IPAW60R180P7S INFINEON | Alldatasheet

Document overview

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Technical content

Features

  • Suitableforhardandsoftswitching(PFCandLLC)duetoanoutstanding commutationruggedness
  • Significantreductionofswitchingandconductionlosses
  • ExcellentESDrobustness>2kV(HBM)forallproducts
  • BetterRDS(on)/packageproductscomparedtocompetitionenabledbya lowRDS(on)*A(below1Ohm*mm²)
  • LargeportfoliowithgranularRDS(on)selectionqualifiedforavarietyof industrialandconsumergradeapplicationsaccordingtoJEDEC(J-STD20 andJESD22) Benefits
  • Easeofuseandfastdesign-inthroughlowringingtendencyandusage acrossPFCandPWMstages
  • Simplifiedthermalmanagementduetolowswitchingandconduction losses
  • Increasedpowerdensitysolutionsenabledbyusingproductswith smallerfootprintandhighermanufacturingqualitydueto>2kVESD protection
  • Suitableforawidevarietyofapplicationsandpowerranges

Applications

PFC,hardswitchingPWMandresonantswitchingpowerstages.e.g.PC Silverbox,Adapter,LCD&PDPTV,Lighting,Server,Telecom&UPS Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate orseparatetotempolesisgenerallyrecommended. Table1KeyPerformanceParameters Parameter Value Unit VDS @ Tj,max 650 V RDS(on),max 180 mΩ Qg.typ 25 nC ID,pulse 53 A Eoss@400V 2.6 µJ Body diode di/dt 900 A/µs Type/OrderingCode Package Marking RelatedLinks IPAW60R180P7S PG -TO220 FullPAK WideCreepage 60S180P7 see Appendix A

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet TableofContents

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 1Maximumratings atTj=25°C,unlessotherwisespecified Table2Maximumratings Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Continuous drain current1) ID

11 A TC=25°C

TC=100°C Pulsed drain current2) ID,pulse - - 53 A TC=25°C Avalanche energy, single pulse EAS - - 56 mJ ID=4A; VDD=50V; see table 10 Avalanche energy, repetitive EAR - - 0.28 mJ ID=4A; VDD=50V; see table 10 Avalanche current, single pulse IAS - - 4.0 A - MOSFET dv/dt ruggedness dv/dt - - 80 V/ns VDS=0...400V Gate source voltage (static) VGS -20 - 20 V static; Gate source voltage (dynamic) VGS -30 - 30 V AC (f>1 Hz) Power dissipation Ptot - - 26 W TC=25°C Storage temperature Tstg -55 - 150 °C - Operating junction temperature Tj -55 - 150 °C - Mounting torque - - - 50 Ncm M2.5 screws Continuous diode forward current IS - - 18 A TC=25°C Diode pulse current2) IS,pulse - - 53 A TC=25°C Reverse diode dv/dt3) dv/dt - - 50 V/ns VDS=0...400V,ISD<=18A,Tj=25°C see table 8 Maximum diode commutation speed dif/dt - - 900 A/µs VDS=0...400V,ISD<=18A,Tj=25°C see table 8 Insulation withstand voltage VISO - - 2500 V Vrms,TC=25°C,t=1min 1) Limited by Tj max. Maximum Duty Cycle D = 0.50; TO-220 equivalent 2) Pulse width tp limited by Tj,max 3) Identical low side and high side switch with identical Rg

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 2Thermalcharacteristics Table3Thermalcharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Thermal resistance, junction - case RthJC - - 4.85 °C/W - Thermal resistance, junction - ambient RthJA - - 62 °C/W leaded Thermal resistance, junction - ambient for SMD version RthJA - - - °C/W - Soldering temperature, wavesoldering only allowed at leads Tsold - - 260 °C 1.6mm (0.063 in.) from case for 10s

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 3Electricalcharacteristics atTj=25°C,unlessotherwisespecified Table4Staticcharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Drain-source breakdown voltage V(BR)DSS 600 - - V VGS=0V,ID=1mA Gate threshold voltage V(GS)th 3 3.5 4 V VDS=VGS,ID=0.28mA Zero gate voltage drain current IDSS - µA VDS=600,VGS=0V,Tj=25°C VDS=600,VGS=0V,Tj=150°C Gate-source leakage current IGSS - - 1000 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) 0.145 0.34 0.180 - Ω VGS=10V,ID=5.6A,Tj=25°C VGS=10V,ID=5.6A,Tj=150°C Gate resistance RG - 11 - Ω f=1MHz,opendrain Table5Dynamiccharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Input capacitance Ciss - 1081 - pF VGS=0V,VDS=400V,f=250kHz Output capacitance Coss - 19 - pF VGS=0V,VDS=400V,f=250kHz Effective output capacitance, energy related1) Co(er) - 33 - pF VGS=0V,VDS=0...400V Effective output capacitance, time related2) Co(tr) - 315 - pF ID=constant,VGS=0V,VDS=0...400V Turn-on delay time td(on) - 14 - ns VDD=400V,VGS=13V,ID=5.6A, RG=10Ω ;seetable9 Rise time tr - 12 - ns VDD=400V,VGS=13V,ID=5.6A, RG=10Ω ;seetable9 Turn-off delay time td(off) - 85 - ns VDD=400V,VGS=13V,ID=5.6A, RG=10Ω ;seetable9 Fall time tf - 8 - ns VDD=400V,VGS=13V,ID=5.6A, RG=10Ω ;seetable9 Table6Gatechargecharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Gate to source charge Qgs - 6 - nC VDD=400V,ID=5.6A,VGS=0to10V Gate to drain charge Qgd - 8 - nC VDD=400V,ID=5.6A,VGS=0to10V Gate charge total Qg - 25 - nC VDD=400V,ID=5.6A,VGS=0to10V Gate plateau voltage Vplateau - 5.2 - V VDD=400V,ID=5.6A,VGS=0to10V 1)Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to400V 2)Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to400V

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet Table7Reversediodecharacteristics Values Min. Typ. Max. Parameter Symbol Unit Note/TestCondition Diode forward voltage VSD - 0.9 - V VGS=0V,IF=5.6A,Tj=25°C Reverse recovery time trr - 175 - ns VR=400V,IF=2A,diF/dt=100A/µs; see table 8 Reverse recovery charge Qrr - 1.3 - µC VR=400V,IF=2A,diF/dt=100A/µs; see table 8 Peak reverse recovery current Irrm - 15 - A VR=400V,IF=2A,diF/dt=100A/µs; see table 8

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation TC[°C] Ptot[W] 100 125 150 Ptot=f(TC) Diagram2:Safeoperatingarea VDS[V] ID[A] 100 101 102 103 10-4 10-3 10-2 10-1 100 101 102 1 µs 10 µs 100 µs 1 ms 10 ms DC ID=f(VDS);TC=25°C;D=0;parameter:tp Diagram3:Safeoperatingarea VDS[V] ID[A] 100 101 102 103 10-4 10-3 10-2 10-1 100 101 102 1 µs 10 µs 100 µs 1 ms 10 ms DC ID=f(VDS);TC=80°C;D=0;parameter:tp Diagram4:Max.transientthermalimpedance tp[s] ZthJC[K/W] 10-5 10-4 10-3 10-2 10-1 100 10-2 10-1 100 101 0.5 0.2 0.1 0.05 0.02 0.01 single pulse ZthJC=f(tP);parameter:D=tp/T

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet Diagram5:Typ.outputcharacteristics VDS[V] ID[A] 20 V 10 V 8 V 7 V 6 V 5.5 V 5 V 4.5 V ID=f(VDS);Tj=25°C;parameter:VGS Diagram6:Typ.outputcharacteristics VDS[V] ID[A] 20 V 10 V 8 V 7 V 6 V 5.5 V 5 V 4.5 V ID=f(VDS);Tj=125°C;parameter:VGS Diagram7:Typ.drain-sourceon-stateresistance ID[A] RDS(on)[Ω ] 0.300 0.500 0.700 7 V 20 V 6 V 10 V 6.5 V 5.5 V RDS(on)=f(ID);Tj=125°C;parameter:VGS Diagram8:Drain-sourceon-stateresistance Tj[°C] RDS(on)[normalized] -50 -25 100 125 150 0.000 0.500 1.000 1.500 2.000 2.500 3.000 RDS(on)=f(Tj);ID=5.6A;VGS=10V

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet Diagram9:Typ.transfercharacteristics VGS[V] ID[A] 150 °C 25 °C ID=f(VGS);VDS=20V;parameter:Tj Diagram10:Typ.gatecharge Qgate[nC] VGS[V] 120 V 400 V VGS=f(Qgate);ID=5.6Apulsed;parameter:VDD Diagram11:Forwardcharacteristicsofreversediode VSD[V] IF[A] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 10-1 100 101 102 125 °C 25 °C IF=f(VSD);parameter:Tj Diagram12:Avalancheenergy Tj[°C] EAS[mJ] 100 125 150 EAS=f(Tj);ID=4.0A;VDD=50V

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet Diagram13:Drain-sourcebreakdownvoltage Tj[°C] VBR(DSS)[V] -50 -25 100 125 150 540 550 560 570 580 590 600 610 620 630 640 650 660 670 680 690 VBR(DSS)=f(Tj);ID=1mA Diagram14:Typ.capacitances VDS[V] C[pF] 100 200 300 400 500 100 101 102 103 104 105 Ciss Coss Crss C=f(VDS);VGS=0V;f=250kHz Diagram15:Typ.Cossstoredenergy VDS[V] Eoss[µJ] 100 200 300 400 500 Eoss=f(VDS)

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 5TestCircuits Table8Diodecharacteristics Test circuit for diode characteristics Diode recovery waveform t V ,I Irrm IF VDS 10 %Irrm trr tF tS QF QS dIF / dt dIrr / dt VDS(peak) Qrr = QF +QS trr =tF +tS VDS IF VDS IF Rg1 Rg 2 Rg1 = Rg 2 Table9Switchingtimes Switching times test circuit for inductive load Switching times waveform VDS VGS td(on) td(off)tr ton tf toff 10% 90% VDS VGS Table10Unclampedinductiveload Unclamped inductive load test circuit Unclamped inductive waveform VDS V(BR)DS ID VDS VDSID

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 6PackageOutlines MILLIMETERS 4.25 (BSC)cDED1 L1eLN b2AA1bA2DIM 0.40 1.70 15.479.1710.7012.583 MIN4.502.340.752.65 0.6090.3610.4210.016 0.1770.0920.0300.104 0.495 4.902.740.902.95MAX 0.024 30.6410.4450.5270.091 INCHESMINMAX0.1930.1080.0350.116 EUROPEAN PROJECTION ISSUE DATE 0SCALE 4 mm REVISION28-04-201501 DOCUMENT NO. 0.167 (BSC)0.067 0.98 0.0391.26 0.050 ¡33.00 0.1183.30 0.130 DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS E DD1L1 H b2 b b5b3 P c AA1 Q 022 L0.381BA e Z8B00176938 Figure1OutlinePG-TO220FullPAKWideCreepage,dimensionsinmm/inches

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet 7AppendixA Table11RelatedLinks

  • IFXCoolMOSP7Webpage:www.infineon.com
  • IFXCoolMOSP7applicationnote:www.infineon.com
  • IFXCoolMOSP7simulationmodel:www.infineon.com
  • IFXDesigntools:www.infineon.com

600VCoolMOSªP7PowerTransistor IPAW60R180P7S Rev.2.1,2017-03-01Final Data Sheet RevisionHistory IPAW60R180P7S Revision:2017-03-01,Rev.2.1 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2017-02-03 Release of final version 2.1 2017-03-01 Updated Rthjc; ID rating; SOA curves, Zth curves, y-axis lable diagram 8 TrademarksofInfineonTechnologiesAG AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™, EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™, ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™, PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™, SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™. TrademarksupdatedAugust2015 OtherTrademarks Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. WeListentoYourComments Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com Publishedby InfineonTechnologiesAG 81726München,Germany ©2017InfineonTechnologiesAG AllRightsReserved. LegalDisclaimer Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics (“Beschaffenheitsgarantie”). Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe product,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthis documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseofthe productofInfineonTechnologiesincustomer’sapplications. Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct informationgiveninthisdocumentwithrespecttosuchapplication. Information Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon TechnologiesOffice(www.infineon.com). Warnings Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion, pleasecontactthenearestInfineonTechnologiesOffice. TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.