EHP-B05_12 EVERLIGHT | Alldatasheet

Document overview

  • Manufacturer or author: pROVIDED bY alldatasheet.com(free datasheet download site)
  • PDF pages: 27

Technical content

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Introduction B05 series is a high power, multi-chip device with very low thermal resistance as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signal, industrial and commercial lighting. Features Applications  Robust package with high lumens  ESD protection up to 8KV  Soldering method: SMT  Moisture Sensitivity Level: 3  RoHS compliant  ANSI binning  Reliability testing conforms to IESNA LM80 Lumen maintenance test method  General Lighting  Spot Lighting  Signal and Symbol Luminaries for orientation marker lights (e.g. steps, exit ways, etc.)  Industrial Lighting  Commercial Lighting EHP-B05 series

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Table of Contents Warm-White Bin Structure & Warm-White Bin Coordinates… … … … … … … … … ...… … … … … 12 Typical Relative Luminous Flux vs Forward Current… … … … … … … … … … … … … … … … … ...… 18 Typical CCT Shift Characteristics vs Forward Current… … … … … … … … … … … … … … … … … … 18 Carrier Tape Dimensions: Loaded quantity & Moisture Resistant Packaging… … … … … … … … . 22

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Product Nomenclature The product name is designated as below: EHP-B05MLG/GT04H-P05/50K/R11/TR Designation: EHP-B05=Family name MLG = Lambertian GT =Color Code [1] 0 _ H = Quantity of the chip [2] P05 =Power Consumption[3] 50K = Color bin or CCT bin R11 = min. luminous flux (lm) or radiation power (mW) performance TR = Tape and Reel Notes 1. Code of wavelength of the chip: Symbol Color Dominant wavelength range/Peak wavelength/CCT RB Royal Blue 445~460nm UB Ultra Blue 460~470nm SUG Green 520~540nm UY Amber 580~595nm USO Ultra Red-Orange 610~620nm SUR Super ultra-Red 620~635nm GRB RGB full color SUR+SUG+UB GT White, CRI Min 70 4745-7050K LM Warm White, CRI Min 70 2580-4745K KT White, CRI Min 80 4745-7050K KM Warm White, CRI Min 80 2580-4745K 2. Quantity of the chip: Symbol Description 2 2 chips 4 4 chips 6 6 chips 8 8 chips 3. Consume the power: Symbol Description P05 5W P07 7W P10 10W Materials Items Description Substrate PCB with Metal Heat Sink Housing Heat resistant polymer Encapsulating Resin Silicone resin

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Maximum Ratings Parameter Symbol Ratings Unit DC Forward Current(1) IF 800 mA DC Pulse Current(2) IPF 1000 mA ESD Sensitivity ESD 8000 V Junction Temperature(3) Tj 125 °C Operating Temperature(4)(5) Top. -40 ~ +85 °C Storage Temperature Tstge. -40 ~ +100 °C Junction To Heat-Sink Thermal Resistance Rth 7 °C /W Max. Solder Pad Temperature TSol 260 °C Max. Allowable Reflow Cycles n/a 2 cycles Notes: 1. Maximum forward current is 1000mA (Thermal Pad = 25°C). 2. Duty cycle = 1/10@1KHz (Thermal Pad = 25°C) 3. Maximum junction temperature is 125°C for White LEDs. 4. Maximum Operating Temperature (Thermal Pad) is 85°C for White LEDs. 5.Avoid operating LEDs at maximum operating temperature exceeding 1 hour. JEDEC Moisture Sensitivity Floor Life Soak Requirements Standard Level Time (hours) Conditions Time (hours) Conditions 3 168H Ù30°C / 60% RH 192 (+5/-0) 30°C / 60% RH

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series PN of the B05 series: Typ. CRI 75 White LEDs The table below is a list of part numbers for the EHP-B05 5W series White LED. All parts listed match ANSI binning standards. Bin offerings of 2700K to 6500K are listed and currently available. CRI is also listed with min 70 to 80. Typical view angle is 140°. These clearly listed binning options allow for proper design and implementation into lighting applications. For Example: If you order product using EHP-B05MLG/GT04H-P05/57K/R11/TR, you will get White, EHP-B05 series LEDs at 700mA are listed below. EHP-B05MLG represents by Color Order Code of EHP-B05 Luminous Flux (lm) [1] CCT(K) Forward Voltage (V) [2] CRI Typ CRI Min [3] /GT04H-P05/65K/R11/TR 400-450 450-500 /GT14H-P05/65K/R12/TR 450-500 500-550 65K-1~65K-4 6.0 - 7.0 75 70 /GT04H-P05/57K/R11/TR 400-450 450-500 /GT14H-P05/57K/R12/TR 450-500 500-550 57K-1~57K-4 6.0 - 7.0 75 70 /GT04H-P05/50K/R11/TR 400-450 450-500 /GT14H-P05/50K/R12/TR 450-500 500-550 50K-1~50K-4 6.0 - 7.0 75 70 /LM04H-P05/45K/N52/TR 375-400 400-450 45K-1~45K-4 6.0 - 7.0 75 70 **/LM04H-P05/40K/N52/TR 350-400 400-450 40K-1~40K-4 6.0 - 7.0 75 70 Color Variant Radiation Pattern CRI Typ CCT Forward Voltage (V) Minimum Luminous Flux (lm) Cool White Lambertian 75 57K-1 ~ 57K-2 57K-3 ~ 57K-4 6.0~6.5(O4) 6.5~7.0(O5) 400 Cool White 6500 Cool White 5700 Neutral White 4500 Cool White 5000 Neutral White 4000

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Color Order Code of EHP-B05 Luminous Flux (lm) [1] CCT(K) Forward Voltage (V) [2] CRI Typ CRI Min [3] /LM04H-P05/35K/N51/TR 350-400 400-450 35K-1~35K-4 6.0 - 7.0 75 70 /LM04H-P05/30K/N51/TR 300-350 350-400 30K-1~30K-4 6.0 - 7.0 75 70 /LM04H-P05/27K/N51/TR 300-350 350-400 27K-1~27K-4 6.0 - 7.0 75 70 PN of the B05 series: Typ. CRI 85 White LEDs EHP-B05MLG represents by Color Order Code of EHP-B05 Luminous Flux (lm) [1] CCT(K) Forward Voltage (V) [2] CRI Typ CRI Min [3] /KT04H-P05/65K/N52/TR 375-400 400-450 65K-1~65K-4 6.0 - 7.0 85 80 /KT04H-P05/57K/N52/TR 375-400 400-450 57K-1~57K-4 6.0 - 7.0 85 80 /KT04H-P05/50K/N52/TR 350-400 400-450 50K-1~50K-4 6.0 - 7.0 85 80 /KM04H-P05/45K/N52/TR 350-400 400-450 /KM14H-P05/45K/R11/TR 400-450 450-500 45K-1~45K-4 6.0 - 7.0 85 80 /KM04H-P05/40K/N51/TR 325-350 350-400 **/KM14H-P05/40K/N52/TR 375-400 400-450 40K-1~40K-4 6.0 - 7.0 85 80 Cool White 6500 Cool White 5700 Cool White 5000 Neutral White 4000 Neutral White 4500 Warm White 2700 Warm White 3000 Warm White 3500

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Color Order Code of EHP-B05 Luminous Flux (lm) [1] CCT(K) Forward Voltage (V) [2] CRI Typ CRI Min [3] /KM04H-P05/35K/N51/TR 300-350 350-400 /KM14H-P05/35K/N52/TR 350-400 400-450 35K-1~35K-4 6.0 - 7.0 85 80 /KM04H-P05/30K/N42/TR 275-300 300-350 /KM14H-P05/30K/N51/TR 325-350 350-400 30K-1~30K-4 6.0 - 7.0 85 80 /KM04H-P05/27K/N42/TR 275-300 300-350 /KM14H-P05/27K/N51/TR 325-350 350-400 27K-1~27K-4 6.0 – 7.0 85 80 Note: 1. Luminous Flux measurement tolerance: ±10%. 2. Forward Voltage measurement tolerance: ±0.1V. 3. Color Rendering Index measurement tolerance: ±2. Warm White 2700 Warm White 3000 Warm White 3500

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Product Binning Luminous Intensity spec Group Bin Minimum Photometric Flux (lm) Maximum Photometric Flux (lm) 31 200 225 32 225 250 41 250 275 42 275 300 51 300 350 N 52 350 400 11 400 450 12 450 500 21 500 550 22 550 600 31 600 650 32 650 700 33 700 750 41 750 800 42 800 850 43 850 925 44 925 1000 51 1000 1075 R 52 1075 1150 53 1150 1225 54 1225 1300 Note: Currently available brightness bins for White LEDs are highlighted and bolded. Forward Voltage Bins Bin Minimum Forward Voltage (V) Maximum Forward Voltage (V) O1 4.5 5.0 O2 5.0 5.5 O3 5.5 6.0 O4 6.0 6.5 O5 6.5 7.0 O6 7.0 7.5 O7 7.5 8.0 R1 8.0 9.0 R2 9.0 10.0 R3 10.0 11.0 R4 11.0 12.0 Notes 1. Wide forward voltage 0.5V bin structure O1 ~ O7 2. Wide forward voltage 1.0V bin structure R1 ~ R4

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series White Bin Structure Notes: 1. The CCT range of Warm-White varies from 2580K to 3710K 2. The CCT range of Neutral-White varies from 3710K to 4745K. 3. The CCT range of Cool-White varies from4745K to 7050K 4. Color coordinates measurement allowance : ±0.01 5. Color bins are defined at IF=350mA operation. Cool-White Bin Structure Chromaticity specification defined by ANSI

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Cool-White Bin Coordinates 5000K Bin CIE X CIE Y Bin CIE X CIE Y 0.346 0.369 0.338 0.362 0.345 0.356 0.337 0.349 0.353 0.362 0.345 0.35650K-1 0.355 0.376 50K-2 0.346 0.369 Reference Range: 4745~5000K Reference Range: 5000~5310K Bin CIE X CIE Y Bin CIE X CIE Y 0.345 0.356 0.337 0.349 0.344 0.343 0.337 0.337 0.352 0.349 0.344 0.34350K-4 0.353 0.362 50K-3 0.345 0.356 Reference Range: 4745~5000K Reference Range: 5000~5310K 5700K Bin CIE X CIE Y Bin CIE X CIE Y 0.329 0.354 0.321 0.346 0.329 0.342 0.322 0.335 0.337 0.349 0.329 0.34257K-1 0.338 0.362 57K-2 0.329 0.354 Reference Range: 5310~5700K Reference Range: 5700~6020K Bin CIE X CIE Y Bin CIE X CIE Y 0.329 0.342 0.322 0.335 0.329 0.331 0.322 0.324 0.337 0.337 0.329 0.33157K-4 0.337 0.349 57K-3 0.329 0.342 Reference Range: 5310~5700K Reference Range: 5700~6020K 6500K Bin CIE X CIE Y Bin CIE X CIE Y 0.312 0.339 0.303 0.330 0.313 0.329 0.305 0.321 0.321 0.337 0.313 0.32965K-1 0.321 0.348 65K-2 0.312 0.339 Reference Range: 6020~6500K Reference Range: 6500~7050K Bin CIE X CIE Y Bin CIE X CIE Y 0.313 0.329 0.305 0.321 0.315 0.319 0.307 0.311 0.322 0.326 0.315 0.31965K-4 0.321 0.337 65K-3 0.313 0.329 Reference Range: 6020~6500K Reference Range: 6500~7050K

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Neutral-White Bin Structure Neutral-White Bin Coordinates 4000K Bin CIE X CIE Y Bin CIE X CIE Y 0.387 0.396 0.374 0.387 0.383 0.380 0.370 0.373 0.395 0.388 0.383 0.38040K-1 0.401 0.404 40K-2 0.387 0.396 Reference Range: 3710~4000K Reference Range: 4000~4260K Bin CIE X CIE Y Bin CIE X CIE Y 0.383 0.380 0.370 0.373 0.378 0.365 0.367 0.358 0.390 0.372 0.378 0.36540K-4 0.395 0.388 40K-3 0.383 0.380 Reference Range: 3710~4000K Reference Range: 4000~4260K 4500K Bin CIE X CIE Y Bin CIE X CIE Y 0.364 0.381 0.355 0.374 0.362 0.366 0.353 0.360 0.370 0.373 0.362 0.36645K-1 0.374 0.387 45K-2 0.364 0.381 Reference Range: 4260~4500K Reference Range: 4500~4745K Bin CIE X CIE Y Bin CIE X CIE Y 0.362 0.366 0.353 0.360 0.359 0.352 0.351 0.347 0.367 0.358 0.359 0.35245K-4 0.370 0.373 45K-3 0.362 0.366 Reference Range: 4260~4500K Reference Range: 4500~4745K

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Warm-White Bin Structure Warm-White Bin Coordinates 2700K Bin CIE X CIE Y Bin CIE X CIE Y 0.469 0.429 0.456 0.426 0.459 0.410 0.447 0.408 0.470 0.413 0.459 0.41027K-1 0.481 0.432 27K-2 0.469 0.429 Reference Range: 2580~2700K Reference Range: 2700~2870K Bin CIE X CIE Y Bin CIE X CIE Y 0.459 0.410 0.447 0.408 0.448 0.392 0.437 0.389 0.459 0.394 0.448 0.392 27K-4 0.470 0.413 27K-3 0.459 0.410 Reference Range: 2580~2700K Reference Range: 2700~2870K 3000K Bin CIE X CIE Y Bin CIE X CIE Y 0.443 0.421 0.430 0.417 0.435 0.403 0.422 0.399 0.447 0.408 0.435 0.40330K-1 0.456 0.426 30K-2 0.443 0.421 Reference Range: 2870~3000K Reference Range: 3000~3220K Bin CIE X CIE Y Bin CIE X CIE Y 0.435 0.403 0.422 0.399 0.426 0.385 0.415 0.381 0.437 0.389 0.426 0.38530K-4 0.447 0.408 30K-3 0.435 0.403 Reference Range: 2870~3000K Reference Range: 3000~3220K

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series 3500K Bin CIE X CIE Y Bin CIE X CIE Y 0.415 0.409 0.400 0.402 0.408 0.392 0.394 0.385 0.422 0.399 0.408 0.39235K-1 0.430 0.417 35K-2 0.415 0.409 Reference Range: 3220~3500K Reference Range: 3500~3710K Bin CIE X CIE Y Bin CIE X CIE Y 0.408 0.392 0.394 0.385 0.402 0.375 0.389 0.369 0.415 0.381 0.402 0.37535K-4 0.422 0.399 35K-3 0.408 0.392 Reference Range: 3220~3500K Reference Range: 3500~3710K Note: Currently available typical CCT ranges are 3000K, 5700K, and 6500K CCT

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Dimensions Notes. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ± 0.25mm.

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Forward Voltage vs Forward Current, T soldering=25ºC Wavelength Characteristics For Cool-White, @ Solder Pad Temperature = 25 Ċ For Neutral-White, @ Solder Pad Temperature = 25 Ċ

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series For Warm-White, @ Solder Pad Temperature = 25 Ċ Typical Light Output Characteristic vs. Solder Pad Temperature Cool-White, Neutral-White, Warm-White for 700mA Drive Current 0 10 20 30 40 50 60 70 80 90 100 0.80 0.85 0.90 0.95 1.00 1.05 1.10Relative Luminous Flux Solder Pad Temperature C

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Typical Forward Voltage vs. Solder Pad Temperature @ 700mA Drive Current 20 30 40 50 60 70 80 90 100 5.9 6.0 6.1 6.2 6.3 6.4 6.5 6.6 6.7Forward Voltage(V) Solder Pad Temperature C Typical Electrical Characteristics For Cool-White, Neutral-White, Warm-White @ Solder Pad Temperature = 25 Ċ 0 200 400 600 800 1000 1200 1400 5.0 5.5 6.0 6.5 7.0 7.5Forward Voltage(V) Forward Current(mA)

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Typical Relative Luminous Flux vs. Forward Current For Cool-White, Neutral-White, Warm-White @ Solder Pad Temperature = 25Ċ 0 200 400 600 800 1000 1200 1400 0.0 0.4 0.8 1.2 1.6 2.0Relative Luminous Intensity Forward Current(mA) Typical CCT Shift Characteristics vs. Forward Current For Cool-White @ Solder Pad Temperature = 25 Ċ 0 200 400 600 800 1000 1200 1400 5500 5750 6000 6250 6500Corelated Color Temperature(K) Forward Current(mA)

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series For Warm-White @ Solder Pad Temperature = 25 Ċ 0 200 400 600 800 1000 1200 1400 2900 3000 3100 3200Corelated Color Temperature(K) Forward Current(mA) Current Derating Curves Current Derating Curve for 700mA Drive Current Cool-White, Neutral-White, Warm-White 0 20 40 60 80 100 120 200 400 600 800 1000Forward Current (mA) Solder Pad Temperature C

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Typical Radiation Pattern -80 -60 -40 -20 0 20 40 60 80 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Relative Luminous Intensity Degree 2 Note. 1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 2. View angle tolerance is ± 5∘

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Label explanation CPN: Customer’ s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank REF: Rank of Forward Voltage LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm.

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Carrier Tape Dimensions: Loaded quantity 300 PCS per reel Note. 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.1mm. Moisture Resistant Packaging Aluminum moistue-proof bag LabelDesiccantLabel Label Aluminum moisture-proof bag Desiccant Label

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Reliability Data (EHP-B05 Series-5W) Stress Test Stress Condition Stress Duration Reflow Tsol=260Ċ, 10sec, 6min 3 times Thermal Shock HjÐ100Ċ 20min. '∫ 20sec. 'LjÑ10Ċ 20min.

500 Cycles

HjÐ100Ċ 15min. '∫ 5min. 'LjÑ 40 Ċ 15min. IF= 300 mA , 2min on/off Storage Ta=85Ċ , RH=85% 1000hours High Temperature/Humidity Operation Ta=85Ċ , RH=85% , IF=400mA 1000hours Low Temperature Operation Life Ta= -40Ċ, IF=700mA 1000hours High Temperature Operation Life #1 Ta=25Ċ, IF=700mA 1000hours High Temperature Operation Life #2 Ta=55Ċ, IF=700mA 1000hours High Temperature Operation Life #3 Ta=85Ċ, IF=400mA 1000hours High Temperature Storage Ta= 110Ċ 1000hours Low Temperature Storage Ta= -40Ċ 1000hours *lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)<30% *VF: FORWARD VOLTAGE DIFFERENCE<20%

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series Precautions For Use 1. Over-current-Protection Thought the EHP-B05 series has an ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current changes and may cause failure. 2. Storage i. Do not open the moisture proof bag before the devices are ready to use ii. Before the package is opened: The LEDs should be stored at temperatures 30 Ċor less and humidity 50% or less. iii. LEDs may be stored for 6 months. When the storage time has reached more than 6 months, LEDs should be stored in a sealed container filled with Nitrogen gas. iv. After the package is opened: The LEDs should be stored at temperatures under 30 Ċ or less and humidity 30% or less. v. LEDs should be used within 168 hours (7 days) after the package is opened. vi. Before using LEDs: The LEDs should be baked under the following conditions: pre-curing at 60±5Ċ for 24 hours. 3. Thermal Management i. For maintaining high flux output and achieving maximum reliability, EHP-B05 series LEDs should be mounted on a metal core printed circuit board (MCPCB) with proper thermal connection to dissipate approximately 5W of thermal energy under 700mA operation. ii. Special thermal designs are also recommended to take into account outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. iii. Sufficient thermal management must be implemented, or the die junction temperature may exceed the limit and LED lifetime will decrease critically. Recommend: Max TSlug = 70 Ċ

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series 4. Proper Handling To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below. Bare Hand Tweezers When handling the product, do not apply direct pressure to the optical surface. Do not touch the resin with tweezers to avoid scratching or other damage the optical surface. Pick and Place Nozzle for Surface Mount Assembly. During Module Assembly Avoid directly contacting with nozzle. Do not stack the modules together, it could damage the resin or scratch the lens.

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series 5. Reflow Soldering Process a. EHP-B05 series are suitable for SMT process b. Curing of glue in oven according to standard operation flow processes. 100 150 200 250 300Temperature Time ts Preheat time tp TL Profile Feature Parameter Ramp-UP Rate 2-3 Ċ/S Preheat Temperature 150-200Ċ Preheat Time(ts) 60~120s Liquid Temperature(TL) 217Ċ Time above TL 60-90s Peak Temperature(TP) 260Ô5Ċ(Varied with the solder material) Peak Time(tp) Max 20s Ramp-Down Rate 3-5 Ċ/S c. Reflow soldering should not be done more than twice. d. In soldering process, stress on the LEDs during heating should be avoided. e. After soldering, do not warp the circuit board.

LifecyclePhase: Revision : 3 Expired Period: Forever Release Date:2012-04-02 19:22:39.0 DATASHEET EHP- B05 Series

Revision History

Current versionj2012/03/15 Previous versionj2011/12/30 Device No.j DHE-0001726 Rev. Ver. j 3 Page Subjects(major change in previous version) Date of change

9 Revised Cool-White Bin 5700K Coordinates 2011/12/30

P05.Revised Typ.CRI 75 White LEDs & Typ.CRI 85 White LEDs(Added Higher Level Products) P16.Revised Typ. Light Output Characteristic vs. Solder Pad Temperature P17.Add Typical Relative Forward Voltage vs. Solder Pad Temperature 2012/03/15