IPI70N10SL-16 INFINEON | Alldatasheet

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Technical content

IPP70N10SL-16, IPB70N10SL-16 SIPMOS Power-Transistor Product Summary VDS 100 V RDS(on) 16 mΩ ID 70 A Feature

  • N-Channel
  • Enhancement mode
  • Logic Level
  • 175°C operating temperature
  • Avalanche rated
  • dv/dt rated P-TO263-3-2 P-TO220-3-1P-TO262-3-1 P-TO220-3-1 2 3 Marking N10L16 N10L16 N10L-16 Type Package Ordering Code IPP70N10SL-16 PG-TO220-3-1 SP0002-25708 IPB70N10SL-16 PG-TO263-3-2 SP0002-25700 IPI70N10SL-16 PG-TO262-3-1 SP000225705 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current TC=25°C ID A Pulsed drain current TC=25°C ID puls 280 Avalanche energy, single pulse ID=70 A , VDD=25V, RGS=25Ω EAS 700 mJ Avalanche energy, periodic limited by Tjmax EAR 25 Reverse diode dv/dt IS=70A, VDS=0V, di/dt=200A/µs dv/dt 6 kV/µs Gate source voltage VGS ±20 V Power dissipation TC=25°C Ptot 250 W Operating and storage temperature Tj , Tstg -55... +175 °C IEC climatic category; DIN IEC 68-1 55/175/56 TC=100°C  Green Package (lead free)

IPP70N10SL-16, IPB70N10SL-16 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - case RthJC - - 0.6 K/W Thermal resistance, junction - ambient, leaded RthJA - - 62.5 SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 1) RthJA Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage VGS=0V, ID=2mA V(BR)DSS 100 - - V Gate threshold voltage, VGS = VDS ID = 2 mA VGS(th) 1.2 1.6 2 Zero gate voltage drain current VDS=100V, VGS=0V, Tj=25°C VDS=100V, VGS=0V, Tj=150°C IDSS 0.1 100 µA Gate-source leakage current VGS=20V, VDS=0V IGSS - 10 100 nA Drain-source on-state resistance VGS=4.5V, ID=50A RDS(on) - 14 25 mΩ Drain-source on-state resistance VGS=10V, ID=50A RDS(on) - 10 16 1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air.

IPP70N10SL-16, IPB70N10SL-16 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Dynamic Characteristics Transconductance gfs VDS≥2*ID*RDS(on)max, ID=50A 30 65 - S Input capacitance Ciss VGS=0V, VDS=25V, f=1MHz - 3630 4540 pF Output capacitance Coss - 640 800 Reverse transfer capacitance Crss - 345 430 Turn-on delay time td(on) VDD=50V, VGS=4.5V, ID=70A, RG=1.3Ω - 70 105 ns Rise time tr - 250 375 Turn-off delay time td(off) - 250 375 Fall time tf - 95 145 Gate Charge Characteristics Gate to source charge Qgs VDD=80V, ID=70A - 10 15 nC Gate to drain charge Qgd - 34 51 Gate charge total Qg VDD=80V, ID=70A, VGS=0 to 10V - 160 240 Gate plateau voltage V(plateau) VDD=80V, ID=70A - 3.22 - V Reverse Diode Inverse diode continuous forward current IS TC=25°C - - 70 A Inv. diode direct current, pulsed ISM - - 280 Inverse diode forward voltage VSD VGS=0V, IF=140A - 1.2 1.8 V Reverse recovery time trr VR=50V, IF=lS, diF/dt=100A/µs - 100 150 ns Reverse recovery charge Qrr - 600 900 nC

IPP70N10SL-16, IPB70N10SL-16

1 Power dissipation

Ptot = f (TC) 0 20 40 60 80 100 120 140 160 °C 190 TC 100 120 140 160 180 200 220 240 W 280 SPP70N10L Ptot

2 Drain current

ID = f (TC) parameter: VGS≥ 10 V 0 20 40 60 80 100 120 140 160 °C 190 TC A SPP70N10L ID

3 Safe operating area

ID = f ( VDS ) parameter : D = 0 , TC = 25 °C 10 -1 10 0 10 1 10 2 10 3 V VDS 010 110 210 310 A SPP70N10L ID RDS(on) VDS / ID DC 10 ms 1 ms 100 µs tp = 18.0µs 4 Max. transient thermal impedance ZthJC = f (tp) parameter : D = tp/T 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -510 -410 -310 -210 -110 010 110 K/W SPP70N10L ZthJC single pulse 0.01 0.02 0.05 0.10 0.20 D = 0.50

IPP70N10SL-16, IPB70N10SL-16 5 Typ. output characteristic ID = f (VDS); Tj=25°C parameter: tp = 80 µs 0 1 2 3 4 V 5.5 VDS 100 120 140 A 170 SPP70N10L ID VGS [V] a a 2.5 b b 3.0 c c 3.5 d d 4.0 e e 4.5 f f 5.0 g g 5.5 h h 6.0 i i 6.5 j j 7.0 k k 8.0 l Ptot = 250W l 10.0 6 Typ. drain-source on resistance RDS(on) = f (ID) parameter: VGS 0 20 40 60 80 100 A 130 ID mΩ SPP70N10L RDS(on) VGS [V] = b b 3.0 c c 3.5 d d 4.0 e e 4.5 f f 5.0 g g 5.5 h h 6.0 i i 6.5 j j 7.0 k k 8.0 l l 10.0 7 Typ. transfer characteristics ID= f ( VGS ); VDS≥ 2 x ID x RDS(on)max parameter: tp = 80 µs 0 0.5 1 1.5 2 2.5 3 3.5 4 V 5 VGS A ID 8 Typ. forward transconductance gfs = f(ID); Tj=25°C parameter: gfs 0 10 20 30 40 A 55 ID S gfs

IPP70N10SL-16, IPB70N10SL-16

9 Drain-source on-state resistance

RDS(on) = f (Tj) parameter : ID = 50 A, VGS = 4.5 V -60 -20 20 60 100 140 °C 200 Tj mΩ 110 SPP70N10L RDS(on) typ 98% 10 Typ. gate threshold voltage VGS(th) = f (Tj) parameter: VGS = VDS, ID = 2 mA -60 -20 20 60 100 140 °C 200 Tj 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 2.2 2.4 V VGS(th) min typ max 11 Typ. capacitances C = f (VDS) parameter: VGS=0V, f=1 MHz 0 5 10 15 20 25 30 V 40 VDS 210 310 410 pF C Ciss Coss Crss 12 Forward character. of reverse diode IF = f (VSD) parameter: Tj , tp = 80 µs VSD 010 110 210 310 A SPP70N10L IF Tj = 25 °C typ Tj = 25 °C (98%) Tj = 175 °C typ Tj = 175 °C (98%)

IPP70N10SL-16, IPB70N10SL-16 13 Typ. avalanche energy EAS = f (Tj) par.: ID = 70 A , VDD = 25 V, RGS = 25 Ω 25 45 65 85 105 125 145 °C 185 Tj 100 150 200 250 300 350 400 450 500 550 600 mJ 700 EAS 14 Typ. gate charge VGS = f (QGate) parameter: ID = 70 A pulsed 0 40 80 120 160 200 nC 280 QGate V SPP70N10L VGS 0,8 VDS max DS maxV0,2

15 Drain-source breakdown voltage

V(BR)DSS = f (Tj) -60 -20 20 60 100 140 °C 200 Tj 100 102 104 106 108 110 112 114 V 120 SPP70N10L V(BR)DSS

IPP70N10SL-16, IPB70N10SL-16 Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 München © Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support