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IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 1 Rev. 2.8 18.05.2015 Low Loss DuoPack : IGBT in TRENCHSTOP™ and Fieldstop technology with soft, fast recovery anti-parallel Emitter Controlled HE diode Features:  Very low VCE(sat) 1.5V (typ.)  Maximum Junction Temperature 175°C  Short circuit withstand time 5s  Designed for : - Frequency Converters - Uninterrupted Power Supply  TRENCHSTOP™ and Fieldstop technology for 600V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior - very high switching speed - low VCE(sat)  Positive temperature coefficient in VCE(sat)  Low EMI  Low Gate Charge  Very soft, fast recovery anti-parallel Emitter Controlled HE diode  Qualified according to JEDEC1 for target applications  Pb-free lead plating; RoHS compliant  Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ Type VCE IC VCE(sat),Tj=25°C Tj,max Marking Package IKP20N60T 600V 20A 1.5V 175C K20T60 PG-TO220-3 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage, Tj ≥ 25C VCE 600 V DC collector current, limited by Tjmax TC = 25C TC = 100C IC A Pulsed collector current, tp limited by Tjmax IC p ul s 60 Turn off safe operating area, VCE = 600V, Tj = 175C, tp = 1µs - 60 Diode forward current, limited by Tjmax TC = 25C TC = 100C IF Diode pulsed current, tp limited by Tjmax IF p ul s 60 Gate-emitter voltage VGE 20 V Short circuit withstand time2) VGE = 15V, VCC  400V, Tj  150C tSC 5 s Power dissipation TC = 25C Pt o t 166 W Operating junction temperature Tj -40...+175 C Storage temperature Ts t g -55...+150 Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 260

1 J-STD-020 and JESD-022

2) Allowed number of short circuits: <1000; time between short circuits: >1s. G C E PG-TO220-3

IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 2 Rev. 2.8 18.05.2015 Thermal Resistance Parameter Symbol Conditions Max. Value Unit Characteristic IGBT thermal resistance, junction – case Rt h J C 0.9 K/W Diode thermal resistance, junction – case Rt h J C D 1.5 Thermal resistance, junction – ambient Rt h J A 62 Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Symbol Conditions Value Unit min. Typ. max. Static Characteristic Collector-emitter breakdown voltage V( B R ) C E S VGE =0V, IC =0. 2mA 600 - - V Collector-emitter saturation voltage VC E ( s a t ) VGE = 15V, IC =20 A Tj =25 C Tj =1 75C 1.5 1.9 2.05 Diode forward voltage VF VGE =0V, IF =20 A Tj =25 C Tj =1 75C 1.65 1.6 2.05 Gate-emitter threshold voltage VG E ( t h) IC =290µ A, VCE =VGE 4.1 4.9 5.7 Zero gate voltage collector current IC E S VCE =600V , VGE =0V Tj =25 C Tj =1 75C 1500 µA Gate-emitter leakage current IG E S VCE =0V, VGE =20V - - 100 nA Transconductance gfs VCE =20V, IC =20 A - 11 - S Integrated gate resistor RG i n t - Ω Dynamic Characteristic Input capacitance Ci s s VCE =25V, VGE =0V, f=1MHz - 1100 - pF Output capacitance Co s s - 71 - Reverse transfer capacitance Cr s s - 32 - Gate charge QG a t e VCC =48 0V, IC =20 A VGE =15V - 120 - nC Internal emitter inductance measured 5mm (0.197 in.) from case LE PG -TO220 -3 - 7 - nH Short circuit collector current1) IC ( S C ) VGE =15V, tSC 5s VC C = 400V, Tj  150C - 183.3 - A 1) Allowed number of short circuits: <1000; time between short circuits: >1s.

IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 3 Rev. 2.8 18.05.2015 Switching Characteristic, Inductive Load, at Tj=25 C Parameter Symbol Conditions Value Unit min. Typ. max. IGBT Characteristic Turn-on delay time td ( o n ) Tj=25 C, VCC =400 V, IC =20 A, VGE =0/15V, rG =12 , L=131 nH, C=31 pF L, C from Fig. E Energy losses include “tail” and diode reverse recovery. - 18 - ns Rise time tr - 14 - Turn-off delay time td ( o f f ) - 199 - Fall time tf - 42 - Turn-on energy Eon - 0.31 - mJ Turn-off energy Eo f f - 0.46 - Total switching energy Ets - 0.77 - Anti-Parallel Diode Characteristic Diode reverse recovery time trr Tj =25 C, VR =400V, IF =20 A, di F /dt =88 0A/ s - 41 - ns Diode reverse recovery charge Qrr - 0.31 - µC Diode peak reverse recovery current Ir r m - 13.3 - A Diode peak rate of fall of reverse recovery current during tb di rr /dt - 711 - A/s Switching Characteristic, Inductive Load, at Tj=175 C Parameter Symbol Conditions Value Unit min. Typ. max. IGBT Characteristic Turn-on delay time td ( o n ) Tj=17 5C, VCC =400 V, IC =20 A, VGE =0/15V, rG =12 , L=131 nH, C=31 pF L, C from Fig. E Energy losses include “tail” and diode reverse recovery. - 18 - ns Rise time tr - 18 - Turn-off delay time td ( o f f ) - 223 - Fall time tf - 76 - Turn-on energy Eon - 0.51 - mJ Turn-off energy Eo f f - 0.64 - Total switching energy Ets - 1.15 - Anti-Parallel Diode Characteristic Diode reverse recovery time trr Tj =1 75C VR =400V, IF =20 A, di F /dt =88 0A/ s - 176 - ns Diode reverse recovery charge Qrr - 1.46 - µC Diode peak reverse recovery current Ir r m - 18.9 - A Diode peak rate of fall of reverse recovery current during tb di rr /dt - 467 - A/s

IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 11 Rev. 2.8 18.05.2015 PG-TO220-3

IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 12 Rev. 2.8 18.05.2015 I r r m 90% I r r m 10% I r r m di /dt F t r r I F i,v tQ S Q F t S t F V R di /dt r r Q =Q Q r r S F t =t t r r S F Figure C. Definition of diodes switching characteristics p(t) 1 2 n T (t)j n n T C r r r r rr Figure D. Thermal equivalent circuit Figure A. Definition of switching times Figure B. Definition of switching losses

IKP20N60T TRENCHSTOP™ Series IFAG IPC TD VLS 13 Rev. 2.8 18.05.2015 Published by Infineon Technologies AG

81726 Munich, Germany

© 2015 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims a ny and all warranties and liabilities of any kind, including without limitation, warranties of non -infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices , please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life -support devices or systems and/or automotive, aviation and aerospace applications or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.