DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 41
Technical content
Features
Dual core computation – Motion Control Engine (MCE) and ARM® Cortex®-M0 based user application controller (MCU) Motion Control Engine (MCE) MCE offers a ready-to-use solution with easy configuration for variable speed motor control − Space Vector PWM with sinusoidal commutation and integrated protection features − Current sensing via single or leg shunt configuration − Sensorless and / or Hall sensor (analog / digital) based operation − Integrated and / or external temperature sensor − Optional boost or totem pole PFC control − Integrated Script language for additional MCE and I/O control. − High speed communication interface (JCOM) between MCE and ARM® core processor − Parameter programming and debug support with MCEWizard and MCEDesigner User Application Controller (MCU) CPU Subsystem − 32-bit Arm® Cortex®-M0 core for user application control − 48/96 MHz core/peripherals clock − Nested Vectored Interrupt Controller (NVIC) − Event Request Unit (ERU) for event interconnections − MATH Co-processor: 24-bit trigonometric calculation (CORDIC), 32-bit division unit On-Chip Memories − 8 Kbyte ROM − 16 Kbyte SRAM (with parity) − 128 Kbyte FLASH memory (with ECC) Supply, Reset and Clock − 3.3 V to 5.5 V supply with power on reset and brownout detector − On-chip clock monitor − Internal slow and fast oscillators − External crystal oscillator support (32 kHz and 4 to 20 MHz) System Control − Window watchdog − Real Time Clock (RTC) modue − Pseudo random number generator
2 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Block Diagram Reference Communication Peripherals − Universal Serial Interface Channels (USIC), usable as UART, double-SPI, IIC, IIS and LIN interfaces − MultiCAN+, Full-CAN/Basic-CAN with 2 nodes, 32 message objects (up to 1 MBaud) Analog Frontend Peripherals − 12-bit ADC converter with adjustable gain, up to 1 MS/s and up to 7 analog inputs − 0 V to 5.5 V input voltage range − 2 fast analog comparators − DAC with one-bit sigma-delta generator, external low-pass filter and up to 7 outputs − Temperature sensor High Speed Timers − 2x Capture Compare Unit with 4 timer channels each (CCU4) − Clock up to 96 MHz − Up to 8 capture inputs − Up to 8 PWM outputs (center/edge aligned) Input/Output Lines With Individual Bit Controllability − Tri-stated in input mode − Push/pull or open drain output mode − Configurable pad hysteresis Debug System − 4 breakpoints, 2 watchpoints − ARM serial wire debug (SWD), single-pin debug (SPD) interfaces − Independent operation of the MCE Potential Applications Air-conditioners Refrigerators Product Validation Industrial
Ordering Information
Product Type Application Package IMC301A-F048 Single motor LQFP-48 IMC301A-F064 LQFP-64 IMC302A-F048 Single motor + PFC (boost, totem pole) LQFP-48 IMC302A-F064 LQFP-64
3 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Block Diagram Reference
Description
iMOTION™ IMC300 is a family of highly integrated ICs for the control of variable speed motor control system with an additional user programmable microcontroller. By integrating the required hardware, software and user program to perform control of a permanent magnet synchronous motor (PMSM) it offers a high flexibility of motor control system at the lowest system and development cost.
4 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Block Diagram Reference Table of Contents
5 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Block Diagram Reference About this document Scope and purpose This Datasheet describes the mechanical, electrical and functional characteristics of the iMOTION™ IMC300 series of motor control ICs. If no specific device is given the characteristics are valid for all devices within the iMOTION™ IMC300 series. For a detailed description of the functionality and configuration options please refer to the device hardware reference manual and the relevant MCE software reference manual. Intended audience The Datasheet is targeting developers implementing a variable speed drive system.
6 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Block Diagram Reference
1 Block Diagram Reference
The block diagram below gives an overview on the available functional units in the iMOTION™ IMC300 family. Not all units are required in all applications and some modules might share pins in smaller packages. Please refer to the pin configuration for individual packages and the application schematics examples given in the following sections. Figure 1 Block Diagram
7 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Pin Configuration
2 Pin Configuration
The following tables show the pin configurations for each individual device from the IMC300 series in the available packages. The pin type is specified as follows: P – power and ground pins I - digital input O - digital output IO – digital input or output AIN - analog input AO – analog output Each of the IMC300 cores has control over a different set of pins. The MCE core pins are labeled by system function which can be a single fixed function or multiple function options that are selected according to the MCE software configuration. The MCE functions and configuration options are described in the MCE software reference manual. The user application core (MCU) pins are labeled by port number (Pn.m) and have peripheral I/O functions selected according to the user software. The peripheral I/O function selection and configuration options are described in the IMC30xA hardware reference manual. Pins that do not have any signal assigned are reserved for future use. These pins should be left unconnected and neither be connected to ground nor to the positive supply. Note: The reference voltage for motor current trip protection is generated by an internal DAC, therefore pins like REFU, REFV, and REFW only require a blocking capacitor. Pin Configuration IMC301A / IMC302A Table 1 Pin List Signal Type IMC301A -F064 IMC301A -F048 IMC302A -F064 IMC302A -F048 VDD P 24, 25, 35, 50 21, 28, 24, 25, 35, 50 21, 28, Supply Voltage VSS P 23, 49 20, 37 23, 49 20, 37 Ground Motor control (MCE) PWMUL O 29 22 29 22 PWM output phase U low side PWMUH O 30 23 30 23 PWM output phase U high side PWMVL O 31 24 31 24 PWM output phase V low side PWMVH O 32 25 32 25 PWM output phase V high side PWMWL O 33 26 33 26 PWM output phase W low side PWMWH O 34 27 34 27 PWM output phase W high side GK I 36 29 36 29 Motor gate kill input VDC AIN 14 11 14 11 DC bus voltage sensing input
8 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Pin Configuration ISS/IU AIN 18 15 18 15 Current sense input single shunt / phase U IV AIN 15 12 15 12 Current sense input phase V IW AIN 11 8 11 8 Current sense input phase W REFU AO 17 14 17 14 Itrip phase U reference output REFV AIN 16 13 16 13 Itrip phase V reference output REFW AIN 10 7 10 7 Itrip phase W reference output Hall sensor inputs (MCE) AHALL1+ AIN 10 7 10 7 Analog Hall sensor input 1+ AHALL1- AIN 11 8 11 8 Analog Hall sensor input 1- AHALL2+ AIN 16 13 16 13 Analog Hall sensor input 2+ AHALL2- AIN 15 12 15 12 Analog Hall sensor input 2- HALL1 IO 26 - 26 - Digital Hall sensor input 1 HALL2 IO 27 - 27 - Digital Hall sensor input 2 HALL3 IO 28 - 28 - Digital Hall sensor input 3 Power Factor Correction (MCE) PFCG0 O - - 44 33 PFC gate drive 0 output PFCG1 O - - 43 32 PFC gate drive 1 (totem pole PFC) output IPFC AIN - - 12 9 PFC current sensing input IPFCREF AIN - - 21 18 PFC Itrip reference input IPFCTRIP AIN - - 22 19 PFC Itrip current sensing input VAC1 AIN - - 20 17 AC voltage sensing input 1 VAC2 AIN - - 19 16 AC voltage sensing input 2 Interface (MCE) PGOUT O 42 31 42 31 Pulse output NTC AIN 13 10 13 10 External thermistor input LED O 41 30 41 30 Status LED Communication (MCE) RXD0 I 45 35 45 35 MCE UART0 receive input TXD0 O 46 36 46 36 MCE UART0 transmit output Scripting (MCE) AIN1 AIN 10 7 10 7 Analog input AIN2 AIN 11 8 11 8 Analog input AIN3 AIN 12 9 - - Analog input AIN4 AIN 13 10 13 10 Analog input AIN7 AIN 16 13 16 13 Analog input AIN8 AIN 17 14 17 14 AIN10 AIN 19 16 - - Analog input AIN11 AIN 20 17 - - Analog input GPIO2 IO - 32 - - User configurable I/O, digital GPIO3 IO - 33 - - User configurable I/O, digital
9 Revision 1.2 2020-10-20 IMC301A/302A Datasheet Pin Configuration GPIO4 IO - 34 - 34 User configurable I/O, digital GPIO5 IO - 18 - - User configurable I/O, digital GPIO6 IO - 19 - - User configurable I/O, digital GPIO7 IO 21 - - - User configurable I/O, digital GPIO8 IO 22 - - - User configurable I/O, digital GPIO9 IO 26 - 26 - User configurable I/O, digital GPIO10 IO 27 - 27 - User configurable I/O, digital GPIO11 IO 28 - 28 - User configurable I/O, digital GPIO12 IO 37 - 37 - User configurable I/O, digital GPIO13 IO 38 - 38 - User configurable I/O, digital GPIO14 IO 39 - 39 - User configurable I/O, digital GPIO15 IO 40 - 40 - User configurable I/O, digital GPIO16 IO 43 - - - User configurable I/O, digital GPIO17 IO 44 - - - User configurable I/O, digital MCU P0.8 IO 51 39 51 39 Programmable I/O P0.9 IO 52 40 52 40 Programmable I/O P0.10 IO 53 41 53 41 Programmable I/O P0.11 IO 54 42 54 42 Programmable I/O P0.12 IO 55 43 55 43 Programmable I/O P0.13 IO 56 44 56 44 Programmable I/O P0.14/SWDIO IO 57 45 57 45 Programmable I/O, or MCU SWD debug interface data input / output P0.15/SWDCLK I 58 46 58 46 Programmable I/O, or MCU SWD debug interface clock input P1.0 IO 48 - 48 - Programmable I/O P1.1 IO 47 - 47 - Programmable I/O P2.0 IO/AIN 3 2 3 2 Programmable I/O, or MCU UART0 receive input, or analog input P2.1 IO/AIN 4 3 4 3 Programmable I/O, or MCU UART0 transmit output, or analog input P2.2 I/AIN 5 4 5 4 Digital input, or analog input P2.6 I/AIN 6 5 6 5 Digital input , or analog input P2.8 I/AIN 7 - 7 - Digital input, or analog input P2.10 IO/AIN 8 - 8 - Programmable I/O, or analog input P2.11 IO/AIN 9 6 9 6 Programmable I/O, or analog input P4.0 IO 59 - 59 - Programmable I/O P4.1 IO 60 47 60 47 Programmable I/O P4.2 IO 61 48 61 48 Programmable I/O P4.3 IO 62 1 62 1 Programmable I/O P4.4 IO 63 - 63 - Programmable I/O, or MCU UART1 receive input
Pin Configuration Drawing IMC301A 17 18 19 20 21 22 23 24 1514 16 P4.2 REFW/AHALL1+/AIN1 IW/AHALL1-/AIN2 AIN3 NTC/AIN4 VDD P2.11 P0.9 GPIO3 PWMVH PWMVL PWMUH PWMUL VSS AIN10 P0.11 P4.1 SWDCLK SWDIO P0.12 IMC301A-F048 (Top View) GK TXD0 VDD VDC 373839404142434445464748 PWMWL PWMWH PGOUT LED P0.10 IV/AHALL2- REFV/AHALL2+/AIN7 REFU/AIN8 ISS/IU VDD VSS P0.13 GPIO2 RXD0 P0.8 P2.6 P4.3 P2.0 P2.2 P2.1 GPIO4 AIN11 GPIO5 GPIO6 Figure 2 IMC301-F048 P4.5 IO 64 - 64 - Programmable I/O, or MCU UART1 transmit output P4.6 IO 1 - 1 - Programmable I/O P4.7 IO 2 - 2 - Programmable I/O
P4.6 TXD0 P0.8 P0.9 VDD P0.13 PWMVH PWMVL HALL2/GPIO10 PWMUL VSS AIN11 SWDIO P4.3 P4.2 P4.1 SWDCLK IMC301A-F064 (Top View) REFU/AIN8 GK VDD GPIO13 VDC 535455565758596061626364 PWMWL PWMWH P0.12HALL1/GPIO9 REFV/AHALL2+/AIN7 ISS/IU GPIO15 P4.0 AIN3 VSS REFW/AHALL1+/AIN1 IW/AHALL1-/AIN2 P0.11 29 30 31 32 52 51 50 49 P2.11 GPIO12 P4.7 RXD0 IV/AHALL2- AIN10 PWMUH HALL3/GPIO11 P2.10 NTC/AIN4 LED P1.0 VDD VDD P1.1 PGOUT GPIO17 GPIO16 P0.10 P2.0 P2.1 P2.6 P2.8 P4.4 P4.5 P2.2 GPIO7 GPIO8 Figure 3 IMC301A-F064
Pin Configuration Drawing IMC302A 17 18 19 20 21 22 23 24 1514 16 P4.2 REFW/AHALL1+/AIN1 IW/AHALL1-/AIN2 IPFC NTC/AIN4 VDD P2.11 P0.9 PFCG0 PWMVH PWMVL PWMUH PWMUL VSS VAC2 P0.11 P4.1 SWDCLK SWDIO P0.12 IMC302A-F048 (Top View) GK TXD0 VDD VDC 373839404142434445464748 PWMWL PWMWH PGOUT LED P0.10 IV/AHALL2- REFV/AHALL2+/AIN7 REFU/AIN8 ISS/IU VDD VSS P0.13 PFCG1 RXD0 P0.8 P2.6 P4.3 P2.0 P2.2 P2.1 GPIO4 VAC1 IPFCREF IPFCTRIP Figure 4 IMC302A-F048
P4.6 TXD0 P0.8 P0.9 VDD P0.13 PWMVH PWMVL HALL2/GPIO10 PWMUL VSS VAC1 SWDIO P4.3 P4.2 P4.1 SWDCLK IMC302A-F064 (Top View) P2.11 REFU/AIN8 GK VDD GPIO13 VDC 535455565758596061626364 PWMWL PWMWH P0.12HALL1/GPIO9 REFV/AHALL2+/AIN7 ISS/IU GPIO15 P4.0 IPFC VSS IW/AHALL1-/AIN2 P0.11 29 30 31 32 52 51 50 49 P2.10 GPIO12 P4.7 RXD0 IV/AHALL2- VAC2 IPFCREF PWMUH HALL3/GPIO11 P2.8 NTC/AIN4 LED P1.0 VDD VDD P1.1 PGOUT PFCG0 PFCG1 P0.10 P2.0 P2.1 P2.2 P2.6 P4.4 P4.5 IPFCTRIP REFW/AHALL1+/AIN1 Figure 5 IMC302A-F064
3 Functional Description
The IMC300 architecture is based on the combination of the Motion Control Engine (MCE) for Hall sensor based or sensorless motor control and PFC regulation and an additional microcontroller (MCU) based on an Arm® Cortex®-M0 core. The MCE contains an embedded motor control algorithm with fast angle sensing at startup and enables low and ultra-high speed operation, and offers either single shunt current sensing or leg shunt current sensing. PFC control supports two topologies, namely a single stage boost mode PFC and a totem-pole PFC with 50 kHz fast switching application to minimize the inductor size. Users can configure the motor and PFC parameters for each specific motors and store into the onboard Flash memory. The MCE also contains the UL 607310-1 software safety certified library and modules. The MCU is based on an Arm® Cortex®-M0 core and provides 128 Kbyte of flash and 16 Kbyte of RAM memory. The peripheral set is targeting communicaton and system application tasks. Both units – MCE and MCU – run largely independantly up to the fact that the MCU can be debuged while the motor is still running. Communication between the two units is using a fast serial interface called JCOM. Figure 6 shows the application schematics diagram for a single motor control system with single shunt current sensing configuration. Programmable IO & Analog input VDD 3.3V – 5.0V Communication Interfaces Debug Tool GK ISS/IU VDC NTC Optional Position Feedback PWMUH PWMUL PWMVH PWMVL PWMWH PWMWL 3 phase Gate Driver REFU VDD Temperature sensing Motor Motion Control EngineARM M0 Script Languare Current Sens e Logic Parameter FOC Block Motion Control Sequencer Fault Handling Space Vector PWM PFC PWM Class B Safety Module Interrupt Control JCOM Math Accelerator Debug System Temperature sensing Program RAM MPU RAM Flash Memory Secure Loader RESET Watchdog Timer 3.3V – 5.0V RESET Watchdog Timer 96 MHz Oscillator 32 kHz Oscillator Oscillator Watchdog Clock monitoring
96 MHz
Figure 6 IMC301A Application Schematics Diagram (Single Shunt Current Sensing)
Figure 7 shows the application schematics diagram for an air-conditioner outdoor unit system with single shunt current sensing and a boost mode PFC configuration. Hall sensor feedback options support applications requiring high torque during start-up. GK IPCREF ISS/IU VDC IPFC NTC VAC1 VAC2 Optional Position Feedback PWMUH PWMUL PWMVH PWMVL PWMWH PWMWL PFCG0 PFCGK 3 phase Gate Driver Gate Driver REFU VDD Temperature sensing Motor Motion Control EngineARM M0 Script Languare Current Sens e Logic Parameter FOC Block Motion Control Sequencer Fault Handling Space Vector PWM PFC PWM Class B Safety Module Interrupt Control JCOM Math Accelerator Debug System Temperature sensing Program RAM MPU RAM Flash Memory Secure Loader RESET Watchdog Timer 3.3V – 5.0V RESET Watchdog Timer 96 MHz Oscillator 32 kHz Oscillator Oscillator Watchdog Clock monitoring & Analog input VDD 3.3V – 5.0V Communication Interfaces Debug Tool VDD VDD Figure 7 IMC302A Application Schematics Diagram (Single Shunt Current Sensing)
Figure 8 shows the application schematics diagram for an air-conditioner outdoor unit system with leg shunt current sensing and a boost mode PFC configuration. Programmable IO & Analog input VDD 3.3V – 5.0V Communication Interfaces Debug Tool GK VDD VDD VDD Optional Position Feedback PWMUH PWMUL PWMVH PWMVL PWMWH PWMWL PFCG0 PFCGK 3 phase Gate Driver Motor Gate Driver Temperature sensing IPCREF ISS/IU VDC IV IW IPFC NTC VAC1 VAC2 REFV REFW REFU Motion Control EngineARM M0 Script Languare Current Sens e Logic Parameter FOC Block Motion Control Sequencer Fault Handling Space Vector PWM PFC PWM Class B Safety Module Interrupt Control JCOM Math Accelerator Debug System Temperature sensing Program RAM MPU RAM Flash Memory Secure Loader RESET Watchdog Timer 3.3V – 5.0V RESET Watchdog Timer 96 MHz Oscillator 32 kHz Oscillator Oscillator Watchdog Clock monitoring Figure 8 IMC302A Application Schematics Diagram (Leg Shunt Current Sensing)
Electrical characteristics and parameters
4 Electrical characteristics and parameters
4.1.1 Parameter Interpretation
The parameters listed in this section represent partly the characteristics of the IMC300 and partly its requirements on the system. To aid interpreting the parameters easily when evaluating them for a design, they are indicated by the abbreviations in the “Symbol” column:
- CC Such parameters indicate Controller Characteristics, which are distinctive feature of the IMC300 and must be regarded for a system design.
- SR Such parameters indicate System Requirements, which must be provided by the application system in which the IMC300 is designed in.
4.1.2 Absolute Maximum Ratings
Stresses above the values listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect device reliability. Table 2 Absolute Maximum Rating Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Ambient temperature TA SR -40 – 105 °C – Junction temperature TJ SR -40 – 115 °C – Storage temperature TST SR -40 – 125 °C – Voltage on power supply pin with respect to VSS VDD SR -0.3 – 6 V – Voltage on pins with respect to VSS VIN SR -0.3 – VDDP + 0.3 V Input current on any pin during overload condition IIN SR -5 – 5 mA – Absolute maximum sum of all input currents during overload condition ΣIIN SR – 25 mA –
Electrical characteristics and parameters
4.1.3 Pin Reliability in Overload
When receiving signals from higher voltage devices, low-voltage devices experience overload currents and voltages that go beyond their own IO power supplies specification. Table 3 defines overload conditions that will not cause any negative reliability impact if all the following conditions are met:
- full operation life-time is not exceeded
- Operating Conditions are met for - pad supply levels (VDDP) - temperature If a pin current is outside of the Operating Conditions but within the overload conditions, then the parameters of this pin as stated in the Operating Conditions can no longer be guaranteed. Operation is still possible in most cases but with relaxed parameters. Note: An overload condition on one or more pins does not require a reset. Note: A series resistor at the pin to limit the current to the maximum permitted overload current is sufficient to handle failure situations like short to battery. Table 3 Overload Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Input current on analog port pins during overload condition IOVA SR -3 – 3 mA Input current on any port pin during overload condition IOV SR -5 – 5 mA Absolute sum of all input circuit currents during overload condition IOVS SR – – 25 mA Figure 9 shows the path of the input currents during overload via the ESD protection structures. The diodes against VDDP and ground are a simplified representation of these ESD protection structures.
Electrical characteristics and parameters Figure 9 Input Overload Current via ESD structures Table 4 and Table 5 list input voltages that can be reached under overload conditions. Note that the absolute maximum input voltages as defined in the Absolute Maximum Ratings must not be exceeded during overload. Table 4 PN-Junction Characterisitics for Positive Overload Pad Type IOV = 5 mA Standard, High-current, AN/DIG_IN VAIN = VDD + 0.5 V VAREF = VDD + 0.5 V Table 5 PN-Junction Characterisitics for Negative Overload Pad Type IOV = 5 mA Standard, High-current, AN/DIG_IN VIN = VSS - (0.3 … 0.5) V VAIN = VSS - 0.5 V VAREF = VSS - 0.5 V Pn.y I OVx GND ESD Pad GND V DDP V DDP
Electrical characteristics and parameters
4.1.4 Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct operation and reliability of the IMC30xA. All parameters specified in the following tables refer to these operating conditions, unless noted otherwise. Table 6 Operating Conditions Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Ambient Temperature TA SR -40 – 105 °C Junction temperature TJ SR -40 – 115 °C Digital supply voltage1) VDDP SR 3.0 3.3 5.5 V All VDD pins need to be connected on the circuit board. Short circuit current of digital outputs2) ISC SR -5 – 5 mA Absolute sum of short circuit currents of the device2) ΣISC_D SR – – 25 mA For MCE peripheral pins Absolute sum of short circuit currents of the device3) ΣISC_D SR – – 25 mA For MCU peripheral pins 1 See also the Supply Monitoring thresholds Power-Up and Supply Threshold Characteristics. 2 Applicable for digital outputs. 3 See also section "Pin Reliability in Overload" for overload current definitions.
Electrical characteristics and parameters
4.1.5 Input / Output Characteristics
The table below provides the characteristics of the input/output pins of the IMC300. Note: These parameters are not subject to production test, but verified by design and/or characterization. Note: Unless otherwise stated, input DC and AC characteristics, including peripheral timings, assume that the input pads operate with the standard hysteresis. Table 7 Input / Output Characteristics (Operating Conditions apply) Parameter Symbol Values Unit Test Conditions Min. Max. Output low voltage on port pins VOLP CC – 1.0 V IOL = 11 mA (5 V) IOL = 7 mA (3.3 V) – 0.4 V IOL = 5 mA (5 V) IOL = 3.5 mA (3.3 V) Output low voltage on PWM outputs VOLP1 CC – 1.0 V IOL = 50 mA (5 V) IOL = 25 mA (3.3 V) – 0.32 V IOL = 10 mA (5 V) – 0.4 V IOL = 5 mA (3.3 V) Output high voltage on port pins VOHP CC VDDP - 1.0 – V IOH = -10 mA (5 V) IOH = -7 mA (3.3 V) VDDP - 0.4 – V IOH = -4.5 mA (5 V) IOH = -2.5 mA (3.3 V) Output high voltage on PWM outputs VOHP1 CC VDDP - 0.32 – V IOH = -6 mA (5 V) VDDP - 1.0 – V IOH = -8 mA (3.3 V) VDDP - 0.4 – V IOH = -4 mA (3.3 V) Rise/fall time on PWM outputs1) tHCPR, tHCPF CC – 9 ns 50 pF @ 5 V – 12 ns 50 pF @ 3.3 V Rise/fall time on standard pad tR, tF CC – 12 ns 50 pF @ 5 V – 15 ns 50 pF @ 3.3 V. Pin capacitance (digital inputs/outputs) CIO CC – 10 pF 1 Rise/Fall time parameters are taken with 10% - 90% of power supply.
Electrical characteristics and parameters Table 7 Input / Output Characteristics (Operating conditions apply) (continued) Parameter Symbol Values Unit Test Conditions Min. Max. Pull-up/-down resistor on port pins (if enabled in software) RPUP CC 20 50 kΩ VIN = VSSP Input leakage current 1) IOZP CC -1 1 µA 0 < VIN < VDDP, TA 105° C Maximum current per pin standard pin IMP SR -10 11 mA – Maximum current per PWM outputs pins IMP1A SR -10 50 mA – Maximum current into VDDP / out of VSS IMVDD / IMVSS SR – 260 mA 1 An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Electrical characteristics and parameters
4.1.6 Analog to Digital Converter (ADC)
The following table shows the Analog to Digital Converter (ADC) characteristics. This specification applies to all analog input as given in the pin configuration list. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 8 ADC Characteristics (Operating conditions apply)1) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Supply voltage range VDD SR 3.0 – 5.5 V Analog input voltage range VAIN SR VSSP- 0.05 – VDDP+ 0.05 V Conversion time tC12 CC – 1.0 1.6 μs Total capacitance of an analog input CAINT CC – – 10 pF Total capacitance of the reference input CAREFT CC – – 10 pF Sample time tsample CC – 200 – ns RMS noise ENRMS CC – 1.5 – LSB12 DNL error EADNL CC – ±2.0 – LSB12 INL error EAINL CC – ±4.0 – LSB12 Gain error EAGAIN CC – ±0.5 – % VDD = 3.3V Offset error EAOFF CC – ±8.0 – mV 1 All parameters are defined for the full supply voltage range if not stated otherwise.
Electrical characteristics and parameters
4.1.7 Power Supply Current
The total power supply current defined below consists of a leakage and a switching component. Application relevant values are typically lower than those given in the following tables, and depend on the customer's system operating conditions (e.g. thermal connection or used application configurations). Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 9 Power Supply parameter table; VDDP = 5V Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Active mode current motor control only IDDPWM CC − 15 40 mA MCE clock 48MHz MPU clock 1 – 48Mhz Active mode current motor control plus PFC IDDPFC CC − 19 40 mA IMC302A only Deep Sleep mode current1) IDDPDS CC − 0.54 − mA Both cores Wake-up time from Sleep to Active mode tSSA CC − 6 − cycles Wake-up time from Deep Sleep to Active mode tDSA CC − 290 − μsec
4.1.8 Flash Memory Parameters
Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 10 Flash Memory Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. Data Retention Time tRET CC 10 years Max. 100 erase / program cycles Erase Cycles2) NECYC CC 5x104 cycles Sum of page and sector erase cycles Total Erase Cycles NTECYC CC 2x106 cycles 1 CPU in sleep, peripherals clock disabled, Flash is powered down and code executed from RAM after wakeup. 2 Sum of page erase and sector erase cycles a page sees.
Electrical characteristics and parameters AC Parameters
4.2.1 Testing Waveforms
Figure 10 Rise/Fall Time Parameters Figure 11 Testing Waveform, Output Delay Figure 12 Testing Waveform, Output High Impedance V SS V DDP t R t F V DDP V DDP V DDP V SS Test Points V LOAD V +0.1 Timing Reference Points V LOAD -0.1 V V OH -0.1 V V OL +0.1 V
Electrical characteristics and parameters
4.2.2 Power-Up and Supply Threshold Characteristics
This chapter provides the characteristics of the supply threshold in IMC300. The guard band between the lowest valid operating voltage and the brownout reset threshold provides a margin for noise immunity and hysteresis. The electrical parameters may be violated while VDDP is outside its operating range. The brownout detection triggers a reset within the defined range. The prewarning detection can be used to trigger an early warning and issue corrective and/or fail-safe actions in case of a critical supply voltage drop. Note: These parameters are not subject to production test, but verified by design and/or characterization. Note: Operating Conditions apply. Table 11 Power-Up and Supply Threshold Parameters Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. VDDP ramp-up time tRAMPUP SR VDDP/ SVDDPrise – 107 μs VDDP slew rate SVDDPOP SR 0 – 0.1 V/μs Slope during normal operation SVDDP10 SR 0 – 10 V/μs Slope during fast transient within +/-10% of VDDP SVDDPrise SR 0 – 10 V/μs Slope during power-on or restart after brownout event SVDDPfall9) SR 0 – 0.25 V/μs Slope during supply falling out of the +/-10% limits10) VDDP prewarning voltage VDDPPW CC 2.1 2.25 2.4 V ANAVDEL.VDEL_SELECT = 00B 2.85 3 3.15 V ANAVDEL.VDEL_SELECT = 01B 4.2 4.4 4.6 V ANAVDEL.VDEL_SELECT = 10B 9 A capacitor of at least 100 nF has to be added between VDDP and VSSP to fulfill the requirement as stated for this parameter. 10 Valid for a 100 nF buffer capacitor connected to supply pin where current from capacitor is forwarded only to the chip. A larger capacitor value has to be chosen if the power source sink a current.
Electrical characteristics and parameters Table 11 Power-Up and Supply Threshold Parameters (continued) Parameter Symbol Values Unit Note or Test Condition Min. Typ. Max. VDDP brownout reset voltage VDDPBO CC 1.55 1.62 1.75 V calibrated, before user code starts running VDDP voltage to ensure defined pad states VDDPPA CC – 1.0 – V Start-up time from poweron reset tSSW CC − 260 – μs Time to the first user code instruction1) Start-up time to PWM on tPWMON CC 5.2 - 360 ms Time to PWM enabled Figure 13 Supply Threshold Parameters 1 This values does not include the ramp-up time. During startup firmware execution, MCLK is running at 48 MHz and the clocks to peripheral as specified in register CGATSTAT0 are gated. VDDP 5.0 V V DDPPW V DDPBO
Electrical characteristics and parameters
4.2.3 On-Chip Oscillator Characteristics
Table 12 provides the characteristics of the 96 MHz digital controlled oscillator DCO1. The DCO1 is used as the time base for peripherals during normal operation. The MCE core clock always runs at 48 MHz. The MCU core clock starts up at 48MHz but can be reduced to 32MHz, 16MHz or 1 MHz after startup. Note: These parameters are not subject to production test, but verified by design and/or characterization. Table 12 96 MHz DCO1 Characteristics Parameter Symbol Values Unit Test Conditions Min. Typ. Max. Nominal frequency fNOM CC - 96 - MHz under nominal conditions1) after trimming Accuracy with adjustment on XTAL as reference ΔfLTX CC -0.3 - +0.3 % with respect to fNOM (typ), TA from -40 °C to 105 °C Accuracy with adjustment algorithm 2) based on temperature sensor ΔfLTTS CC -0.6 - +0.6 % with respect to fNOM (typ), TA from 0 °C to 105 °C -1.9 - +1.0 % with respect to fNOM (typ), TA from -25 °C to 105 °C -2.6 - +1.3 % with respect to fNOM (typ), TA from -40 °C to 105 °C Accuracy ΔfLT CC -1.7 – 3.4 % with respect to fNOM(typ), TA from 0 °C to 85 °C -3.9 – 4.0 % with respect to fNOM(typ), TA from -40 °C to 105 °C Table 13 provides the characteristics of the 32 kHz digital controlled oscillator DCO2. The DCO2 is only used internally as a secondary clock source for the internal watchdog and as a fallback in case of failure of DCO1. Table 13 32 kHz DCO2 Characteristics Parameter Symbol Values Unit Test Conditions Min. Typ. Max. Nominal frequency fNOM CC 32.5 32.75 33 kHz under nominal conditions1) after trimming 1 The deviation is relative to the factory trimmed frequency at nominal VDDC and TA = + 25° C. 2 MCE version newer or equal to V1.03.00, clock adjustement algorithm for improved accuracy enabled.
Electrical characteristics and parameters Short term frequency deviation (over VDDC) ΔfST CC -1 – 1 % with respect to fNOM(typ), at 25° C Accuracy ΔfLT CC -1.7 – 3.4 % with respect to fNOM(typ), TA from 0 °C to 85 °C -3.9 – 4.0 % with respect to fNOM(typ), TA from -40 °C to 105 °C Motor Control Parameters The following parameters are defined in the iMOTIONTM Motion Control Engine (MCE) software.
4.3.1 PWM Characteristics
Table 14 PWM Carrier Frequency Characteristics
4.3.2 Current Sensing Characteristics
Table 15 Motor Current Sensing Characteristics Parameter Symbol Values Unit Condition Min. Typ. Max. Motor PWM frequency fPWM 5 16 40 kHz Ta=25 °C, VDD = nominal Parameter Symbol Values Unit Condition Min. Typ. Max. Input range IPWM VSS-0.05 - VDD+0.05 V Ta=25 °C, VDD = nominal Configurable analog gain 1/3/6/12 Itrip input range IPWMTRIP VSS-0.05 - VDD+0.05 V Itrip offset Accuraccy ±8 - mV REF Input capacitance CREFIU/V/W - - 10 pF External capacitance required on REFU,REFV, REFW
Electrical characteristics and parameters
4.3.3 Fault Timing
4.3.4 Analog Hall Sensing Characteristics
Table 17 Analog Hall Input Characteristics Parameter Symbol Values Unit Condition Min. Typ. Max. GK pulse width twGK 1 - - µs Ta = 25 °C, VDD = nominal GK input to PWM shutoff tGK - 1.3 - µs Motor Fault reset timing tRESET - 1.84 - ms fault reset command via UART to PWM reactivation Itrip to PWM shutoff tPWMOFF - 1.0 - µs single shunt configuration Itrip to PWM shutoff tPWMOFF - 1.0 - µs leg shunt configuration Parameter Symbol Values Unit Condition Min. Typ. Max. Input range VH VSS-0.05 - VDD+0.05 V Ta = 25 °C, VDD = nominal Comparator Offset VCMPOFF - +/-3 - mV Comparator Hysteresis ±15 - mV
Electrical characteristics and parameters Power Factor Correction (PFC) parameters The following parameters are defined in the iMOTIONTM Motion Control Engine (MCE) software.
4.4.1 Boost PFC characteristics
Table 18 PWM Carrier Frequency Characteristics
4.4.2 Totem Pole PFC characteristics
Table 19 PWM carrier frequency Characteristics
4.4.3 PFC current sensing characteristics
Table 20 PFC Current Sensing Characteristics
4.4.4 PFC Fault timing
Parameter Symbol Values Unit Condition Min. Typ. Max. PFC PWM frequency fPFC - 20 50 kHz Motor PWM frequency within specified range Parameter Symbol Values Unit Condition Min. Typ. Max. PFC PWM frequency fPFC - 20 50 kHz Motor PWM frequency within specified range Parameter Symbol Values Unit Condition Min. Typ. Max. Input range IPFC VSS-0.05 - VDD+0.05 V Ta=25 °C, VDD=nominal Configurable analog gain 1/3/6/12 Itrip input range IPFCTRIP VSS-0.05 - VDD+0.05 V Itrip offset ±3 - mV Input voltage difference > 200mV REF Input capacitance CREFIPFC - - 10 pF External capacitor required on IPFCREF Parameter Symbol Values Unit Condition Min. Typ. Max. Itrip to PFCPWM shutoff tPFCOFF - 1.18 - µs Motor Fault reset timing tRESET - 1.0 - ms Fault reset command via UART to PWM reactivation
Electrical characteristics and parameters Control Interface Parameters (MCE) IMC300 series provides the following communication interfaces. Note: These parameters are not subject to production test, but verified by design and/or characterization.
4.5.1 UART Interface
Table 22 Electrical Characteristics Figure 15 UART Timing
4.5.2 Over Temperature Input
The over temperature input can be used to continuously monitor an external temperature sensor like an NTC. Specific type of NTC has to be used. Refer to the MCE Reference Manual for details. Table 23 Over temperature input Parameter Symbol Values Unit Condition Min. Typ. Max. UART baud rate 1200 57600 - BPS UART mode - 8-N-1 - Data-parity-stop bit UART sampling filter period TUARTFIL - 1/16 - TBAUD Parameter Symbol Values Unit Condition Min. Typ. Max. Over temperature input threshold VOT 0.1 1.0 3.0 V VDD = 3.3V, configurable parameter e.g. via MCEDesigner, default = 1.0V Over temperature to PWM shutdown tot - 1.0 2.1 ms TXD RXD Start Bit Data and Parity Bit T BAUD Stop Bit T UARTFIL
Electrical characteristics and parameters
4.5.3 Pulse Output
The IMC300 series provide an optional PGOUT pin pulse output. The pulse frequency is proportional to motor revolution. Refer to the MCE software reference manual for details. Table 24 Pulse Output
4.5.4 LED Output
The IMC300 series provide an output that can be connected to an LED to give a visual indication of the status of the motor drive. Table 25 LED Output Parameter Symbol Values Unit Condition Min. Typ. Max. Pulse per revolution PPR 4 - 24 PPR Pulse duty cycle tPPR - 50 - % Parameter Symbol Values Unit Condition Min. Typ. Max. Fault to LED delay tLEDFAULT - 53 - ms Fault reset to LED delay tLEDRESET - 1.84 - ms LED blinking frequency fLED 1 1000 Hz LED blinking duty cycle tLED 5 95 %
5 Quality Declaration
Table 26 Quality Parameters Parameter Symbol Values Unit Condition Min. Max. ESD susceptibility according to Human Body Model (HBM) VHBM SR - 2000 V Conforming to ANSI/ESDA/JEDEC JS-001 ESD susceptibility according to Charged Device Model (CDM) pins VCDM SR - 500 V Conforming to ANSI/ESDA/JEDEC JS-002 Moisture sensitivity level MSL CC - 3 - JEDEC J-STD-020D Soldering temperature TSDR SR - 260 °C Profile according to JEDEC J- STD-020D
Device and Package Specification
6 Device and Package Specification
The table below gives the IDs for the individual devices in the IMC300 family. Depending upon the mode either the SBSL-ID (secure boot loader) or the Chip-ID should be used to identify the device. Both cores of the IMC300 family have a dedicated Chip-ID. The MCE core is programmed via a secure loader using the SBSL-IDs as given below. For details refer to the iMOTION™ Programming Manual. Table 27 SBSL and Chip IDs Product Type Core Chip-ID SBSL-ID IMC301A-F048 MCE 0x1B010006 0x026add3f080ad5abfb67af2271ea4973 ARM® Cortex®-M0 0x13011006 - IMC301A-F064 MCE 0x1B01000B 0x0207810c349410e8be51722b81520cf8 ARM® Cortex®-M0 0x1301100B - IMC302A-F048 MCE 0x1B020006 0x024747b4b61060cf95f7b14a05b1decc ARM® Cortex®-M0 0x13021006 - IMC302A-F064 MCE 0x1B02000B 0x0216ebe1d4cc0767684bacceefae29b2 ARM® Cortex®-M0 0x1302100B -
Device and Package Specification Package Drawings
6.2.1 PG-LQFP-48-11
Device and Package Specification
6.2.2 PG-LQFP-64-29
Device and Package Specification Thermal Characteristics Table 28 Package Thermal Characteristics Note: For electrical reasons, it is required to connect the exposed pad to the board ground VSSP, independent of EMC and thermal requirements. When operating the IMC300 in a system, the total heat generated in the chip must be dissipated to the ambient environment to prevent overheating and the resulting thermal damage. The maximum heat that can be dissipated depends on the package and its integration into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The power dissipation must be limited so that the average junction temperature does not exceed 115° C. The difference between junction temperature and ambient temperature is determined by ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA The internal power consumption is defined as PINT = VDD × IDDP (switching current and leakage current). The static external power consumption caused by the output drivers is defined as PIOSTAT = Σ((VDD - VOH) × IOH) + Σ(VOL × IOL) The dynamic external power consumption caused by the output drivers (PIODYN) depends on the capacitive load connected to the respective pins and their switching frequencies. If the total power dissipation for a given system configuration exceeds the defined limit, countermeasures must be taken to ensure proper system operation: Reduce VDD, if possible in the system Reduce the system frequency Reduce the number of output pins Reduce the load on active output drivers
1 Device mounted on a 4-layer JEDEC board (JESD 51-5); exposed pad of VQFN soldered
Parameter Symbol Values Unit Condition Min. Max. Thermal resistance Junction- Ambient1) RΘJA CC - 66.7 K/W PG-LQFP-64-26 - TBD K/W PG-LQFP-48-26
Device and Package Specification Part Marking Figure 18 Part Marking IMC100 Pr isma graphi cs rev 2.vsdm_mar king I M C 302 A F 064 X X X X X Manufacturer Part number Lot number or -code
Revision history
Date of release Description of changes 1.2 2020-10-20 Table 1 (Pin List) updated. 1.1 2020-5-11 Figure and table numbers updated. Table 1 (Pin List) updated. Pin configuration drawings updated. Added DCO accuracy with calibration. Increased max. motor PWM frequency up to 40 kHz. Application schematics drawings in section 3 updated. Section 5 (Quality Declaration) updated. 1.0 2019-12-12 Initial version
81726 Mü nchen, Germany
© 2021 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”) . With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of cu stomer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies o ffice (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. Edition 2020-10-20 Trademarks of Infineon Technologies AG µHVIC™, µIPM™, µPFC™, AU-ConvertIR™, AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolDP™, CoolGaN™, COOLiR™, CoolMOS™, CoolSET™, CoolSiC™, DAVE™, DI-POL™, DirectFET™, DrBlade™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, GaNpowIR™, HEXFET™, HITFET™, HybridPACK™, iMOTION™, IRAM™, ISOFACE™, IsoPACK™, LEDrivIR™, LITIX™, MIPAQ™, ModSTACK™, my -d™, NovalithIC™, OPTIGA™, OptiMOS™, ORIGA™, PowIRaudio™, PowIRStage™, PrimePACK™, PrimeSTACK™, PROFET™, PRO -SIL™, RASIC™, REAL3™, SmartLEWIS™, SOLID FLASH™, SPOC™, StrongIRFET™, SupIRBuck™, TEMPFET™, TRENCHSTOP™, TriCore™, UHVIC™, XHP™, XMC™ Trademarks updated November 2015 Other Trademarks All referenced product or service names and trademarks are the property of their respective owners. owners.