IP4786CZ32S NEXPERIA | Alldatasheet
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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
- General description The IP4786CZ32S is designed to protect High-Definition Multimedia Interface (HDMI) transmitter host interfaces. It includes HDMI 5 V overcurrent / overvoltage protection, Display Data Channel (DDC) buffering and decoupling, Hot Plug Detect (HPD), backdrive protection, Consumer Electronic Control (CEC) buffering and decoupling, and 12 kV contact ElectroStatic Discharge (ESD) protection for all external I/Os in accordance with the IEC 61000-4-2, level 4 standard. The IP4786CZ32S incorporates Transmission Line Clamping (TLC) technology on the high-speed Transition-Minimized Differential Signaling (TMDS) lines to simplify routing and help reduce impedance discontinuities. All TMDS lines are protected by an impedance-matched diode configuration that minimizes impedance discontinuities caused by typical shunt diodes. The enhanced 60 mA overcurrent / overvoltage linear regulator guarantees HDMI-compliant 5 V output voltage levels with up to 6.5 V inputs. The DDC lines use a new buffering concept which decouples the internal capacitive load from the external capacitive load for use with standard Complementary Metal Oxide Semiconductor (CMOS) or Low Voltage Transistor-Transistor Logic (LVTTL) I/O cells down to 1.8 V. This buffering also redrives the DDC and CEC signals, allowing the use of longer or cheaper HDMI cables with a higher capacitance. The internal hot plug detect module simplifies the application of the HDMI transmitter to control the hot plug signal. All lines provide appropriate integrated pull-ups and pull-downs for HDMI compliance and backdrive protection to guarantee that HDMI interface signals are not pulled down if the system is powered down or enters Standby mode. Only a single external capacitor is required for operation. 2. Features and benefits HDMI 2.0 and all backward compatible standards are supported 6.0 Gbps TMDS Bit Rate (600 Mcsc TMDS Character Rate) compatible Supports Ultra High-Definition (UHD) 4K (2160p) 60 Hz display modes Impedance matched 100 differential transmission line ESD protection for TMDS lines (10 ). No Printed-Circuit Board (PCB) pre-compensation required Simplified flow-through routing utilizing less overall PCB space DDC capacitive decoupling between system side and HDMI connector side and buffering to drive cable with high capacitive load (> 700 pF/25 m) All external I/O lines with ESD protection of at least 12 kV, exceeding the IEC 61000-4-2, level 4 standard IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection, DDC/CEC buffering, hot plug detect and backdrive protection Rev. 3 — 7 January 2015 Product data sheet
Table 1. Ordering information
Product data sheet Rev. 3 — 7 January 2015 3 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 5. Functional diagram Fig 1. Functional diagram n m aaa-013776 CEC driver ESDESD CEC_CONCEC_SYS 26 kΩ10 kΩ
3.3 V VOLTAGE
ESDHDMI_5V0_CON HDMI_5V0_CON ESD DDC_CLK_CONDDC_CLK_SYS 1.85 kΩ3.65 kΩ DDC driver ESDESD DDC_DAT_CONDDC_DAT_SYS 1.85 kΩ3.65 kΩ Hot plug ESDESD HOTPLUG_DET_CONHOTPLUG_DET_SYS 100 kΩ 100 kΩ 100 kΩ enable enCEC enLim enRef CURRENT LIMITER ESDESD HDMI_5V0_CON POWER MANAGEMENT UNIT ESD main clamp ESD_BYPASS ESD ESD CEC_STBY TMDS_CK+_SYS TMDS_CK+_CON TMDS_D0+_SYS TMDS_D0+_CON TMDS_D1+_SYS TMDS_D1+_CON TMDS_D2+_SYS TMDS_D2+_CON 100 kΩ ibias 1..n vref 1..m CURRENT-/VOLTAGE- REFERENCES ESD UTILITY_CON VCC(5V0) VCC(SYS) VCC(SYS) VCC(SYS) VCC(5V0) VCC(5V0) VCC(SYS) VCC(SYS) VCC(5V0)VCC(SYS)
6.1 Pinning
6.2 Pin description
Table 2. Pin description
1 TMDS_D2+_SYS TMDS to ASIC inside system
3 TMDS_D1+_SYS TMDS to ASIC inside system
5 TMDS_D0+_SYS TMDS to ASIC inside system
7 TMDS_CK+_SYS TMDS to ASIC inside system
9 DDC_CLK_SYS DDC clock system side
10 DDC_DAT_SYS DDC data system side
12 HOTPLUG_DET_CON hot plug detect connector side
13 HDMI_5V0_CON 5 V overcurrent out to connector
[1] Connector-side pins (typically d enoted with “_CON” suffix) to ground. [2] System-side pins: CEC_SYS, DDC_DAT_SYS, DDC_CLK_SYS, HOTPLUG_DET_SYS, CEC_STBY, VCC(SYS) and VCC(5V0).
14 DDC_DAT_CON DDC data connector side
15 DDC_CLK_CON DDC clock connector side
16 UTILITY_CON utility line ESD protection
17 TMDS_CK_CON TMDS ESD protection to connector
18 TMDS_CK+_CON TMDS ESD protection to connector
19 TMDS_D0_CON TMDS ESD protection to connector
20 TMDS_D0+_CON TMDS ESD protection to connector
21 TMDS_D1_CON TMDS ESD protection to connector
22 TMDS_D1+_CON TMDS ESD protection to connector
23 TMDS_D2_CON TMDS ESD protection to connector
24 TMDS_D2+_CON TMDS ESD protection to connector
25 CEC_CON CEC signal connector side
26 ESD_BYPASS ESD bias voltage
27 VCC(SYS) supply voltage for level shifting
28 CEC_STBY CEC Standby mode control (LOW for lowest power, CEC-only mode)
29 CEC_SYS CEC I/O signal system side
32 HOTPLUG_DET_SYS hot plug detect system side
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
[1] The IP4786CZ32S contains a 5 V voltage regulator function for higher input voltages. [1] This parameter is guaranteed by design. [2] Capacitive dip at HDMI Time Domain Reflectometer (TDR) measurement conditions. TMDS_D2_SYS, TMDS_CK+_SYS and TMDS_CK_SYS. [5] Backdrive current from TMDS_x_SYS and TMDS_x_CON pins to local VCC(5V0) bias rail at power-down. Table 4. Supplies Tamb = 25 C to +85 C unless otherwise specified. Table 5. TMDS protection circuit amb = 25 C to +85 C unless otherwise specified.
[1] ANSI-ESD SP5.5.1-2004, ESD sensitivity testing TLP component level method 50 TDR. [2] The IP4786CZ32S contains a 5 V voltage regulator function for higher input voltages. [1] ANSI-ESD SP5.5.1-2004, ESD sensitivity testing TLP component level method 50 TDR. Table 6. HDMI_5V0_CON Tamb = 25 C to +85 C unless otherwise specified. Table 7. UTILITY_CON amb = 25 C to +85 C unless otherwise specified.
Table 8. Static characteristics Tamb = 25 C to +85 C unless otherwise specified.
Table 8. Static characteristics …continued Tamb = 25 C to +85 C unless otherwise specified.
[1] The device is active if the input volt age at pin CEC_STBY is above the HIGH level. [2] This parameter is guaranteed by design. [3] Capacitive load measured at power-on. [4] No external pull-up resistor attached. [5] Typical value at T amb =+ 2 5C. [1] The CEC_STBY pin should be connected permanently to V CC(5V0) or VCC(SYS) if no enable control is needed. [2] DDC buffers, HPD buffer, and HDMI_5V0_CON out enabled; CEC buffer enabled. [3] DDC buffers, HPD buffer, and HDMI_5V0_CON out disabled; CEC buffer enabled. Tamb = 25 C to +85 C unless otherwise specified. Table 9. CEC_STBY powe r management circuit
[1] All dynamic measurements are done with a 75 pF load. Ri se times are determined by internal pull-up resistors. Table 10. Dynamic characteristics VCC(5V0) =5 . 0V ; VCC(SYS) = 1.8 V; GND = 0 V; Tamb = 25 C to +85 C unless otherwise specified.
Product data sheet Rev. 3 — 7 January 2015 12 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection (1) Sdd21 (2) Scc21 Normalized to 100 ; differential pairs at signal pins. Fig 4. Mixed-mode differential and commo n-mode insertion loss; typical values (1) Sdd21; Near End Crosstalk (NEXT) (2) Sdd21; Far End Crosstalk (FEXT) normalized to 100 ; differential pairs CH1/CH2 versus CH3/CH4 Fig 5. Mixed-mode differential and common-mode NEXT / FEXT; typical values 018aaa086 f (Hz) 106 1010109107 108 Sdd21; Scc21 (dB) –15 (1) (2) 018aaa087 f (Hz) 106 1010109107 108 Sdd21 (dB) –15 (1) (2)
Product data sheet Rev. 3 — 7 January 2015 13 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
227 MHz pixel clock
Horizontal scale: 90 ps/div Vertical scale: 200 mV/div Offset: 42.6 mV Fig 6. Eye diagram using IP4786CZ32S (1080p, 12 bit)
297 MHz pixel clock
Horizontal scale: 67.5 ps/div Vertical scale: 200 mV/div Offset: 42.6 mV Fig 7. Eye diagram using IP4786CZ32S (1080p, 16 bit) aaa-004451 aaa-004452
Product data sheet Rev. 3 — 7 January 2015 14 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
148.5 MHz test frequency
Measured at TP2 with worst cable emulator, reference cable equalizer and worst case negative skew, device powered. Fig 8. Eye diagram using IP4786CZ32S (2160p, 60 Hz) Deviation from typical capacitance normalized at Vbias =2 . 5V Fig 9. Line capacitance as a function of bias voltage; typical values aaa-014946 Vbias (V) 018aaa090 0.0 –0.2 0.2 0.4 Cline (pF) –0.4
Product data sheet Rev. 3 — 7 January 2015 15 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection IEC 61000-4-5; tp =8 / 2 0s; positive pulse IEC 61000-4-5; t p =8 / 2 0s; negative pulse Fig 10. Dynamic resistance with positive clamping Fig 11. Dynamic resistance with negative clamping tp = 100 ns; TLP; signal pins; typical values tp = 100 ns; TLP; signal pins; typical values Fig 12. Dynamic resistance with positive clampi ng Fig 13. Dynamic resistance with negative clamping I (A) 018aaa091 3.50 3.25 3.75 4.00 VCL (V) 3.00 I (A) 018aaa092 1.5 2.0 2.5 V CL (V) 1.0 VCL (V) 62 2 1810 14 018aaa093 I (A) VCL (V) –12 0 –4–8 018aaa0940 I (A) –14 –12 –10
Product data sheet Rev. 3 — 7 January 2015 16 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection (1) 5.3 V; maximum values; HDMI CTS TID 7-11 (2) 4.8 V; minimum values; HDMI CTS TID 7-11 (3) I = 0 mA (4) I = 55 mA (5) V CC(5V0) supply input; 4.925 V to 6.5 V Fig 14. Overvoltage limiter function (HDMI_5V0_CON) Fig 15. Overcurrent limiter function (HDMI_5V0_CON) 018aaa095 VCC(5V0) (V) 5.0 6.5 6.05.5 5.5 5.0 6.0 6.5 VI (V) 4.5 (1) (5) (4) (3) (2) IO (A) 018aaa096 2.0 4.0 6.0 V O (V) 0.0 (1) (4) (3) (2)
Product data sheet Rev. 3 — 7 January 2015 17 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 10. AC waveforms
10.1 DDC propagation delay
Fig 16. Propagation delay DDC, DDC sys tem side to DDC connector side Fig 17. Propagation delay DDC, DDC co nnector side to DDC system side 018aaa097 DDC system side DDC connector side VCC(SYS)
0.5 V(HDMI_5V0_CON)
0.28 VCC(SYS)
0.5 VCC(SYS)
V(HDMI_5V0_CON) 018aaa098 DDC system side DDC connector side VCC(SYS) 0.5 VCC(SYS) 0.5 VCC(SYS) V(HDMI_5V0_CON)
Product data sheet Rev. 3 — 7 January 2015 18 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
10.2 DDC transition time
Fig 18. Transition time DDC connector side Fig 19. Transition time DDC system side 018aaa099 DDC system side DDC connector side VOL V(HDMI_5V0_CON) 80 % V(HDMI_5V0_CON) 20 % V(HDMI_5V0_CON) VCC(SYS) VOL tPHL tPLH 018aaa100 DDC system side DDC connector side VCC(SYS) 80 % VCC(SYS) 20 % VCC(SYS) VOL VOL tPHL tPLH V(HDMI_5V0_CON)
Product data sheet Rev. 3 — 7 January 2015 19 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 11. Application information
11.1 TMDS ESD
To protect the TMDS lines and also to comply with the impedance requirements of the HDMI specification, the IP4786CZ32S provides ESD protection with matched TLC ESD structures. Typical Dual Rail Clamp (DRC) or rail-to-rail shunt structures are common for low-capacitance ESD protection (Figure 20 ; left side) where the dominant factor for the TMDS line impedance dip is determined by the capacitive load to ground. Parasitic lead inductances of the packaging in this case work against the ESD clamping performance by including the I/t reactance of the inductance into the path of the ESD shunt. The IP4786CZ32S utilizes these inherent inductances in series with the transmission line in order to present an effective capacitive load of roughly only 0.7 pF. This TLC structure minimizes the capacitive dip, for ideal signal integrity (Figure 20 ; right side) without complicated PCB pre-compensation. As a beneficial side effect, this enhances the ESD performance of the device as well, since the reactance of the series inductance attenuates the fast initial peak of the ESD pulse, for a lower residual pulse delivered to the Application Specific Integrated Circuit (ASIC). a. Classic parallel ESD shunt protection b. Improved series shunt TLC clamping Fig 20. TLC ESD protection of TMDS lines 018aaa101 018aaa102
11.2 Operating and standby modes
device into full operating mode. operation as soon as the supplies are available. be detected only when the ASIC power supply rail is on. Table 11. IP4786CZ32S operating modes
Product data sheet Rev. 3 — 7 January 2015 21 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.3 DDC circuit
The DDC bus circuit integrates all required pull-ups, and provides full capacitive decoupling between the HDMI connector and the DDC bus lines on the PCB. The capacitive decoupling ensures that the maximum capacitive load is well within the 50 pF maximum of the HDMI specification. No external pull-ups or pull-downs are required. The bidirectional buffers support high-capacitive load on the HDMI cable-side. Various non-compliant but prevalent low-cost cables have been observed with a capacitive load of up to 6 nF on the DDC lines, far exceeding the 700 pF HDMI limit. The IP4786CZ32S can easily decouple this from the weaker ASIC I/O buffers, and drive the rogue cable successfully. a. DDC clock b. DDC data Fig 21. DDC circuit 1.85 kΩ 3.65 kΩ ESD_BYPASS DDC_CLK_CON DDC_CLK_SYS HDMI_5V0_CON VCC(SYS) 018aaa103 1.85 kΩ 3.65 kΩ ESD_BYPASS DDC_DAT_CON DDC_DAT_SYS HDMI_5V0_CON VCC(SYS) 018aaa104 (1) Valid I 2C signaling example on the cable (connector side) from 5 V (HIGH) to approximately 1 V (LOW). (2) Valid logic-level signaling example to the ASIC (system side) from 1.8 V (HIGH) to approximately 0.5 V (LOW). Fig 22. DDC level shifting waveform example time V (1) (2) 018aaa105
Product data sheet Rev. 3 — 7 January 2015 22 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.4 Logic low I 2C voltage shifter
The DDC buffers provide an additional feature commonly required for high-integration HDMI ASICs. In order to be compatible with the 5 V I2C standard used for DDC communication, I/O buffer cells of many HDMI modern transmitter chips require level shifting. As FET-based level shifting just limits the HIGH level of the signal, the LOW level remains unchanged. As a result, the LOW-level voltages on the DDC bus often exceed the 0.3 VDD LOW-level input voltage (VIL) limit of low-voltage I/O buffers. To enable proper operation that is independent of the system side I/O voltage, the DDC buffers inside IP4786CZ32S shift both the HIGH and the LOW levels by the required amount. This ensures that LOW levels on the system side DDC bus match the LOW-level input voltage requirements down to I/O voltages of 1.8 V. Besides the DDC buffers, this feature is also included in the CEC buffer, allowing standard I/O buffer cells to be used in HDMI ASICs and microcontrollers. (1) V OL(max) driven to system (ASIC) side when I2C logic LOW (less than 0.3 HDMI_5V0_CON) (2) V IH(min) threshold on system (ASIC) side to drive I2C logic HIGH (3) V IL(max) threshold on system (ASIC) side to drive I2C logic LOW Fig 23. Logic voltage thresholds as a function of supply voltage on system side 018aaa106 VCC(SYS) (V) 0.5 0.7 0.9 V OL;VIH; VIL (V) 0.3 (1) (3) (2)
Product data sheet Rev. 3 — 7 January 2015 23 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.5 Hot plug detect circuit and HEAC support
The IP4786CZ32S includes a hot plug detect circuit that simplifies the hot plug application. The circuit generates a standard logic level from the hot plug signal. The hot plug detect circuit is pulling down the signal to avoid any floating signal. The comparator guarantees a save detection of the 2 V hot plug signal without any glitches or oscillation at the hot plug output. The IP4786CZ32S also provides an additional ESD pin to protect the reserved / HEAC pin along with hot plug detect to 12 kV IEC 61000-4-2, level 4.
11.6 CEC
The logical multidrop topology of the CEC bus can include complex physical stubs, loading cables, and interconnects that may deteriorate signal quality. The IP4786CZ32S includes a full bidirectional buffer to drive the CEC bus and isolate the CEC microcontroller or ASIC General-Purpose Input/Output (GPIO). The CEC buffer derives power from an on-board 3.3 V regulator from the VCC(5V0) domain (see Figure 25). This allows extensive system power management configurations and guarantees an HDMI-compliant V(CEC_CON) on the connector, as well as the backdrive-protected 125 A nominal CEC pull-up which does not degrade the bus when powered down. By placing the CEC microcontroller and VCC(5V0) input on a 5 V rail as shown in Figure 28, the CEC microcontroller can communicate over CEC for power commands, and then enable the HDMI port via the CEC_STBY pin, as well as the rest of the system as needed. The CEC buffer is always active as soon as both supply voltages are present. For details on the operating and Standby modes of IP4786CZ32S, see Section 11.2. Fig 24. Hot plug detect circuit 100 kΩ 100 kΩ ESD_BYPASS HOTPLUG_DET_CON HOTPLUG_DET_SYS VCC(5V0) 018aaa107
Product data sheet Rev. 3 — 7 January 2015 24 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.7 Backdrive protection
The HDMI connector contains various signals which can partly supply current into an HDMI device that is powered down. Typically, the DDC lines and the CEC signals can force significant current back into the powered-down rails as shown in Figure 26, causing power-on reset problems with the system, and possible damage. The IP4786CZ32S prevents this backdrive condition whenever the I/O voltage is greater than the local supply. Fig 25. CEC module VCC(5V0) 10 kΩ 26 kΩ ESD_BYPASS CEC_CON CEC_SYS VCC(SYS) 3V3 018aaa108 Fig 26. Generalized backdrive protection 018aaa109 HDMI ASIC HDMI source supply off 5 V backdrive current I2C-bus ASIC HDMI sink
Product data sheet Rev. 3 — 7 January 2015 25 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 11.8 55 mA overcurrent / overvoltage LDO function To isolate faults from the source power supply while still meeting HDMI output specifications, IP4786CZ32S integrates a complete linear output overcurrent protection. The Low DropOut (LDO) design provides a low-cost solution requiring just a single output capacitor (1 F or higher, Equivalent Series Resistance (ESR) < 1 ), eliminating start-up and ripple concerns (see Figure 27). A typical 100 mV dropout voltage Vdo overcurrent-only solution would require a 5.1 V 3 % input supply to guarantee 4.8 V to 5.3 V over 0 mA to 55 mA at the HDMI connector. The overcurrent / overvoltage feature of the IP4786CZ32S allows the use of wider tolerance input supplies up to 6.5 V while still meeting the 4.8 V-to-5.3 V output limit required by HDMI. This means, for example, a cost-reduced 5.2 V 5 % or even a5 . 5V 10 % supply can be used with the IP4786CZ32S. As with all the I/O pins, this block is ESD-protected and also provides backdrive protection when a rogue HDMI sink powers the HDMI cable unexpectedly. Fig 27. 5 V LDO with overcurrent / overvoltage protection ESD_BYPASS HDMI_5V0_CON 018aaa110 DDC/HPD buffers60 mA overcurrent control CEC 3V3 regulator CEC buffer VCC(5V0)
Product data sheet Rev. 3 — 7 January 2015 26 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.9 Schematic view of application
Only a single external component (CO =1 F) is required to protect and interface the ASIC to a complete and compliant HDMI port. The 100 nF ESD bypass capacitor is optional. Fig 28. Schematic view of IP4786CZ32S application &(& +'0, &211(&725 +'0, $6,& ,3&=6 3$' 87,/,7<B&21 70'6B'B&21 70'6B'B&21 70'6B'B&21 70'6B'B&21 70'6B'B&21 70'6B'B&21 70'6B&.B&21 70'6B&.B&21 &(&B&21 ''&B&/.B&21 ''&B'$7B&21 +273/8*B'(7B&21 +'0,B9B&21 ''&B&/.B6<6 ''&B'$7B6<6 +273/8*B'(7B6<6 70'6B'B6<6 70'6B'B6<6 70'6B'B6<6 70'6B'B6<6 70'6B'B6<6 70'6B'B6<6 70'6B&.B6<6 70'6B&.B6<6 9'' 9WR9 6833/< 9WR96833/< &2 ) (6' E\\SDVV RSWLRQDO DDD
Product data sheet Rev. 3 — 7 January 2015 27 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection
11.10 Typical application
The IP4786CZ32S is designed to simplify routing to the HDMI connector, and ease the incorporation of high-level ESD protection into delicately balanced high-speed TMDS lines. These lines rely on tightly controlled microstrip or stripline transmission lines with minimal impedance discontinuities, which can deteriorate return loss, increase deterministic jitter and generally erode overall link signal integrity. Normally when designing the PCB with standard shunt ESD clamps, careful consideration must be given to manual pre-compensation of the additional load of the added ESD component. With the IP4786CZ32S TLCs, the ESD suppressor is designed to maintain the characteristic impedance of the PCB microstrip or stripline, and therefore the designer needs only be concerned with the standard-controlled impedance of the unloaded PCB lines. This simplifies the task of the PCB designer, and minimizes the tuning cycles, which are sometimes required when pre-compensation misses the mark. A basic application diagram for the ESD protection of an HDMI interface is shown in Figure 29 for a type-C HDMI connector. The optimized HXQFN32 pinning simplifies the PCB design to keep the ESD protection close to the connector where it can minimize the coupling of the ESD pulse onto other lines in the system during a strike. Due to the integrated pull-up and pull-down resistors, only two external capacitors are required to implement a fully compliant HDMI port. Fig 29. Application of the IP4786CZ32S showing optimized HDMI type-C connector routing DDD PP
Product data sheet Rev. 3 — 7 January 2015 28 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 12. Package outline Fig 30. Package outline SOT1318-1 (HXQFN32) ReferencesOutline version European projection Issue date IEC JEDEC JEITA sot1318-1_po 11-11-16 11-11-27 Unit mm max nom min 0.50 0.05 0.02 0.00 0.127 4.1 4.0 3.9 2.95 2.80 2.65 4.1 4.0 3.9 0.4 2.8 0.4 0.3 0.2 0.1 A (1) Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HXQFN32: plastic thermal enhanced extremely thin quad flat package; no leads; 32 terminals; body 4 x 4 x 0.5 mm SOT1318-1 A1 b 0.30 0.21 0.18 cD D h EE h 2.95 2.80 2.65 ee 1 e2 2.8 Lv 0.1 w 0.05 y 0.05 0 5 mm scale Eh L terminal 1 index area X C yCy1 terminal 1 index area Dh 32 25 B AD E detail X A c e b 9 16 e 1/2 e 1/2 e A CBv Cw
Product data sheet Rev. 3 — 7 January 2015 29 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
- Through-hole components
- Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
- Board specifications, including the board finish, solder masks and vias
- Package footprints, including solder thieves and orientation
- The moisture sensitivity level of the packages
- Package placement
- Inspection and repair
- Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
- Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave
- Solder bath specifications, including temperature and impurities
13.4 Reflow soldering
- Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 31) than a SnPb process, thus reducing the process window
- Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board
- Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 12 and 13 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 31.
Table 12. SnPb eutectic process (from J-STD-020D) Table 13. Lead-free process (from J-STD-020D)
Product data sheet Rev. 3 — 7 January 2015 31 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Glossary HDMI sink — Device which receives HDMI signals for example, a TV set. HDMI source — Device which transmits HDMI signal for example, DVD player. MSL: Moisture Sensitivity Level Fig 31. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature
Table 14. Revision history
- Section 2 “Features and benefits”: updated
- Figure 1 “Functional diagram”: updated
- Figure 8 “Eye diagram using IP4786CZ32S (2160p, 60 Hz)”: added
- Section 16 “Legal information”: updated IP4786CZ32S v.2 20130711 Product data sheet - IP4786CZ32S v.1 IP4786CZ32S v.1 20120727 Preliminary data sheet - -
Product data sheet Rev. 3 — 7 January 2015 33 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection 16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
Product data sheet Rev. 3 — 7 January 2015 34 of 35 NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors IP4786CZ32S DVI and HDMI interface ESD and overcurrent protection © NXP Semiconductors N.V. 2015. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 7 January 2015 Document identifier: IP4786CZ32S Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents
11.4 Logic low I
11.5 Hot plug detect circuit and HEAC support . . . 23 11.8 55 mA overcurrent / overvoltage LDO function 25