ILX547K

ILX547K SONY | Alldatasheet

Document overview

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• PDF pages: 11

Technical content

Features

• Number of effective pixels: 8100 pixels (2700 pixels
• 3)
• Pixel size: 8µm · 8µm (8µm pitch)
• Distance between line: 32µm (4 lines)
• Maximum data rate: 6MHz (2MHz · 3)
• Built-in clamp circuit
• Low lag/High sensitivity
• Single 5V power supply
• Input clock pulse: CMOS 5V drive
• Number of output: 3 (R, G, B)
• Package: 22 pin Plastic DIP (400mil) Absolute Maximum Ratings
• Supply voltage V DD 6V
• Operating temperature –10 to +60 °C
• Storage temperature –30 to +80 °C Pin Configuration(Top View) Block Diagram – 1 – E99908-PS Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. ILX547K 22 pin DIP (Plastic) Amplifier (R) φCLP VOUT (B) VOUT (G) VOUT (R) VREF VDD φRS GND φROG Sensor (R) ROG driver CCD analog shift register (R) Reset out gate (R) Amplifier (G) Amplifier (B) /#06 /#08 /#06 Sensor (G) CCD analog shift register (G) Reset out gate (G) /#03/#04/#04/#07 Sensor (B) CCD analog shift register (B) Reset out gate (B) Timing generator 1920 1 22VREF 2VOUT (G) 3GND 4NC 5NC 6NC 7NC 8NC 9NC 10NC 12φROG VOUT (R) VOUT (B) VDD φRS NC NC NC NC NC 2700 2700 G B2700

– 2 – ILX547K Unit pF pF pF Max. Typ. 900 Min. Symbol C f 1, Cf2 C fRS C fROG Item Input capacity of f1, f2 Input capacity of fRS Input capacity of fROG Input Pin Capacity Unit MHz Max. Typ. Min. Symbol ff1, ff2, ffRS Item Item Frequency of f1, f2, fRS Clock Frequency Unit V Max. 5.25 Typ. Min. 4.75 Item VDD Recommended Supply Voltage Unit V V Max. 5.25 0.1 Typ. 5.0 Min. 4.75 High level Low level f1, f2, fRS, fROG pulse voltage Input Clock Pulse Voltage Pin Description Pin No. Symbol Description V REF VOUT (G) GND NC NC NC NC NC NC NC fROG Reference voltage Signal output (G) GND NC NC NC NC NC NC NC Clock pulse input Pin No. Symbol Description NC NC NC NC NC fRS V DD VOUT (B) VOUT (R) Clock pulse input Clock pulse input NC NC NC NC NC Clock pulse input Power supply Signal output (B) Signal output (R)

– 3 – ILX547K Unit V mV mV mA Ω V Remarks Note 3 Note 4 Note 8 Max. 7.6 9.2 6.5 Typ. 5.6 6.8 4.8 1.5 0.27 0.22 0.31 0.5 9.5 430 3.6 Min. 3.6 4.4 3.1 1.2 0.16 0.13 0.19 Symbol R R R G R B PRNU VSAT SE R SE G SE B VDRK DSNU IL I VDD TTE Zo V OS Item Sensitivity nonuniformity Saturation output voltage Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Electrooptical Characteristics(Note 1) (Ta = 25°C, V DD = 5V, ffRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of the signal level of the optical black pixels. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT (G) = 500mV (Typ.) PRNU = · 100 [%] Where the 2700 pixels are divided to blocks of 150, R, G and B pixels, respectively. The maximum output of each block is set to VMAX , the minimum output to VMIN and the average output to VAVE . 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = Where R indicates RR , RG , RB, and SE indicates SER , SEG , SEB. 6. Optical signal accumulated time t int stands at 10ms. 7. VOUT (G) = 500mV (Typ.) 8. Vos is defined as indicated bellow. VOUT indicates VOUT (R), VOUT (G) and VOUT (B). (VMAX – VMIN )/2 VAVE VSAT R Sensitivity Saturation exposure Red Green Blue Red Green Blue V/(lx · s)Note 2 lx · s Note 5 Note 6 Note 6 Note 7 VO S VO U T G N D /#07/#05/#08/#05 /,/#01

– 4 – ILX547K Clock Timing Chart 1 φR O G φR S VO U T D12 D13 D14 D60 D61 D62 S2698 S2699 D2700 D63 D64 2764 /#04/#05 /#04/#05 /#01 /#06/#07 /,/#03 /#05 /#01/#03/#04 /#04/#05 /#02/#05 O ptical black (48 pixels) D um m y signal (62 pixels) Effective picture elem ents signal (2700 pixels) 1-line output period (2764 pixels) N ote) The transfer pulses (φ1, φ2) m ust have m ore than 2764 cycles.

– 5 – ILX547K Clock Timing Chart 2 φR O G t4 t5 t7t6 Clock Timing Chart 3 VO U T φR S t12 t13 t11t10 t6t7 /#01 /#01 /#02 /#03 /#03 /#04 /#04 /#05 /#05 /#06 /#06 /#07 /#07 /#08 /#01

– 6 – ILX547K Clock Pulse Recommended Timing Unit ns ns ns ns ns ns ns ns ns ns ns ns ns Max. Typ. 100 1000 1000 250* 250*1 130 Min. 800 800 Symbol t10 t11 t12 t13 Item fROG, f1 pulse timing fROG pulse high level period fROG, f1 pulse timing fROG pulse rise time fROG pulse fall time f1 pulse rise time/f2 pulse fall time f1 pulse fall time/f2 pulse rise time fRS pulse high level period fRS, f1 pulse timing fRS pulse rise time fRS pulse fall time Signal output delay time 1 These timing is the recommended condition under ffRS = 1MHz.

– 7 – ILX547K Application Circuit* 1VREF 2VOUT (G) 3GND 4NC 5NC 6NC 7NC NC 9NC 10NC 20 19 18 16 φROG VOUT (R) VOUT (B) VDD φRS NC NC NC NC NC 2ΩBuffer1 100Ω INBuffer1: IC 1: 74AC 04 5VBuffer1 0.1µF 47µF/16V 10µF/16V VO U T (G ) 2SK523 O U T 1.5kΩ φR S VO U T (B) Buffer1 VO U T (R ) ∗ D ata rate fφR S = 1M H z 100Ω IC 1 φR O G IC 1 1517 2122 14 13 12 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

– 8 – ILX547K Example of Representative Characteristics(VDD = 5V, Ta = 25°C) W avelength [nm ] R elative sensitivity 550 600 650400 0.2 0.4 0.6 0.8 1.0 450 500 700 Spectral sensitivity characteristics (Standard characteristics) D ark voltage rate vs. A m bient tem perature (Standard characteristics) O utput voltage rate vs. Integration tim e (Standard characteristics) O ffset level vs. Supply voltage (Standard characteristics) O ffset level vs. A m bient tem perature (Standard characteristics) Ta – Am bient tem perature [°C ] D ark voltage rate 30 40 50–10 00.1 100 10 20 60 Ta – Am bient tem perature [°C ] Vos – O ffset level [V] 20 30 40 50–100 0 10 60 VD D – Supply voltage [V] Vos – O ffset level [V] 54.75 5.25 τ int – Integration tim e [m s] O utput voltage rate 510.1 ∆Vos ∆VD D 0.8 ∆Vos ∆Ta –1m V/°C

– 9 – ILX547K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1)Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2)Shearing strength: 29N/surface (3)Tensile strength: 29N/surface (4)Torsional strength: 0.9Nm b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1)Applying repetitive bending stress to the external leads. (2)Applying heat to the external leads for an extended period of time with soldering iron. (3)Rapid cooling or heating. (4)Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5)Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. Plastic portion C over glass 39N C eram ic portion Adhesive (1) 29N (3) 0.9N m (4) 29N (2) /,/#01/#02/#04/#05 /#06/#07 /#08 /,/#01/#02/#04 /#05/#07/#08 /,/#01 /,/#01 /#01 /#03 /#05/#07/#08 /,/#01 /,/#01 /#01/#02/#04 /#07/#08 /,/#01 /,/#01

– 10 – ILX547K 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.

– 11 – ILX547K Package Outline Unit: mm PAC KAG E STR U C TU R E PAC KAG E M ATER IAL LEAD TR EATM EN T LEAD M ATER IAL PAC KAG E M ASS D R AW IN G N U M BER Plastic , C eram ic G O LD PLATIN G

42 ALLO Y

2.21g H V 1 11 1222 0º to 9º 32.0 ± 0.3 10.0 ± 0.3 0.25 2.54 5.0 ± 0.3 10.16 0.51 6.8 ± 0.3 21.6 (8µm X 2700Pixels) 9.0 30.6 2.10 2.80 ± 0.5 4.0 ± 0.5 N o.1 Pixel (G reen) 0.3 M 22pin D IP(400m il) LS-D 8-01(E) 1. The height from the bottom to the sensor surface is 1.61 ± 0.3m m . 2. The thickness of the cover glass is 0.7m m , and the refractive index is 1.5.