IP4264CZ8-10-TTL NEXPERIA | Alldatasheet
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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
- Product profile
1.1 General description
The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV contact and higher than 25 kV air discharge, far exceeding IEC 61000-4-2, level 4. The devices support ESD protection of the USB data pins of a Universal Subscriber Identity Module (USIM) interface, as well as the digital standard SIM interface ESD protection and ElectroMagnetic Interface (EMI) filtering. The devices are fabricated using monolithic silicon technology. They integrate three resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all three devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices. Similar products are available in Wafer Level Chip-Size Package (WLCSP). IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces. IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) 3-channel SIM card interface integrated RC-filter array and SIM voltage ESD protection 2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance Integrated 100 /100 /47 series channel resistors Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL) or 40 pF (IP4264CZ8-40-TTL) Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2 Micropak (QFN compatible) plastic package with 0.4 mm pitch
1.3 Applications
SIM interfaces in for example, cellular phone and Personal Communication System (PCS) mobile handsets IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Rev. 2 — 12 October 2011 Product data sheet
Table 1. Pinning Table 2. Ordering information Table 3. Marking codes
specified IEC 61000-4-2, level 4 (8 kV contact discharge). Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
[2] Total line capacitance including diode capacitance, per channel. Table 5. Channel resistance Tamb =2 5 C unless otherwise specified. Table 6. Channel characteristics amb =2 5 C unless otherwise specified.
Product data sheet Rev. 2 — 12 October 2011 5 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection 7. Application information
7.1 Insertion loss
The devices are designed as EMI/Radio Frequency Interference (RFI) filters for SIM card interfaces. The setup for measuring return loss is shown in Figure 1. The insertion loss in a 50 system for all three channels of IP4264CZ8-10-TTL (Cch = 10 pF) is shown in Figure 2. The same measurements for IP4264CZ8-20-TTL (Cch = 20 pF) are shown in Figure 3. The insertion loss for IP4264CZ8-40-TTL (Cch = 10 pF) is shown in Figure 4. Cch =1 0p F (1) Pin 2 to 7 (2) Pin 1 to 8 (3) Pin 3 to 6 Fig 1. Frequency response setup Fig 2. IP4264CZ8-10-TTL: Frequency response curves 018aaa016 50 Ω Vgen 50 Ω DUT OUTIN TEST BOARD 018aaa145 –20 –30 –10 S21 (dB) –40 f (MHz) 10–1 10410311 0210 (1) (2) (3)
Product data sheet Rev. 2 — 12 October 2011 6 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Cch =2 0p F (1) Pin 2 to 7 (2) Pin 1 to 8 (3) Pin 3 to 6 Cch =4 0p F (1) Pin 2 to 7 (2) Pin 1 to 8 (3) Pin 3 to 6 Fig 3. IP4264CZ8-20-TTL: Frequency response curves Fig 4. IP4264CZ8-40-TTL: Frequency response curves 018aaa017 −20 −30 −10 S21 (dB) −40 f (MHz) 10−1 10410311 0210 (1) (2) (3) 018aaa018 −20 −30 −10 S21 (dB) −40 f (MHz) 10−1 10410311 0210 (1) (2) (3)
7.2 Crosstalk
Figure 5. The crosstalk for IP4264CZ8-10-TTL is shown in Figure 6, for are terminated with a 50 resistor to ground.
Product data sheet Rev. 2 — 12 October 2011 8 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Cch =2 0p F (1) Pin 1 to 7 (2) Pin 2 to 6 (3) Pin 3 to 8 Cch =4 0p F (1) Pin 1 to 7 (2) Pin 2 to 6 (3) Pin 3 to 8 Fig 7. IP4264CZ8-20-TTL: Crosstalk behavior Fig 8. IP4264CZ8-40-TTL: Crosstalk behavior 018aaa020 −60 −40 −80 −20 S21 (dB) −100 f (MHz) 10−1 10410311 0210 (1) (2) (3) 018aaa021 −60 −40 −80 −20 S21 (dB) −100 f (MHz) 10−1 10410311 0210 (1) (2) (3)
Product data sheet Rev. 2 — 12 October 2011 9 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection
7.3 USIM and SIM interface application schematic
The application schematic diagram depicted in Figure 9 demonstrates how the three NXP SIM card EMI filter and ESD protection devices are used in a typical USIM interface application. For example, in case a standard SIM interface without USB 1.1 is used, the two single diodes (pins 4 and 5) can protect the VSIM line. It is only one example dependent on layout constraints. For example, channels 1 to 8 can be swapped with channels 3 to 6. Also, the USB interface ESD protection pins 4 and 5 can be exchanged. Due to both sides of the devices containing identical protection diodes, baseband and SIM card side can be swapped, too (pin 1 with pin 8, pin 2 with pin 7 etc.). A standard SIM interface application is depicted in Figure 10. In this case, both ESD protection diodes (pins 1 and 8) are used to protect VSIM. Fig 9. USIM application schematic BASEBAND VSIM RST CLK CENTER GROUND PAD SIM CARD USB VSIM protection diode I/O 100 Ω 100 Ω 47 Ω 018aaa147 VCC GND RST SPU AUX 1 AUX 2 CLK I/O
Product data sheet Rev. 2 — 12 October 2011 10 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection
7.4 Compatible devices in WLCSP
The IP4264CZ8-10-TTL and IP4264CZ8-20-TTL are optimized for SIM and USIM interfaces. Comparable devices are also available in WLCSP:
- IP4064CX8, 0.5 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
- IP4364CX8, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-20-TTL
- IP4366CX8/P, 0.4 mm pitch SIM interface device compatible with IP4264CZ8-10-TTL
- IP4365CX11/P, 0.4 mm pitch USIM interface device compatible with IP4264CZ8-10-TTL Fig 10. SIM application schematic CENTER GROUND PAD SIM CARD BASEBAND VSIM RST CLK I/O 100 Ω 100 Ω 47 Ω 018aaa148 VCC GND RST SPU AUX 1 AUX 2 CLK I/O
Product data sheet Rev. 2 — 12 October 2011 11 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection 8. Package outline Fig 11. Package outline SOT1166-1 (HUSON8) ReferencesOutline version European projection Issue date IEC JEDEC JEITA sot1166-1_po 10-03-18 10-03-22 Unit(1) mm max nom min 0.55 0.05 0.00 0.25 0.20 0.15 1.8 1.7 1.6 1.3 1.2 1.1 1.45 1.35 1.25 0.4 1.2 0.30 0.25 0.20 0.05 A Dimensions Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1 A1 c 0.127 bD D h EE h 0.45 0.40 0.35 ee 1 k 0.2 Lv 0.1 w 0.05 y 0.05 0 1 2 mm scale X C yCy1 tiebars are indicated on arbitrary location and size detail X A c terminal 1 index area B AD E b terminal 1 index area e A CBv Cw L k Eh Dh
Table 7. Revision history
- Section 10 “Legal information”: updated IP4264CZ8-10_20_40-TTL v.1 20110708 Product data sheet - -
Product data sheet Rev. 2 — 12 October 2011 13 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection 10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.
Product data sheet Rev. 2 — 12 October 2011 14 of 15 NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 11. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 October 2011 Document identifier: IP4264CZ8-10_20_40-TTL Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 12. Contents