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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 9
Technical content
Features
- N-channel - Enhancement mode
- AEC qualified
- MSL1 up to 260°C peak reflow
- 175°C operating temperature
- Green Product (RoHS compliant)
- 100% Avalanche tested Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Unit Continuous drain current I D T C=25 °C, V GS=10 V 17 A T C=100°C, V GS=10V1) 13.3 Pulsed drain current1) I D,pulse T C=25°C 68 Avalanche energy, single pulse1) E AS I D=5.4A 54 mJ Avalanche current, single pulse I AS - 5.4 A Reverse diode dv /dt dv /dt- 6k V / µ s Gate source voltage V GS -± 2 0 V Power dissipation P tot T C=25°C 107 W Operating and storage temperature T j, T stg - -55 ... +175 °C IEC climatic category; DIN IEC 68-1 - - 55/175/56 Value VDS 250 V RDS(on),max 100 mΩ ID 17 A Product Summary PG-TO220-3-1PG-TO263-3-2 Type Package Marking IPB17N25S3-100 PG-TO263-3-2 3N25100 IPP17N25S3-100 PG-TO220-3-1 3N25100 Rev. 1.1 page 1 2013-05-13
Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics1) Thermal resistance, junction - case R thJC -- - 1 . 4 K / W Thermal resistance, junction - ambient, leaded R thJA -- - 6 2 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area2) -- 4 0 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0V, I D= 1mA 250 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=54µA 2.0 3.0 4.0 Zero gate voltage drain current I DSS V DS=250V, V GS=0V -0 . 0 11 µ A V DS=250V, V GS=0V, T j=125°C2) - 1 100 Gate-source leakage current I GSS V GS=20V, V DS=0V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=10V, I D=17A - 85 100 mΩ Values Rev. 1.1 page 2 2013-05-13
Parameter Symbol Conditions Unit min. typ. max. Dynamic characteristics1) Input capacitance C iss - 1133 1500 pF Output capacitance C oss - 480 625 Reverse transfer capacitance Crss -1 1 2 3 Turn-on delay time t d(on) -4 . 4- n s Rise time t r -3 . 7- Turn-off delay time t d(off) -7 . 5- Fall time t f -1 . 2- Gate Charge Characteristics1), 3) Gate to source charge Q gs -57 n C Gate to drain charge Q gd -2 . 4 4 . 8 Gate charge total Q g -1 4 1 9 Gate plateau voltage V plateau -4 . 6- V Reverse Diode Diode continous forward current1) I S -- 1 7 A Diode pulse current1) I S,pulse -- 5 6 Diode forward voltage V SD V GS=0V, I F=17A, T j=25°C -0 . 9 1 . 3 V Reverse recovery time1) t rr V R=125V, I F=17A, di F/dt =100A/µs - 120 - ns Reverse recovery charge1) Q rr - 525 - nC Values V GS=0V, V DS=25V, f =1MHz V DD=125V, V GS=10V, I D=17A, R G=3.3Ω V DD=200V, I D=17A, V GS=0 to 10V 3) Devices thermal performance determined according to EIA JESD 51-14 "Transient Dual Interface Test Method For The Measurement Of The Thermal Resistance" 1) Defined by design. Not subject to production test. T C=25°C 2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.1 page 3 2013-05-13
1 Power dissipation 2 Drain current
P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS ≥ 6 V; SMD 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0; SMD Z thJC = f(t p) parameter: t p parameter: D =t p/T 1 µs 10 µs 100 µs 1 ms 0.1 100 0.1 1 10 100 1000 ID [A] VDS [V] single pulse 0.01 0.05 0.1 0.5 10-6 10-5 10-4 10-3 10-2 10-1 100 10-3 10-2 10-1 100 101 ZthJC [K/W] tp [s] 100 125 0 50 100 150 200 Ptot [W] TC [°C] 0 50 100 150 200 ID [A] TC [°C] Rev. 1.1 page 4 2013-05-13
5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C; SMD R DS(on) = f(I D); T j = 25 °C; SMD parameter: V GS parameter: V GS 7 Typ. transfer characteristics 8 Typ. drain-source on-state resistance I D = f(V GS); V DS = 25V R DS(on) = f(T j); I D = 17 A; V GS = 10 V; SMD parameter: T j 100 150 200 250 300 -60 -20 20 60 100 140 180 RDS(on) [mΩ] Tj [°C] 5 V 5.5 V 10 V 0 6 12 18 24 30 ID [A] VDS [V] 5V 5.5 V 10 V 100 200 300 400 500 0 1 73 45 16 8 RDS(on) [mΩ] ID [A] -55 °C 25 °C 175 °C 3456 ID [A] VGS [V] Rev. 1.1 page 5 2013-05-13
9 Typ. gate threshold voltage 10 Typ. capacitances V GS(th) = f(T j); V GS = V DS C = f(V DS); V GS = 0 V; f = 1 MHz parameter: I D
11 Typical forward diode characteristicis 12 Avalanche characteristics
IF = f(VSD) I A S= f(t AV) parameter: T j parameter: Tj(start) 25 °C175 °C 100 101 102 103 IF [A] VSD [V] 54 µA 540 µA 1.5 2.5 3.5 -60 -20 20 60 100 140 180 VGS(th) [V] Tj [°C] Ciss Coss Crss 102 103 104 0 5 10 15 20 25 30 C [pF] VDS [V] 101 25 °C100 °C150 °C 0.1 100 0.1 1 10 100 1000 10000 IAV [A] tAV [µs] 25 °C175 °C 100 101 102 IF [A] VSD [V] Rev. 1.1 page 6 2013-05-13
13 Avalanche energy 14 Drain-source breakdown voltage
E AS = f(T j) V BR(DSS) = f(T j); I D = 1 mA parameter: I D 15 Typ. gate charge 16 Gate charge waveforms V GS = f(Q gate); I D = 17 A pulsed parameter: V DD V GS Q gate V gs(th) Q g(th) Q gs Q gd Q sw Q g 200 220 240 260 280 300 -60 -20 20 60 100 140 180 VBR(DSS) [V] Tj [°C] 50 V 200 V 0 5 10 15 VGS [V] Qgate [nC] 5.4 A 2.7 A 1.35 A 100 150 200 250 25 75 125 175 EAS [mJ] Tj [°C] Rev. 1.1 page 7 2013-05-13
81726 Munich, Germany
© Infineon Technologies AG 2012 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 8 2013-05-13
Revision History
Revision 1.0 Revision 1.1 Final Data Sheet Changes Update of diagram 5 and 612.05.2013 Date 18.10.2012 Rev. 1.1 page 9 2013-05-13