FJ330301 PANASONIC | Alldatasheet
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Ver. CED This product complies with the RoHS Directive (EU 2002/95/EC). Publication date: January 2011 1 FJ330301 Silicon P-channel MOS FET For switching circuits Overview FJ330301 is P-channel small signal MOS FET employed small size surface mounting package. Features Low drain-source ON resistance: RDS(on) typ. = 4 W (VGS = -4.0 V) High-speed switching Small size surface mounting package: SSSMini3-F2-B Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Packaging Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard) Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Drain-source surrender voltage VDSS -30 V Gate-source surrender voltage VGSS ±12 V Drain current ID -100 mA Peak drain current IDP -200 mA Power dissipation PD 100 mW Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Package Code SSSMini3-F2-B Pin Name 1: Gate 2: Source 3: Drain Marking Symbol: U1 Internal Connection (G) (S) (D)
Ver. CED This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 Electrical Characteristics Ta = 25°C±3°C Parameter Symbol Conditions Min Typ Max Unit Drain-source surrender voltage VDSS ID = -1 mA, VGS = 0 -30 V Drain-source cutoff current IDSS VDS = -30 V, VGS = 0 -1.0 mA Gate-source cutoff current IGSS VGS = ±10 V, VDS = 0 ±10 mA Drain-source ON resistance RDS(on) ID = -10 mA, VGS = -2.5 V 7 17 W ID = -10 mA, VGS = -4.0 V 4 7 W Forward transfer admittance Yfs ID = -10 mA, VDS = -3 V 20 40 mS Short-circuit input capacitance (Common source) Ciss VDS = -3 V, VGS = 0, f = 1 MHz 12 pF Short-circuit output capacitance (Common source) Coss 7 pF Reverse transfer capacitance (Common source) Crss 3 pF Turn-on time * ton VDD = -3 V, VGS = 0 V to -3 V, ID = -10 mA 100 ns Turn-off time * toff VDD = -3 V, VGS = -3 V to 0 V, ID = -10 mA 100 ns Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Test circuit VDD = −3 V ID = −10 mA RL = 300 Ω VOUT VIN D G S 50 Ω td(on) td(off) VIN VOUT 10% 90% 90% 10% tr tf VGS = 0 V to −3 V
Ver. CED This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 ID VDS ID VGS RDS(on) VGS −100 −20 −40 −60 −80 FJ330301_ ID-VDS Drain-source voltage VDS (V) Drain current ID (mA) −2.5 V VGS = −4.5 V −1.5 V Ta = 25°C −10−3 −10−2 −10 −10−1 −102 FJ330301_ ID-VGS Gate-source voltage VGS (V) Drain current ID (mA) Ta = 85°C −30°C 25°C VDS = −3 V 102 103 FJ330301_ RDS(on)-VGS Gate-source voltage VGS (V) Drain-source ON resistance RDS(on) (Ω) Ta = 25°C ID = 0.01 A FJ330301_ RDS(on)-ID Drain current ID (mA) Drain-source ON resistance RDS(on) (Ω) −1 −10 −102 10−1 102 −10−1 VGS = −2.5 V −4.0 V Ta = 25°C Area of safe operation for the FJ330301 Drain current ID (mA) Drain-source voltage VDS (V) −10 −103 −102 100 ms 1 s DC Limited by RDS(on) = 7 Ω (max) (VGS = −4.0 V) 10 ms Ta = 25°C Glass epoxy board (25.4 mm× 25.4 mm × t0.8 mm) coated with copper foil, which has more than 300 mm2. IDP = − 0.2 A 0 −10−5 −15 −20 FJ330301_Ciss , Crss , Coss -VDS Drain-source voltage VDS (V) Short-circuit input capacitance (Common source) Ciss , Reverse transfer capacitance (Common source) Crss , Short-circuit output capacitance (Common source) Coss (pF) Ciss Crss Coss Ta = 25°C FJ330301_|Yfs|-ID Forward transfer admittance |Yfs | (S) Drain current ID (mA) 10−3 10−2 10−1 Ta = 25°C VDS = −3 V Ciss , Crss , Coss VDS Yfs ID 0 40 12080 160 120 100 FJ330301_ PD-Ta Power dissipation PD (mW) Ambient temperature Ta (°C) RDS(on) ID PD Ta Safe operation area
Ver. CED This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 SSSMini3-F2-B Unit: mm 0.30 +0.05 −0.02 0.20 +0.05 −0.02 0.13 +0.05 −0.02 (0.4) (0.4) 0.80 ±0.05 0.80 ±0.05 0.52 ±0.03 1.20 ±0.05 1.20 ±0.05 0.20 ±0.05 1 2 (0.27) 0 to 0.05 (5°) (5°)
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202