IPD053N08N3G INFINEON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 9

Technical content

Features

  • N-channel, normal level
  • Excellent gate charge x R DS(on) product (FOM)
  • Very low on-resistance R DS(on)
  • 175 °C operating temperature
  • Pb-free lead plating; RoHS compliant
  • Qualified according to JEDEC1) for target application
  • Ideal for high-frequency switching and synchronous rectification Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Unit Continuous drain current I D T C=25 °C2) 90 A T C=100 °C 90 Pulsed drain current2) I D,pulse T C=25 °C 360 Avalanche energy, single pulse E AS I D=90 A, R GS=25 Ω 190 mJ Gate source voltage V GS ±20 V Power dissipation P tot T C=25 °C 150 W Operating and storage temperature T j, T stg -55 ... 175 °C IEC climatic category; DIN IEC 68-1 55/175/56 Value V DS 80 V R DS(on),max 5.3 mΩ I D 90 A Product Summary Type IPD053N08N3 G Marking 053N08N previous engineering sample code: IPD06CN08N Rev. 1.0 page 1 2008-01-25

Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R thJC - - 1 K/W Thermal resistance, R thJA minimal footprint - - 75 junction - ambient 6 cm2 cooling area3) -- 5 0 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA 80 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=90 µA 2 2.8 3.5 Zero gate voltage drain current I DSS V DS=80 V, V GS=0 V, T j=25 °C - 0.1 1 µA V DS=80 V, V GS=0 V, T j=125 °C - 10 100 Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 1 100 nA Drain-source on-state resistance R DS(on) V GS=10 V, I D=90 A - 4.4 5.3 mΩ V GS=6 V, I D=45 A - 5.8 9.5 Gate resistance R G - 2.2 - Ω Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=90 A 56 111 - S 1)J-STD20 and JESD22 2) See figure 3 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 Values Rev. 1.0 page 2 2008-01-25

Parameter Symbol Conditions Unit min. typ. max. Dynamic characteristics Input capacitance C iss - 3570 4750 pF Output capacitance C oss - 963 1280 Reverse transfer capacitance C rss -3 6 5 4 Turn-on delay time t d(on) -1 8- n s Rise time t r -6 6- Turn-off delay time t d(off) -3 8- Fall time t f -1 0- Gate Charge Characteristics4) Gate to source charge Q gs -1 9 2 5 n C Gate to drain charge Q gd -1 1 1 6 Switching charge Q sw -1 9 2 8 Gate charge total Q g -5 2 6 9 Gate plateau voltage V plateau - 5.3 - V Output charge Q oss V DD=40 V, V GS=0 V -7 0 9 3 n C Reverse Diode Diode continous forward current I S - - 90 A Diode pulse current I S,pulse - - 360 Diode forward voltage V SD V GS=0 V, I F=90 A, T j=25 °C - 1.0 1.2 V Reverse recovery time t rr -7 2- n s Reverse recovery charge Q rr - 130 - nC 4) See figure 16 for gate charge parameter definition V R=40 V, I F=I S, di F/dt =100 A/µs T C=25 °C Values V GS=0 V, V DS=40 V, f =1 MHz V DD=40 V, V GS=10 V, I D=90 A, R G=1.6 Ω V DD=40 V, I D=90A, V GS=0 to 10 V Rev. 1.0 page 3 2008-01-25

1 Power dissipation 2 Drain current

P tot=f(T C) I D=f(T C); V GS≥10 V 3 Safe operating area 4 Max. transient thermal impedance I D=f(V DS); T C=25 °C; D =0 Z thJC=f(t p) parameter: t p parameter: D =t p/T 1 µs 10 µs 100 µs 1 ms 10 ms DC 103 102 101 100 10210110010-1 V DS [V] I D [A] limited by on-state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10-2 10-1 100 101 10-5 10-4 10-3 10-2 10-1 100 t p [s] Z thJC [K/W] 120 150 180 0 50 100 150 200 T C [°C] P tot [W] 100 0 50 100 150 200 T C [°C] I D [A] Rev. 1.0 page 4 2008-01-25

5 Typ. output characteristics 6 Typ. drain-source on resistance I D=f(V DS); T j=25 °C R DS(on)=f(I D); T j=25 °C parameter: V GS parameter: V GS 7 Typ. transfer characteristics 8 Typ. forward transconductance I D=f(V GS); |V DS|>2|I D|R DS(on)max g fs=f(I D); T j=25 °C parameter: T j 4.5 V 5 V 5.5 V 6 V 6.5 V 7 V 8 V 10 V 0 40 80 120 160 I D [A] R DS(on) [mΩ ] 25 °C 175 °C 120 150 180 02468 V GS [V] I D [A] 120 160 0 40 80 120 160 I D [A] g fs [S] 4.5 V 5 V 5.5 V 6 V 6.5 V 7 V 8 V 10 V 120 160 200 240 280 320 360 012345 V DS [V] I D [A] Rev. 1.0 page 5 2008-01-25

9 Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(on)=f(T j); I D=90 A; V GS=10 V V GS(th)=f(T j); V GS=V DS parameter: I D 11 Typ. capacitances 12 Forward characteristics of reverse diode C =f(V DS); V GS=0 V; f =1 MHz I F=f(V SD) parameter: T j typ 98 % -60 -20 20 60 100 140 180 T j [°C] R DS(on) [mΩ ] 90 µA 900 µA -60 -20 20 60 100 140 180 T j [°C] V GS(th) [V] Ciss Coss Crss 104 103 102 101 0 2 04 06 08 0 V DS [V] C [pF] 25 °C175 °C 25 °C, 98% 175 °C, 98% 103 102 101 100 0 0.5 1 1.5 2 V SD [V] I F [A] Rev. 1.0 page 6 2008-01-25

13 Avalanche characteristics 14 Typ. gate charge I AS=f(t AV); R GS=25 Ω V GS=f(Q gate); I D=90 A pulsed parameter: T j(start) parameter: V DD

15 Drain-source breakdown voltage 16 Gate charge waveforms

V BR(DSS)=f(T j); I D=1 mA 20 V 40 V 60 V 02 0 4 0 6 0 Q gate [nC] V GS [V] -60 -20 20 60 100 140 180 T j [°C] V BR(DSS) [V] V GS Q gate V gs(t h ) Q g(th) Q gs Q gd Q sw Q g 25 °C 100 °C 150 °C 100 0.1 1 10 100 1000 t AV [µs] I AV [A] Rev. 1.0 page 7 2008-01-25

PG-TO252-3 (D-Pak) Rev. 1.0 page 8 2008-01-25

81726 Munich, Germany

© 2007 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user Rev. 1.0 page 9 2008-01-25