 4 Electrical characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Undervoltage reset/ release level VUVR 2.1 – 2.7 V Undervoltage reset hysteresis VUVR_Hyst 100 – 300 mV Supply current into VDD IVDD – – 3.5 mA Without SPI communication Supply current into VDD during power-down mode (quiescent current) IVDD_PD – – 10 µA Pressure signal path settling time tpath_pres – – 5 ms Pressure accuracy within specification Temperature signal path settling time tpath_temp – – 5 ms Temperature accuracy within specification Start-up time (with self diagnosis) tstart-up_wd – – 10 ms No SPI communication possible After tstart-up_wd within full specification Configuration Parameter power_updiag_en = 1 Start-up time (without self diagnosis) tstart-up_wod – – 5 ms No SPI communication possible After tstart-up_wod within full specification Configuration Parameter power_updiag_en = 0 Power down wake- up time (with self diagnosis) tPD_start-up_wd – – 10 ms Configuration Parameter wupdiag_en = Power down wake- up time (without self diagnosis) tPD_start- up_wod – – 5 ms Configuration Parameter wupdiag_en= Capacitive load at pins NCS, CLK & SDI Cload_in – – 14 pF Capacitive load at pin SDO Cload_out – – 19 pF (table continues...) KP464 Datasheet Datasheet 8 Rev. 1.0.0 2022-11-25

Table 4 (continued) Electrical characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Tri-state leakage current ISDO -5 – 5 µA NCS = high VDD = 5V Hysteresis of input voltage at pins NCS, CLK & SDI VSPI_Hys 100 – – mV Current sink for NCS, CLK & SDI (each pin) - Vlow_in ISPI_in -100 – -5 µA Vlow_in = 0V No back biasing Not valid in Power-Down mode Current sink for NCS, CLK & SDI (each pin) - Vhigh_in ISPI_in – – 5 µA Vhigh_in = 5V No back biasing

4.1.2 Transfer function pressure characteristics

Table 5 Transfer function pressure characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Ambient operating pressure range pamb 40 – 115 kPa Accuracy pressure central temperature range accp -1.0 – 1.0 kPa Ta = 0°C to 85°C; additional drift from specifications for 24 hours after reflow soldering. Accuracy pressure low temperature range accp_Tlow -1.5 – 1.5 kPa Ta = -40°C; additional drift from specifications for 24 hours after reflow soldering. Accuracy pressure high temperature range accp_Thigh -1.5 – 1.5 kPa Ta = 125°C; additional drift from specifications for 24 hours after reflow soldering. Note: Drift from specifications after reflow soldering or when device is exposed to extreme temperature conditions for a maximum duration of 24h after reflow soldering in standard conditions (25°C, 100kPa). Attention: The device is sensitive to light incident to the pressure port. All specifications are valid for an illuminance of less than 1 lx. KP464 Datasheet Datasheet 9 Rev. 1.0.0 2022-11-25

4.1.3 Transfer function temperature characteristics

Table 6 Transfer function temperature characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Accuracy temperature low accT_low -5.0 – 5.0 °C Ta = -40°C to 25°C After device self-heating within accT_low Accuracy temperature central accT_cen -3.0 – 3.0 °C Ta = 25°C to 85°C; After device self- heating within accT_cen Accuracy temperature high accT_high -3.5 – 3.5 °C Ta = 85°C to Ta_max; After device self- heating within accT_high

4.1.4 Undervoltage range characteristics

Table 7 Undervoltage range characteristics Parameter Symbol Values Unit Note or condition Min. Typ. Max. Clock frequency of SPI interface fSPI 0.1 – 2.5 MHz Undervoltage range VDD_UV Accuracy pressure central temperature range accp -2.0 – 2.0 kPa Ta = 0°C to 85°C Undervoltage range VDD_UV Accuracy pressure low temperature range accp_Tlow -3.0 – 3.0 kPa Ta = -40°C to 0°C Undervoltage range VDD_UV Accuracy pressure high temperature range accp_Thigh -3.0 – 3.0 kPa Ta = 85°C to 125°C Undervoltage range VDD_UV Output voltage for low level at pin SDO Vlow_out – – 0.4 V Test current (sink) at pin SDO is 1.5mA Undervoltage range VDD_UV Output voltage for high level at pin SDO Vhigh_out VDD - 0.4 – VDD V Test current (source) at pin SDO is 1.5mA Undervoltage range VDD_UV

4.1.5 SPI timing

Parameter Symbol Values Unit Note or condition Min. Typ. Max. Clock frequency of SPI interface fSPI 0.1 – 5 MHz (table continues...) KP464 Datasheet Datasheet 10 Rev. 1.0.0 2022-11-25

Table 8 (continued) SPI timing Parameter Symbol Values Unit Note or condition Min. Typ. Max. Transition speed at SDO (low capacitive load) tSDO_trans_l 5 – 30 ns VDD = 5V Cload = 50pF Rising edge = 20% - 80% Falling edge = 80% - 20% Transition speed at SDO (high capacitive load) tSDO_trans_h 5 – 50 ns VDD = 5V Cload = 150pF Rising edge = 20% - 80% Falling edge = 80% - 20% Clock high time tclh 75 – – ns Clock low time tcll 75 – – ns NCS filter time tfNCS 10 – 60 ns Pulses below the NCS filter time will be ignored Delay between NCS falling edge and SDO active tcsdv – – 75 ns Delay between CLK rising edge and start SDO data tpcld – – 50 ns CLK to data at 10% of SDO rising edge Cload = 120pF Delay between CLK low and start NCS low tsclch 75 – – ns Delay between NCS low and rising edge 1st CLK pulse thclcl 75 – – ns Time between start SDI data and falling edge CLK tscld 15 – – ns Time between falling edge CLK and end SDI data thcld 15 – – ns Delay between falling edge last CLK pulse and rising edge NCS tsclcl 100 – – ns Delay between rising edge NCS and rising edge CLK pulse thclch 100 – – ns (table continues...) KP464 Datasheet Datasheet 11 Rev. 1.0.0 2022-11-25

Table 8 (continued) SPI timing Parameter Symbol Values Unit Note or condition Min. Typ. Max. Delay between rising edge NCS and end SDO data tpchdz – – 75 ns Time between rising edge NCS and falling edge next NCS tonncs 300 – – ns Minimum input rise/ fall time tSPI_switch – – 2 ns 20% - 80% at SDI, CLK, NCS Maximum output over-/undershoot VSDO_ovun -200 – 200 mV VDD = 5V Cload = 150pF Trace inductance < 400nH Valid pressure/ temperature value after trigger diagnostic command tdiag_wait – – 10 ms

4.2 Functional description

4.2.1 Transfer function pressure

The KP46x pressure calibration is adjusted with the parameters Sp and offsp. The formula in order to calculate the ambient pressure based on these paramters and the sensor output is shown below: pamb = outp − offsp Sp (1) The KP46x device is fully calibrated on delivery. The sensor has a linear transfer function between the applied pressure and the digital output signal. The device provides an absolute pressure value by triggering the Acquire Pressure Command. KP464 Datasheet Datasheet 12 Rev. 1.0.0 2022-11-25

Pressure [kPa] LSB OUT,1 LSB OUT,2 p IN,1 Operating Pressure Range Maximum Input Pressure Range Output Signal [LSB] Zoom p IN,2 p amb_max (max) p amb_max (min) Figure 3 Pressure transfer function Table 9 Pressure transfer function characteristics (10-bit) Pressure Output Code Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit pIN,1 40 kPa LSBOUT ,1 0 LSB pIN,2 115 kPa LSBOUT ,2 1023 LSB Table 10 Gain and offset pressure transfer function (10-bit) Gain and Offset Symbol Values (Typ.) Unit Sp 13.64 LSB/kPa offsp -545.6 LSB Table 11 Pressure transfer function characteristics (12-bit) Pressure Output Code Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit pIN,1 40 kPa LSBOUT ,1 0 LSB pIN,2 115 kPa LSBOUT ,2 4095 LSB Table 12 Gain and offset pressure transfer function (12-bit) Gain and Offset Symbol Values (Typ.) Unit Sp 54.6 LSB/kPa (table continues...) KP464 Datasheet Datasheet 13 Rev. 1.0.0 2022-11-25

Table 12 (continued) Gain and offset pressure transfer function (12-bit) Gain and Offset offsp -2184 LSB Table 13 Pressure transfer function characteristics (14-bit) Pressure Output Code Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit pIN,1 40 kPa LSBOUT ,1 0 LSB pIN,2 115 kPa LSBOUT ,2 16383 LSB Table 14 Gain and offset pressure transfer function (14-bit) Gain and Offset Symbol Values (Typ.) Unit Sp 218.44 LSB/kPa offsp -8737.6 LSB -40 0 85 125 Error Multiplier Temperature [°C] Absolute Error [kPa] 0.0 0.5 1.5 1.0 2.0 2.5 1.0 1.5 2.5 Figure 4 Accuracy for pressure acquisition

4.2.2 Transfer function temperature

The KP46x temperature calibration is adjusted with the parameters ST and offsT. The formula in order to calculate the ambient temperature based on these paramters and the sensor output is shown below: Tamb = outT − offsT ST (2) The KP46x device is fully calibrated on delivery. The sensor has a linear transfer function between the applied temperature and the digital output signal. The device provides an ambient temperature value by triggering the Acquire Temperature Command. KP464 Datasheet Datasheet 14 Rev. 1.0.0 2022-11-25

T IN,1 LSB OUT,1 LSB OUT,2 T IN,2 Output Signal [LSB] Temperature [°C] Zoom T a (min) T a (max) Ambient Operating Temperature Range Temperature Transfer Function Figure 5 Temperature transfer function Table 15 Temperature transfer function characteristics (10-bit) kp25xt_compat vddrange VDD Temperature Output Code Bit Bit Values (Typ.) Unit Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit 0 0 3.3 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 1023 LSB 1 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 1023 LSB 1 - 3.3 V TIN,1 -38.5 °C LSBOUT ,1 0 LSB TIN,2 126.5 °C LSBOUT ,2 1023 LSB - 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 1023 LSB Table 16 Gain and offset of temperature transfer function (10bit) kp25xt_compat VDD Gain and offset Bit Values (Typ.) Unit Symbol Values (Typ.) Unit 1 3.3 / 5.0 V ST 6.2 LSB/°C 5.0 offsT_5.0 248 LSB 3.3 offsT_3.3 238.7 LSB 0 3.3 / 5.0 V ST 6.2 LSB/°C offsT 248 LSB KP464 Datasheet Datasheet 15 Rev. 1.0.0 2022-11-25

Table 17 Temperature transfer function characteristics (12-bit) kp25xt_compat vddrange VDD Temperature Output Code Bit Bit Values (Typ.) Unit Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit 0 0 3.3 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 4095 LSB 1 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 4095 LSB 1 - 3.3 V TIN,1 -38.5 °C LSBOUT ,1 0 LSB TIN,2 126.5 °C LSBOUT ,2 4095 LSB - 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 4095 LSB Table 18 Gain and offset of temperature transfer function (12bit) kp25xt_compat VDD Gain and offset Bit Values (Typ.) Unit Symbol Values (Typ.) Unit 1 3.3 / 5.0 V ST 24.82 LSB/°C 5.0 offsT_5.0 992.73 LSB 3.3 offsT_3.3 955.5 LSB 0 3.3 / 5.0 V ST 24.82 LSB/°C offsT 992.73 LSB Table 19 Temperature transfer function characteristics (14-bit) kp25xt_compat vddrange VDD Temperature Output Code Bit Bit Values (Typ.) Unit Symbol Values (Typ.) Unit Symbol Values (Typ.) Unit 0 0 3.3 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 16383 LSB 1 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 16383 LSB 1 - 3.3 V TIN,1 -38.5 °C LSBOUT ,1 0 LSB TIN,2 126.5 °C LSBOUT ,2 16383 LSB - 5.0 V TIN,1 -40 °C LSBOUT ,1 0 LSB TIN,2 125 °C LSBOUT ,2 16383 LSB Table 20 Gain and offset of temperature transfer function (14bit) kp25xt_compat VDD Gain and offset Bit Values (Typ.) Unit Symbol Values (Typ.) Unit (table continues...) KP464 Datasheet Datasheet 16 Rev. 1.0.0 2022-11-25

Table 20 (continued) Gain and offset of temperature transfer function (14bit) kp25xt_compat VDD Gain and offset 1 3.3 / 5.0 V ST 99.29 LSB/°C 5.0 offsT_5.0 3971.64 LSB 3.3 offsT_3.3 3822.7 LSB 0 3.3 / 5.0 V ST 99.29 LSB/°C offsT 3971.64 LSB

4.2.3 Power-down mode

The KP46x has implemented a special power saving feature called the power-down mode. The sensor will enter a power-down state where the power consumption is drastically reduced. For current consumption during power-down mode, see parameter IVDD_PD (see in table Electrical characteristics).

4.2.3.1 Entering power-down mode

The device enters the power-down mode when the Trigger Power-Down Mode Command command is received via the SPI inteface.

4.2.3.2 Exiting power-down mode

To wake-up the sensor from the power-down mode the NCS pin needs to be low during the rising edge of the CLK pin. Note: If the sensor is in the power-down state then the next command triggers the wake-up process (NCS must be low in combination with a rising CLK edge). To allow repowering of the sensor after the wake-up from power-down mode, the user needs to wait the time tstart- up (see in table Electrical characteristics) before sending the first SPI command (e.g. Acquire Pressure Command). Note: The response of the sensor during this first command must be ignored in case a command was part of the NCS and CLK wake-up sequence. With the next SPI command the response from the first command will be returned.

4.2.4 Serial interface

The communication and data transmission is based on a standard 16 bit serial peripheral interface (SPI). The SPI timing and the associated timing parameters are shown below: NCS CLK SDO SDI t sclch t hclcl t clh t cll MSB t pcld MSB t scld t hcld LSB LSB t onncs t sclcl t hclch t pchdz t csdv Figure 6 SPI timing KP464 Datasheet Datasheet 17 Rev. 1.0.0 2022-11-25

When NCS is high, SDO is let in a high impedance state (no SPI communication is possible). When the number of CLK period is different from 0 or multiple of 16, next SPI answer signalizes a communication error. In case of no CLK edge when NCS is low, the transfer is considered as valid. The answer of last command is sent during next transfer. The device is able to send a unique ID number, upon request. This Traceability-ID makes sure that all numbers for KP46x family are unique.

4.2.4.1 EEPROM programmability

The following parts of the EEPROM are user programmable via the SPI interface:

• Identifier response (spi_id: bit 0-7)
• SPI interface configuration: - kp25xres_compat - vddrange - kp25xt_compat
• Start-up self diagnostics: - wupdiag_en - power_updiag_en

4.2.4.2 Commands

The following commands are defined:

• Acquire identifier
• Acquire pressure (incl. the diagnosis pressure out of range, EEPROM check and last updated Diag1 & Diag2) 1)
• Acquire temperature (incl. the diagnosis pressure out of range, EEPROM check and last updated Diag1 & Diag2) 1)
• Trigger Power-Down mode (activates the power-down state)
• Trigger diagnosis (triggers Diag1, Diag2)
• Trigger programming mode (entry into programming mode only occurs with a high voltage level (>10V) on pin VPROG) 1) Last updated diagnosis information is only available if the Trigger Diagnosis Command (see Chapter 4.2.4.6) was sent at any time before and the diagnostic reset is not active (Reset-bit C12 = '1').

4.2.4.3 Command behaviour

The answer of the command sent in SPI frame N will be send in next SPI frame (N+1). When a command (N) is sent and the processing of the previous command (N-1) has not finalized, the last command (N) will not interrupt the processing. The diagnosis command triggers the Diag1 and Diag2 measurement; during the execution of the self diagnosis the pressure values (including out of range information) will not be updated. The first answer of the sensor after power-on or reset is the identifier response (see Chapter 4.2.4.8) independent from the command.

4.2.4.4 Structure

The following structure is defined for an SPI command: KP464 Datasheet Datasheet 18 Rev. 1.0.0 2022-11-25

\0\REQUEST RESET BIT ADDITIONAL REQUEST MSB LSB Figure 7 SPI command structure The following structure is defined for a 10-bit SPI response: 0123456789101112131415 DATADIAGNOSIS PARIT Y MSB LSB Figure 8 SPI response structure (10-bit) This response structure is valid for the Acquire Pressure Command (10-bit), Acquire Temperature Command (10- bit) and Trigger Diagnosis Command (10-bit). The following structure is defined for a 12-bit SPI response: 0123456789101112131415 DATADIAGNOSIS PARIT Y MSB LSB Figure 9 SPI response structure (12-bit) This response structure is valid for the Acquire Pressure Command (12-bit), Acquire Temperature Command (12- bit) and Trigger Diagnosis Command (12-bit). The following structure is defined for a 14-bit SPI response: 0123456789101112131415 DATA DIAGNOSIS PARIT Y MSB LSB Figure 10 SPI response structure (14-bit) This response structure is valid for the Acquire Pressure Command (14-bit), Acquire Temperature Command (14- bit) and Trigger Diagnosis Command (14-bit). The following structure is defined for a SPI response for identifier: KP464 Datasheet Datasheet 19 Rev. 1.0.0 2022-11-25

spi_idSUPPLIER MSB LSB SILICON VERSION METAL VERSION Figure 11 SPI response structure for identifier

4.2.4.5 Parity

The following SPI responses include an odd parity (LSB, [0]):

• Acquire Pressure
• Acquire Temperature
• Trigger Diagnosis
• Communication Error The number of bits with the value one in the 16 bit response is odd (including the parity bit).

4.2.4.6 Command definition

0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 12 Acquire pressure command (10-bit) for kp25xres_compat = 0 10 1 0123456789101112131415

0 X 0 0 0 0 0 0 0 0 0 0 0

Figure 13 Acquire pressure command (10-bit) for kp25xres_compat = 1 10 1 0123456789101112131415 Figure 14 Acquire pressure command (12-bit) for kp25xres_compat = 0 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 15 Acquire pressure command (12-bit) for kp25xres_compat = 1 KP464 Datasheet Datasheet 20 Rev. 1.0.0 2022-11-25

Figure 16 Acquire pressure command (14-bit) 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 17 Acquire temperature command (10-bit) for kp25xres_compat = 0 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 Figure 18 Acquire temperature command (10-bit) for kp25xres_compat = 1 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 Figure 19 Acquire temperature command (12-bit) for kp25xres_compat = 0 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 20 Acquire temperature command (12-bit) for kp25xres_compat = 1 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 Figure 21 Acquire temperature command (14-bit) 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 22 Trigger diagnosis command (10-bit) for kp25xres_compat = 0 KP464 Datasheet Datasheet 21 Rev. 1.0.0 2022-11-25

Figure 23 Trigger diagnosis command (10-bit) for kp25xres_compat = 1 101 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 Figure 24 Trigger diagnosis command (12-bit) for kp25xres_compat = 0 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 25 Trigger diagnosis command (12-bit) for kp25xres_compat = 1 1 01 0123456789101112131415 0 0 X 0 0 0 0 0 0 0 0 0 0 Figure 26 Trigger diagnosis command 14-bit Note: After a Trigger Diagnostic Command the user has to wait the time tdiag_wait (see in table SPI timing) to acquire a valid pressure or temperature value. 1 1 0123456789101112131415 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 27 Trigger Power-Down Mode Command 1 1 1 0123456789101112131415 X 0 0 0 0 0 0 0 0 0 0 0 0 Figure 28 Acquire identifier command Note: The Reset-bit (C12) determines how the diagnostic reset is handled. KP464 Datasheet Datasheet 22 Rev. 1.0.0 2022-11-25

0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 29 Trigger programming mode command

4.2.4.7 Communication error

In normal operation only the specified commands are valid. Every abnormality of these commands (e.g. unused command, other value of unused bits, number of clocks not equal to 16n with n = 1, 2, 3...) will result in a communication error. The response to a detected communication error is given below. 0123456789101112131415 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Figure 30 Response after a communication error

4.2.4.8 Identifier response definition

The response to an "Acquire Identifier Command" is a defined value for each derivate as stated below. With this response, the KP46x sensor can be identified when operated in a bus system with several different parts. 1 1 1 1 1 1 0123456789101112131415 0 0 0 0 0 0 0 1 1 0 Figure 31 Identifier response definition

4.2.4.9 Single device operation

The figure below shows an example on how to connect a singe device to a microcontroller. After NCS is pulled to low, the request command is sent to the sensor with the next 16 cycles of the CLK. The response of the sensor for the previous request command is returned at the same time. CLK NCS MDO MDI CLK NCS SDI SDO Microcontroller KP46x NCS low for 16 CLK pulses Figure 32 Example for single device operation KP464 Datasheet Datasheet 23 Rev. 1.0.0 2022-11-25

The SPI signal timing for single device operation is shown in the figure below. NCS CLK MDI MDO COMMAND_n ANSWER_n-1 Time

16 CLK cycles

... COMMAND_n+1 ANSWER_n ... Figure 33 Example for single device signal diagram

4.2.4.10 Daisy chain operation

The daisy chain operation can be used to connect several devices to one SPI connection in order to save microcontroller pins. Please see Daisy Chain Operation Example for an example how to connect several devices to one microcontroller. The number of devices connected in daisy chain operation is unlimited. The figure below shows an example of a combination of daisy chain mode and parallel operation. SDI CLK NCS_S1 KP46x_1.1 MDO CLK NCS_S1 NCS_S2 NCS_S3 MDI Microcontroller SDO SDI CLK NCS_S2 KP46x_2.1 SDO SDI CLK NCS_S2 KP46x_2.2 SDO SDI CLK NCS_S3 KP46x_3.1 SDO SDI CLK NCS_S3 KP46x_3.2 SDO SDI CLK NCS_S3 KP46x_3.3 SDO NCS_S1 low for 16 CLK pulses NCS_S3 low for 48 CLK pulses NCS_S2 low for 32 CLK pulses Figure 34 Example for daisy chain operation KP464 Datasheet Datasheet 24 Rev. 1.0.0 2022-11-25

Note: Not all five sensors in this example could be addressed at once. Only one branch can be addressed at once (e.g. the KP46x_2.x branch). Finally only one NCS line can be low at the same time (NCS_S1, NCS_S2 or NCS_S3). The Example for daisy chain operation figure shows an example of a combination of daisy chain mode and parallel operation. The responding NCS line for the addressed sensor group must be low during the complete communication. During this time the provided number of clock pulses must be the multiplication result of 16 times the number of sensors in a daisy chain (e.g. 32 clock pulses for the KP46x_2.x branch in figure "Daisy Chain Operation Example"). It is important that NCS_S2.1 and NCS_S2.2 stay at the low level during the complete transmission. Therewith the sensor is able after receiving more than 16 clock pulses without a change in the NCS signal to switch automatically in daisy chain mode (in this example the first received 16 bit input data by the sensor S2.1 will be clocked to the output of sensor S2.1 with the last 16 clock pulses). The figure "Daisy Chain Operation Signal Diagram" shows the whole signal diagram. NCS_S2.1 CLK_S2.1 SDO_S2.1 SDI_S2.1 COMMAND_S2.2_n ANSWER_S2.1_n-1 ANSWER_S2.1_n-1 ANSWER_S2.2_n-1 NCS_S2.2 CLK_S2.2 SDO_S2.2 SDI_S2.2 COMMAND_S2.1_n COMMAND_S2.2_n COMMAND_S2.2_n ANSWER_S2.1_n-1 Time Figure 35 Example for daisy chain signal diagram It is important that the number of clock pulses is a multiple of 16. Otherwise all commands for a daisy chain branch will be identified as invalid commands and the response of all sensors on this branch will be the Communication Error Response.

4.2.4.11 SPI configuration parameters

The following parameters of the digital interface are user-configurable: KP464 Datasheet Datasheet 25 Rev. 1.0.0 2022-11-25

Table 21 Interface configuration parameters Configuration parameter Symbol Nominal range Unit Step width Default Note Start-up diagnostics - VDD Power-On power_updiag_en 0 of 1 bit - 1 Can be adjusted by changing the corresponding EEPROM bit:

• 0: Deactivated self diagnostics during VDD start-up
• 1: Activated self diagnostics during VDD start-up This influences the average power consumption of the device. Start-up diagnostic - PD Power- Up wupdiag_en 0 or 1 bit - 1 Can be adjusted by changing the corresponding EEPROM bit:
• 0: Deactivated self diagnostics during PD start-up
• 1: Activated self diagnostics during PD start-up This influences the average power consumption of the device. VDD range vddrange 0 or 1 bit - 1 Can be adjusted by changing the corresponding EEPROM bit:
• 0: 3.3 V supply voltage for the device
• 1: 5.0 V supply voltage for the device Temperature compatibility kp25xt_compat 0 or 1 bit - 1 Can be adjusted by changing the corresponding EEPROM bit:
• 0: vddrange bit is active. Same temperature offset parameter and transfer function for 3.3 V and 5.0 V supply voltage (please see Transfer Function Temperature)
• 1: vddrange bit is inactive. Different temperature offset paramter and transfer function for 3.3 V and 5.0 V supply voltage (please see Transfer Function Temperature) (table continues...) KP464 Datasheet

Datasheet 26 Rev. 1.0.0 2022-11-25

Table 21 (continued) Interface configuration parameters Configuration parameter Symbol Nominal range Unit Step width Default Note Acquire pressure and temperature command kp25xres_compat 0 or 1 bit - 0 Can be adjusted by changing the corresponding EEPROM bit:

• 0: 10-bit acquire pressure/ temperature command like e.g. KP254
• 1: 12-bit acquire pressure/ temperature command like e.g. KP253

4.2.5 Diagnosis

The sensor is able to detect automatically the following malfunctions:

• Pressure out of range (low and high)
• Signal path check (Diag1)
• Sensor cell check (Diag2)
• EEPROM check (ECC error) If a malfunction is detected, the responding diagnosis code is sent with the next response. Note: The Diag1 and Diag2 test can only be triggered by the separate Trigger Diagnosis Command. After this command the user has to wait the time tdiag_wait (see in table SPI timing) to get a valid pressure or temperature value after a new request. In case a 10-bit Acquire Temperature or Pressure Command is received by the device a 5-bit diagnosis will be transmitted during the next received command as part of the 10-bit Response Structure (see Chapter 4.2.4.4). If more than one test fails, only that diagnosis code with the highest priority will be sent. Table 22 5-bit diagnosis codes Failure Priority Diagnosis Code Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 EEPROM: ECC error 1 1 0 0 0 0 Acquisition chain failure: Diag1 2 0 1 0 0 0 Sensor cell failure: Diag2 3 0 0 1 0 0 Pressure out of range: High 4 0 0 0 1 0 Pressure out of range: Low 5 0 0 0 0 1 No error - 0 1 0 1 0 In case a 12-bit Acquire Temperature or Pressure Command is received by the device a 3-bit diagnosis will be transmitted during the next received command as part of the 12-bit Response Structure (see Chapter 4.2.4.4). If more than one test fails, only that diagnosis code with the highest priority will be sent. KP464 Datasheet

Datasheet 27 Rev. 1.0.0 2022-11-25

Table 23 3-bit diagnosis codes Failure Priority Diagnosis Code Bit 15 Bit 14 Bit 13 EEPROM: ECC error 1 1 0 0 Acquisition chain failure: Diag1 2 0 1 0 Sensor cell failure: Diag2 3 0 0 1 No error - 0 1 1 In case a 14-bit Acquire Temperature or Pressure Command is received by the device a 1-bit diagnosis will be transmitted during the next received command as part of the 14-bit Response Structure (see Chapter 4.2.4.4). Table 24 1-bit diagnosis codes Failure Diagnosis Code Bit 15 EEPROM: ECC error 1 No error 0 Note: The diagnosis codes Diag1 and Diag2 are not updated until a self diagnosis is triggered by sending the Trigger Diagnosis Command.

4.2.5.1 Diagnosis reset

The Reset-bit C12 of a SPI command allows using different reset strategies:

• Reset-bit = '0': All transmitted failures will be reset (with the exception of ECC error)
• Reset-bit': A transmitted failure will not be reset Attention: Reset of the ECC error is not possible. Once they are detected and transmitted it remains until supply reset or power-down mode is entered.

4.2.5.1.1 Reset-bit = '1'

Once a failure is detected, the corresponding diagnosis code is still transmitted continuously, even if the failure disappears/is no longer present, as long as:

• A failure with a higher priority is not detected
• The sensor is not reset (power-down) Time Failure presence Command Diagnosis code response 01010 00001 00001 00001 e.g. Pressure out of range: low Pressure sampling Figure 36 Example for reset strategy Reset-bit C12 = '1' KP464 Datasheet

Datasheet 28 Rev. 1.0.0 2022-11-25

4.2.5.1.2 Reset-bit = '0'

A detected failure is only transmitted by the responding diagnosis code as long as the failure is present with the exception of ECC error. The diagnosis code will be reset after once transmitted. Only if the failure is detected again, the diagnosis code will be transmitted again with the next response. Time Failure presence Command Diagnosis code response 01010 00001 00001 01010 e.g. Pressure out of range: low Pressure sampling Figure 37 Example for reset strategy Reset-bit C12 = '0'

4.2.5.2 Pressure out of range

The measured pressure is internally checked. If the pressure value falls below the lower limit pIN,1 or exceeds the higher limit pIN,2 the corresponding diagnosis code will be set. The lower and higher limits are defined in the Transfer Function Pressure chapter.

4.2.5.3 Diag1

The Diag1 test checks the functionality of the signal path. Therefore the inputs of the sigma delta ADC are shorted. Afterwards, the system response is compared with the expected range (~ 50% of full scale range). If the system response is out of range, the diagnosis code is set. SD A/D Digital Filter Figure 38 Diag1 functionality

4.2.5.4 Diag2

The Diag2 test checks the functionality of the pressure sensor cells. Therefore a malfunction (e.g. broken membrane) can be detected. The KP46x pressure sensing element is made of 2 measuring cells and 2 reference cells. In the normal mode these four cells are connected in a Wheatstone bridge configuration. In the Diag2 mode, the connection of the cells is modified as shown in the figure below: KP464 Datasheet Datasheet 29 Rev. 1.0.0 2022-11-25

p p U = f (p) Normal Operation p U f (p) Diag2 Mode Figure 39 Diag2 functionality

4.2.5.5 EEPROM check

Every start-up and wake-up a full EEPROM ECC test will be executed. Each EEPROM word consist of 16 data bits and 6 ECC bits. The 6 ECC bits allow the detection and correction of one flipped data bit and the detection of two flipped data bits within one EEPROM word (16 data bits). A one bit error per EEPROM word will be corrected. The sensor will continue with normal operation. Any additional bit error in this EEPROM word results in an ECC error. In case of an ECC error the corresponding diagnosis code will be transmitted with the next response.

4.2.6 Calculation of overall power consumption

The formulas below can be used in order to calculate the overall average power consumption of the device in normal operation mode based on the system and SPI configuration (e.g. Cload on SDO): IVDDaverage µ A = IVDD + ISPIaverage (3) IVDDaverage µ A = IVDD + 16 × fNCS fSPI × 250 µ A+ fSPI × Cload × VDD 2 (4) Table 25 Variables of overall average power consumption formula Variable Description Unit IVDD Supply current into VDD µA fNCS Sampling rate (e.g. pressure requests) MHz fSPI Clock frequency of SPI interface MHz Cload Load capacitance on SDO pF VDD Supply Voltage V

4.2.7 Start-up behavior

There is no SPI response of the device on any SPI command during the start-up phase (tstart-up - see in table Electrical characteristics). KP464 Datasheet Datasheet 30 Rev. 1.0.0 2022-11-25

5 Application information

Figure 40 Example application diagram Table 26 Component Values Parameter Symbol Values Unit Note or condition Min. Typ. Max. Supply Decoupling Capacitor C1 30 100 – nF Typ: The use of a blocking capacitor with at least a nominal value of 100nF is mandatory; any drift or tolerances in capacity of standard capacitors are already considered. To avoid any measurement inaccuracy the supply blocking capacitor has to be placed as close as possible to the VDD pin, at least the distance must be less than 10mm. Min: The minimum capacity C1 including any variations or drift over lifetime must not undershoot the minimum C1 value. KP464 Datasheet Datasheet 31 Rev. 1.0.0 2022-11-25

6 Package

The package is a PG-DFN-8-1 as shown below: Figure 41 PG-DFN-8-1 outlines Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). KP464 Datasheet Datasheet 32 Rev. 1.0.0 2022-11-25

Figure 42 Package footprint drawing Although the self-alignment effect due to the surface tension of the liquid solder will support the formation of reliable solder joints, the components have to be placed accurately according to their geometry. Manual positioning of the package is not recommended, but it is possible. For the PG-DFN package with a pad width of 0.3 mm and a pitch of 0.8 mm, an automatic pick-and-place machine is recommended to achieve reliable solder joints. The device is delivered in tape and reel packing which is suitable for being used in pick-and-place equipment.

6.1 Identification code

The identification code for the device is on the same side of the package as pin 1. KP464 Datasheet Datasheet 33 Rev. 1.0.0 2022-11-25

W B: BE Location YY: Year WW: Week Figure 43 Identification code KP464 Datasheet Datasheet 34 Rev. 1.0.0 2022-11-25

7 Revision history

1.0 2022-11-25 Initial release KP464 Datasheet Datasheet 35 Rev. 1.0.0 2022-11-25

All referenced product or service names and trademarks are the property of their respective owners. Edition 2022-11-25 Published by Infineon Technologies AG

81726 Munich, Germany

© 2022 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-gel1669120542280 Important notice The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. Warnings Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.