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Sony has commercialized the "IMX323LQN" CMOS Image Sensor that realizes a compact and thin package while main- taining low illumination performance equal to that of the existing Sony product (IMX222LQJ*) that improved sensitivity in the near infrared region for industrial applications. WLCSP (Wafer Level Chip Size Package) technology is used Diagonal 6.23 mm (Type 1/2.9) Approx. 2.19M-Effective Pixel Color CMOS Image Sensor ˙Frame rate 30 frame/s ˙On-chip 10-bit/12-bit ADC ˙Pixel size: 2.8 μm-square unit pixel ˙Compact and thin package using WLCSP technology 7.55mm (H) × 5.75mm (V) × 0.77mm (t) ˙Improved sensitivity in the near infrared range * Exmor is a trademark of Sony Corporation. The Exmor is a version of Sony's high performance CMOS image sensor with high-speed processing, low noise and low power dissipation by using column- parallel A/D conversion. Full HD Support High Sensitivity CMOS Image Sensor with a Super Small Package for Industrial Applications Compact and thin package Improved sensitivity in the near infrared range to realize a smaller size while maintaining performance such as visibility. The package size has been reduced to 1/8 the volume of the previous product, which helps to greatly reduce the set size. * See the New Product Information released in August 2013 The IMX323LQN is the first Sony CMOS image sensor for industrial applications to use WLCSP (Wafer Level Chip Size Package) technology, which realized a reduced package size and thickness (7.55mm (H) × 5.75mm (V) × 0.77mm(t)) compared to the existing product IMX222LQJ (12.8mm (H) × 10.8mm (V) × 1.95mm (t)). This makes it possible to shrink the set board size, which helps to reduce the camera size (Photograph 1). Improved picture quality at low illumination is strongly demanded of cameras for industrial applications. To meet this demand, Sony also applied technology to the IMX323LQN that increases sensitivity in the near infrared range as well as the visible light range. This makes it possible to obtain clear images that enable to suf ficiently discriminate subjects even under moonlit conditions. (Photograph 2). IMX323LQNIMX323LQN
ʻphotograph 1ʼComparison of existing product and IMX323LQN packages ʻPhotograph 2ʼ Image sample Conditions: 0.1 lx, F1.4 (ADC 12 bit mode, 30 frame/s) New product IMX323LQNExisting product IMX222LQJ Existing product IMX222LQJ Gain 42 dB New product IMX323LQN Gain 45 dB ʻTable 1ʼ Device Structure Item Existing product IMX222LQJ Image size Unit cell size Package Gain Supply voltage Number of effective pixels 2.8 μm (H) × 2.8 μm (V) Diagonal 6.4 mm (Type 1/2.8) 2.7 V / 1.8 V / 1.2 V 94 pin LGA 0 to 42 dB (0.3 dB Step) 1984 (H) × 1225 (V) Approx. 2.43M pixels Diagonal 6.23 mm (Type 1/2.9) 80 pin CSP BGA 0 to 45 dB (0.3 dB Step) 1985 (H) × 1105 (V) Approx. 2.19M pixels New product IMX323LQN ʻTable 3ʼ Basic Drive Mode Drive mode Recommended number of recording pixels ADC Full HD HD 1920 (H) × 1080 (V) Approx. 2.07M pixels 1280 (H) × 720 (V) Approx. 0.92M pixels 10 bit 10 bit 12 bit 12 bit 30 frame/s 60 frame/s 30 frame/s 30 frame/s Frame rate ʻTable 2ʼ Image Sensor Characteristics Item IMX323LQNIMX222LQJ Remarks Sensitivity (F5.6) 510 mV Typ. 1/30s accumulation *Sony reserves the right to change products and specifications without prior notice.