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Power Management & Multimarket Datasheet Revision 1.0, 2015-04-08 ILD2111 Digital DC/DC Buck Controller IC
Datasheet 2 Revision 1.0, 2015-04-08 Digital DC/DC Controller with I-Set Product highlights Assumes control of functionality where a microcontroller is requi red in conventional systems Device configurable by a comprehensive parameter set High efficiency over wide input and output ranges High accuracy of +/ -5% over output current range and useful temperature
Features
Hysteretic current regulation Output current adjustable in up to 16 steps with a dynamic range of 1:4 between min . and max. configurable by an external resistor Flicker-free and phase -aligned PWM dimming based on input PWM signal Fully configurable i nternal and e xternal smart overtemperature protection Open/short load protection Overpower protection
Applications
LED drivers, e.g . 2 -stage professional lighting systems Integrated electronic control gear for LED luminaires
Description
The ILD2111 is a high -performance microcontroller-based digital DC/DC buck LED controller, design ed as a constant current source . The driving current is adjustable with a simple external resistor. Flicker-free dimming supported by means of phase -aligned PWM LED current . An ASSP digital microcontroller-based engine is highly configurable using a comprehensive parameter set to provide fine tuning of operatio n and protection features. High-precision hysteretic output current regulation is achieved thanks to the digital control loops. Figure 1. Typical Application
Datasheet 3 Revision 1.0, 2015-04-08 Table of Contents
1 Pin Configuration and Description
The pin configuration is shown in Figure 2 and Table 1-1. The pin functions are described later. Figure 2. Pin Configuration appropriate passive temperature sensor. serial communication interface. Current measurement on an external shunt resistor. Output for directly driving a power MOS. sensing and current limitation. Input for PWM-based dimming signal.
2 Block Diagram
The block diagram of ILD2111 is shown in Figure 3. Figure 3. Block Diagram
Datasheet 6 Revision 1.0, 2015-04-08
3 Functional Description
The functional description provides an overview of the integrated functions and features , and their relationship. The parameters and equations provided are based on typical values at T A = 25°C. The corresponding minimum and maximum values are shown in Section 4, Electrical Characteristics.
3.1 Introduction
The ILD2111 is a high -performance digital microcontroller-based DC/DC buck LED controller designed as a constant current source with hysteretic output current regulation. The c ontroller typically uses a floating buck topology operating in a Continuous Conduction Mode (CCM). In order to reduce switching losses and increase efficiency, as well as to control the switching frequency over a wide variety of external component values , input voltage and load variations, a frequency ripple control is introduced. Both internal and external temperature measurements are implemented and accompanied with an intelligent temperature protection algorithm with two threshold values. The controller utilizes a variety of protection features , including overpower, open and short load conditions. The ILD2111 is a dimmable device controll ed by an external PWM signal. The device can be parameterized by means of a single pin UART interface at the REF/SC pin (see Section 3.9). A c omplete top-level device operation process , including protection and error handling , is shown in Figure 4. Table 3-1 shows device operating statuses, buck statuses associated with the buck state machine, as well as error and associated error codes. The buck state machine diagram is shown in Figure 5.
Datasheet 7 Revision 1.0, 2015-04-08 Power-up reset Hardware initialization Applying parameter patches Temperature protection initialization Parameters CRC? YES NO Reference current set UART initialization VIN_MIN_START < VIN < VIN_MAX_START NO T>T_critical Buck operation initialization and START Startup delay Process UART communication NO YES YES Parameters Consistency? YES NO T_hot < T < T_critical NO YES Set internal PWM duty to parameter value OPER_STATUS = OPER_ERR ERR_STATUS = ERR_PARAM_EMPTY OPER_STATUS = OPER_ERR ERR_STATUS = ERR_PARAM_DATA OPER_STATUS = OPER_OFF ERR_STATUS = ERR_NONE BUCK_CONTROL = BUCK_OFF OPER_STATUS = OPER_STARTUP buck_oper_loop_delay for error restart phases: Delay = 0 – for first start, after HOT and COLD restart and after input undervoltage error. Delay = ERR_RESTART_TIME – after following errors: output undervoltage, output overvoltage, output overpower, open output and input overvoltage BUCK_CONTROL = BUCK_STARTUP ERR_STATUS = ERR_INPUV or ERR_INPOV ERR_STATUS = ERR_OTI or ERR_OTE Parameters: ITP_STARTUP_PWM_HOT or ETP_STARTUP_PWM_HOT OPER_STATUS = OPER_RUN BUCK_CONTROL = BUCK_SOFTSTART Copy OTP to RAM with CRC check and start FW Copy default parameters from OTP to RAM Executed from ROM code
Datasheet 8 Revision 1.0, 2015-04-08 Process UART communication VIN_MIN_OPER < VIN < VIN_MAX_OPER NO Process EPWM measurement Open output? Process Buck state machine OCP2 level? NO NO YES YES YES Average check? NO YES Apply delay (event_counter) Delay(1) = 100 µs Delay(2) = 500 µs Delay(3) = 2500 µs Delay(4+) = OCP2_RESTART_DELAY Restart hardware PWM engine VOUT_MIN < VOUT < VOUT_MAX NO Process temperature dimming POUT < POUT_MAX_LC or POUT_MAX_HC T > T_critical NO NO YES Process Calculations and Compensations YES YES OPER_STATUS = OPER_ERR ERR_STATUS = ERR_INPUV or ERR_INPOV OPER_STATUS = OPER_ERR ERR_STATUS = ERR_OPEN One averaging interval is 16 Buck PWM switching cycles OPER_STATUS = OPER_ERR ERR_STATUS = ERR_OUTUV or ERR_OUTOV OPER_STATUS = OPER_ERR ERR_STATUS = ERR_PWR OPER_STATUS = OPER_ERR ERR_STATUS = ERR_OTI or ERR_OTE
Figure 4. Device Operating Flowchart
Datasheet 10 Revision 1.0, 2015-04-08 Operating statuses are presented in Table 3-1 below. Table 3-1. Device Operating Statuses Status Value Description OPER_STATUS OPER_OFF 0000H Off - initial buck state OPER_STARTUP 0001H Startup - Vin & temperature checking OPER_RUN 0002H Run OPER_ERR 0004H Stopped by error OPER_STOP 0008H Stopped by UART command ERR_STATUS ERR_NONE 0000H No errors ERR_INPUV 0001H Input undervoltage ERR_INPOV 0002H Input overvoltage ERR_OUTUV 0004H Output undervoltage ERR_OUTOV 0008H Output overvoltage ERR_PWR 0010H Output overpower ERR_OPEN 0020H Output open ERR_OCP 0040H OCP2 level detection ERR_OTI 0080H Overtemperature internal sensor ERR_OTE 0100H Overtemperature external sensor ERR_PARAM_EMPTY 0400H Default parameter block empty ERR_PARAM_DATA 0800H Default parameter block checksum error ERR_MODE ERR_MODE_LATCH Error handling latch ERR_MODE_RESTART Error handling auto restart ERR_MODE_OFF Error handling is off ERR_MODE_NOP Error handling does not affect auto restart counter BUCK_STATUS 1) BUCK_OFF Buck is off BUCK_STARTUP Buck is in start -up phase (initialized, waiting for start-up condition, i.e. voltage and temperature) BUCK_SOFTSTART Buck is in soft -start phase (implements increasing current slope until reaching reference current) BUCK_SHUTDOWN Buck is in shutdown phase (implements current decreasing slope) BUCK_EXE_OFF Buck is executing off, buck operation stopped BUCK_ERRC Buck in error state (generate small error current) BUCK_ON 2) Buck is on (normal operation, default state of operation) During normal operation , in addition to the aforementioned operations, the following actions will be executed: − Open-output processing − Output current PWM dimming processing − VCC / internal temperature measurement and processing − External temperature measurement and processing − OCP1 - peak current processing − OCP2 - peak current processing − EPWM measurement and processing − PI regulator processing − Input over- and undervoltage processing − Output over- and undervoltage processing − Output overpower processing 1) See buck state machine in Figure 5. 2) The number of averaged buck cycles for steady-state operation, where calculations and protections are handled, is defined by the constant Buck_steady_delay (see Table 3-14).
Figure 5. Buck State Machine
3.2 Main Supply (VCC)
3.3 Controller Features
Table 3-2 gives an overview of the controller features that are described in the referenced sections.
3.3.1 Configurable Leading Edge Blanking (LEB) and Sampling Time at Pin CS
sampling at the moment when no spikes are present. Figure 6. Configurable Leading Edge Blanking Time at Pin CS
3.3.2 Configurable Gate Driver Output
correspond to different gate driving currents. The slope is proportional to the current. Figure 7. Configurable Gate Driver Output
3.3.3 Reference Current Setup
output protection recovery – see Section 3.6.4. from the predefined I-set table. Figure 8. Charging and Discharging of the C_ref Capacitance Depending on the Switch State suppress noise for ADC measurement as well as UART communication.
Figure 9. C_ref Discharging Interval Determined by the Reference Resistor Value their tolerances must provide unique thresholds in order to be detected appropriately (see Figure 10). More accurate equations will be obtained if typical component tolerance values are included.
Figure 10. Time Constant vREF_TIME_n Threshold Calculations and based on that, it will be determined which reference resistor is detected, hence reference output current . current from the range should not exceed 1000 mA.
Datasheet 16 Revision 1.0, 2015-04-08 The components (R_iset, C_r ef) must be carefully selected to avoid overlap ping time intervals, because in that case an appropriate threshold could not be calculated to provide unique detection. For example, if the resistance values are too close (including tolerances) , discharge tim e intervals will overlap, and calculated thresholds will be set inside the overlapped area. Therefore it cannot be guarantee d that the s ame current will be selected across different IC production series and external component tolerances. Reference current determination only takes place during the initial chip startup and after the load has been disconnected - open output is detected. During normal buck operation, the REF/SC pin can be used as a communication port. Example For typical application s, which cover – for example – the outputs ranging from 250 mA to 800 mA ( in 50 mA steps), reference resistor values for the spe cific current values (assuming C_ref = 10 nF and threshold voltage value of V_adc_th = 0.6075 V) are given in Table 3-3. Resistors from the series E96 with a variation (tolerance) of 1% are used . The r eference pin serial resistor is R_ref_sc = 3.3 kΩ. The r ecommended capacitor C_ref tolerance should be ≤ 5%1. The recommended C_ref capacitor type is a zero-drift CoG (NPO). Table 3-3. Reference Resistor Values Example Ordinal number I_ref_n [mA] R_iset_n [kΩ] vREF_TIME_n [µs] 1 800 2.15 70 2 750 10.00 180 3 700 15.00 280 4 650 21.50 430 5 600 33.20 610 6 550 43.20 780 7 500 53.60 950 8 450 63.40 1110 9 400 71.50 1270 10 350 82.50 1430 11 300 90.90 1580 12 250 100.00 1860 Although, typically, the application uses less than 16 reference currents, all parameters (Ref_current_01- Ref_current_16, see Table 3-12) must be filled (arranged) in 4 groups, using copies with the same reference current. It is assumed that approximately the same currents have approximately the same parameters. Thereafter, all appropriate reference time thresholds (Reference_time_01 – Reference_time_16) will be automatically allocated to the groups (see Table 3-19). Each group consists of four consecutive currents and each group is associated with the unique set of FRC parameters . The currents from the same group will have the same minim um and maximum switching frequency limit s and minim um and maximum current ripple limits as well (see Table 3-20). One possible arrangement is given below in Table 3-4. 1 For different component tolerances, different discharge times will be obtained by equations. The resistor values in Table 3-3 are given as examples . The number of different reference resistor values must match the number of different reference currents. For different applications (different output currents and output power), different values of the external resistors can be taken.
Datasheet 17 Revision 1.0, 2015-04-08 Table 3-4. Reference Current Arrangement Group number Reference Currents 1. 800 mA, 750 mA, 700 mA 2. 650 mA, 600 mA, 550 mA 3. 500 mA, 450 mA, 400 mA 4. 350 mA, 300 mA, 250 mA
3.3.4 Output Current Control and Measuring
The o utput current is measured at the CS pin by means of an external shunt resistor. The c ontroller, using floating buck topology, operates in a Continuous Conduction Mode (CCM) and is realized as a hysteretic current controller. The a verage output current is regulated using minimum and maximum current s (IMAX and IMIN, see Figure 11). Maximum and minimum current values are defined with respect to allowed output current ripple. The maximum current is set as a true analog comparator threshold value using an internal DAC. The minimum current value is regulated by the internal PI regulator controlling TOFF time. When the MOSFET is turned on, T ON is approximately given as follows (all resistances and voltage drops of used components are neglected): 𝑇𝑂𝑁 = (𝐼𝑀𝐴𝑋 − 𝐼𝑀𝐼𝑁) ∙ 𝐿𝐸𝑋𝑇 𝑉𝐼𝑁−𝑉𝑂𝑈𝑇 = 𝐼𝑅𝐼𝑃𝑃𝐿𝐸 ∙ 𝐿𝐸𝑋𝑇 𝑉𝐼𝑁−𝑉𝑂𝑈𝑇 . (10) When the MOSFET is turned off, T OFF is approximately given as follows (all resistances and voltage drops of used components are neglected): 𝑇𝑂𝐹𝐹 = (𝐼𝑀𝐴𝑋 − 𝐼𝑀𝐼𝑁) ∙ 𝐿𝐸𝑋𝑇 𝑉𝑂𝑈𝑇 = 𝐼𝑅𝐼𝑃𝑃𝐿𝐸 ∙ 𝐿𝐸𝑋𝑇 𝑉𝑂𝑈𝑇 . (11) where VIN and VOUT are the input and output voltages respectively and LEXT is the buck inductance. Therefore, the switching frequency of the buck cycle can be rendered as: 𝑓𝑆𝑊 = 𝑇𝑂𝑁+𝑇𝑂𝐹𝐹 𝐼𝑅𝐼𝑃𝑃𝐿𝐸∙𝐿𝐸𝑋𝑇∙( 1 𝑉𝐼𝑁−𝑉𝑂𝑈𝑇 + 1 𝑉𝑂𝑈𝑇 . (12)
number (Gain) to obtain appropriate behavior regarding response and stability of the output current.
3.3.5 Current Startup, Soft-Start and Shutdown Control
VCC voltage), within the operating range and stable. buck converter will start with a 100% current, and without soft-start. Softshutdown_curr_step or tCSDS = Softshutdown_time_step). Figure 13. Soft-Start and Soft Shutdown Definitions
maximum. Two options for implementing a suitable system are described below.
3.4.1 Fixed Current Ripple
around the output voltage V OUT = V IN/2. The m aximum switching frequency should not exceed 250 kHz. Examples for three different current values are shown in Figure 14. Figure 14. Switching Frequency vs. Output Voltage for Constant Output Current Ripple Iripple = 30 %
3.4.2 Frequency and Ripple Control
FRC passes, before being considered steady, is defined by the constant FRC_pass_oper_th (see Table 3-20). Figure 15. FRC Operating Area group have the same switching frequency and current ripple limits, as explained in Section 3.3.3. 1) Curr_ripple_perc – Initial (starting) current ripple (in percentage form). value, Iripple_min in mA, not in percentage form). value, Iripple_max in mA, not in percentage form).
Datasheet 22 Revision 1.0, 2015-04-08 An example is provided below for better understanding. The following parameters apply in this example for I OUT = 350 mA: 1. Iripple_init = 30% (or 105 mA) – Initial starting current ripple. 2. Iripple_min = 25% (or 87.5 mA) – Minimum allowed current ripple. 3. Iripple_max = 50% (or 175 mA) – Maximum allowed current ripple. 4. fsw_min = 100 kHz (or TPWM_max = 1/fsw_min = 10 µs) – Minimum allowed switching frequency. 5. fsw_max = 150 kHz (or TPWM_min = 1/fsw_max = 6.67 µs) – Maximum allowed switching frequency. The Frequency Ripple Control algorithm works as following: The s ystem begins to operate with the defined ripple , which is given as a percentage of the average current (e.g. I ripple_init = 30% I OUT). This value is used to calculate the maximum (adding the half-ripple value to the reference current value) and minimum (subtracting the half-ripple value to the reference current value) hysteretic currents. There are several possible cases depending on the output voltage: 1) If the achieved operating frequency is within allowed borders (defined by fsw_min and fsw_max), and the starting value of the ripple is within allowed absolute ripple borders (defined by Iripple_min and Iripple_max), no correction will be performed (e.g. Vout = 10 V – orange curve, operating point B is in the operating area, B=B’, see Figure 16). 2) If the achieved operating frequency is ab ove the maximum allowed switching frequency f sw_max (e.g. Vout = 15 V – grey curve, point C; V out = 20 V – yellow curve, point D), the firmware will start to slowly increase the ripple in order to lower the operating frequency (the slope of this increasing ripple depends on the buck inductance LEXT, see equation (12) on page 17). It will continue increasing the ripple until the frequency falls below the high threshold fsw_max (corrected points C’ and D’, see Figure 16). 3) If the achieved operating frequency is above the maximum allowed switching frequency f sw_max (e.g. Vout = 25 V – dark blue curve, point E ; Vout = 30 V – green curve, point F), the firmware will start to slowly increase the ripple in order to lower the operating frequency (the slope of this increasing ripple depends on the buck inductance LEXT, see equation (12) on page 17). It will continue increasing the ripple until it hits its maximum allowed value I ripple_max. The switching frequency will be determined by Iripple_max and could be outside the predefined borders (corrected points E’ and F’, see Figure 17). 4) If the achieved operating frequency is below the minimum allowed switching frequency f sw_min (e.g. Vout = 5 V – blue curve, point A), the firmware will start to slowly decrease the ripple in order to raise the operating frequency ( the slope of this decreasing ripple depends on the buck inductance LEXT, see equation (12) on page 17). It will continue decreasing the ripple until the frequency reaches the low threshold value defined by the parameter fsw_min, or if the ripple hits the minimum allowed value defined by the parameter Iripple_min. In this case, the switching frequency could be outside the predefined borders (corrected point A’, see Figure 17).
Figure 16. FRC Algorithm Example – Operating Point successfully put into Operating Area
Figure 17. FRC Algorithm Example – Operating Point is outside the Predefined Borders
Figure 20. 350 mA FRC Scheme the ripple will increase accordingly. ripple (30% of Iout). The switching frequency will be changed accordingly (not valid for 800 mA). by the TOFF and Iripple values and external hardware components. FRC) and can be outside the defined limits. point into the operating area, but its final position will depend on the other criteria that affect its position.
Figure 21. Operating Point determined by Toff_min criteria
3.5 Input Voltage Measurement and Calibration
the converter switching operation. The measurement circuit is shown in Figure 22 below. Figure 22. Input Voltage Measurement Schematic 1) Current range 00b => IMEAS = 209 µA, RSHUNT = 6690 Ω. 2) Current range 01b => IMEAS = 1.6 mA, RSHUNT = 1490 Ω. The current range is defined by the parameter Vin_current_range (see Table 3-8). voltage (bus voltage), power dissipation needs to be considered as part of system losses. For more details, see the examples below.
Datasheet 29 Revision 1.0, 2015-04-08 Examples: 1) If the maxim um bus voltage is high, e.g. VINMAX = 5 00 V, the current measurement range (209 µA) should be chosen to minimize power dissipation over R_vin. The value of the external resistor R_vin is obtained from the equation below (209 µA would ideally be full scale at the ADC; to achieve accurate measurement over the production spread of ILD2111, use a margin factor of 75%). Therefore, 𝑅_𝑣𝑖𝑛 = 𝑉𝐼𝑁𝑀𝐴𝑋 0.75∙𝐼209µ𝐴 − 𝑅𝑆𝐻𝑈𝑁𝑇 = 3.18 MΩ. (14) 2) If the maximum bus voltage is lower, e.g. VINMAX = 80 V, the current measurement range (1.6 mA) should be chosen. Therefore, 𝑅_𝑣𝑖𝑛 = 𝑉𝐼𝑁𝑀𝐴𝑋 0.75∙𝐼1.6𝑚𝐴 − 𝑅𝑆𝐻𝑈𝑁𝑇 = 65.2 kΩ. (15)
Datasheet 30 Revision 1.0, 2015-04-08
3.6 Protection Features
Table 3-5 gives an overview of the supported protection features. Two protection modes are implemented (auto restart mode and latch mode) , which can be entered. Protection features can be configured by the parameters that are shown in Table 3-9 and Table 3-10. An error counter counts errors up to 4 restarts, defined by the constant value Err_restart_tries (see Table 3-14). The error counter is reset when the device operates without additional error s for the time defined by the constant Err_cnt_clear_time (see Table 3-14), or at the startup sequence, e.g. if VCC falls below the voltage threshold (see Table 4-4). Table 3-5. Protection Features Undervoltage Protection for DC Input Line – VIN Undervoltage Section 3.6.1 Overvoltage Protection for DC Input Line – VIN Overvoltage Section 3.6.2 Output Undervoltage Protection – VOUT Undervoltage Section 3.6.3 Open Output Protection Section 3.6.4 Output Overvoltage Protection – VOUT Overvoltage Section 3.6.5 Output Overpower Protection – POUT Overpower Section 3.6.6 Overtemperature Protection Section 3.6.7 Overcurrent Protection – Level 2 (OCP2) Section 3.6.8 Functional Protections Section 3.6.9
Datasheet 31 Revision 1.0, 2015-04-08 Protection functions are shown in a matrix in Table 3-6 below. Table 3-6. Protection Functions Matrix Description of Fault Characteristics of Fault Operating Mode Detection Active Consequence Name of Fault Minimum Duration of effect Startup Normal Shutdown Error Current Buck OFF VIN Undervoltage INPUV 1.6 ms X X - - - Startup - Waits until condition is removed Normal – Auto-restart VIN Overvoltage INPOV 1.6 ms X X - - - Startup - Waits until condition is removed Normal – Auto-restart VOUT Undervoltage OUTUV 0.8 ms @40 kHz - X - - - Auto-restart mode with 4 tries (restarts). After 4 failed attempts, the device enters latch mode Open Output OPEN 1) X X - - - Auto-restart mode with 4 tries (restarts). In each restart try, I -set procedure will be executed. After 4 failed attempts, the device enters latch mode VOUT Overvoltage OUTOV 0.4 ms @40 kHz - X - - - Auto-restart mode with 4 tries (restarts). After 4 failed attempts, the device enters latch mode POUT Overpower PWR 6.4 ms @40 kHz - X - - - Auto-restart mode with 4 tries (restarts). After 4 failed attempts, the device enters latch mode Overtemperature (Internal or External) OTI or OTE 0.4 ms @40 kHz X X - - - Startup - Waits until condition is removed Normal – Auto-restart OCP2 OCP Instantly X X - - - The device is in predefined time loop until the device is switched off or when the cause of the OCP2 event is removed – see Section 3.6.8 X = Checked during Operating Mode - = Not checked during Operation Mode In each restart attempt, the IC remains in a time loop whose duration is determined by the constant Err_restart_time, see Table 3-14 1) Defined by constant Open_out_timeout, see Section 3.6.4 . All protections are described in the following sections.
Datasheet 32 Revision 1.0, 2015-04-08
3.6.1 Undervoltage Protection for DC Input Line – VIN Undervoltage
Undervoltage protection for the DC input line prevents the device from operating with a n excessively low VIN voltage. If the input volta ge is below the specified value, the output current is turned off. The device waits until the input undervoltage (low voltage value) condition is removed (Vin_min_start is met) and then start s with output current generation again. There are two hy steretic input voltage values that are used as thresholds during the startup sequence ( upper threshold value – parameter Vin_min_start, see Table 3-9)1 and during operation ( lower threshold value – parameter Vin_min_oper, see Table 3-9)1. If the input voltage is V IN < Vin_min_oper during operation, the buck converter will be shut down and will wait for the VIN startup condition (when Vin_min_start is reached). This event does not affect the error counter.
3.6.2 Overvoltage Protection for DC Input Line – VIN Overvoltage
Overvoltage protection for the DC input line prevents the device from operating with a n excessively high VIN voltage. After the overvoltage condition on input is detected, the output current is turned off. The device waits for the input overvoltage condition to be removed (Vin_max_start is met) and then starts output current generation again. There are two hysteretic input voltage values that are used as threshold s during the startup sequence (lower threshold value – parameter Vin_max_start, see Table 3-9)1 and during operation (upper threshold value – parameter Vin_max_oper, see Table 3-9)1. If the input voltage is V IN > Vin_max_oper during operation, the buck converter will be shut down and will wait for the VIN startup condition (when Vin_max_start is reached). This event does not affect the error counter.
3.6.3 Output Undervoltage Protection – VOUT Undervoltage
Output undervoltage protection prevents the device from operating with a n excessively low output voltage VLEDmin or when LED output is lowered. If the o utput voltage is lower than the minimum value VOUT < Vout_min, an undervoltage output is detected, and the device enters error auto -restart mode with 4 tries (restarts) – constant Err_restart_tries (see Table 3-14). After 4 failed attempts, the device enters latch mode. The minimum output operating voltage value is programmable (parameter Vout_min , Table 3-9). Undervoltage output is checked during steady-state condition, after completing soft-start. The restart timeout startup delay is predefined by the constant Err_restart_time (see Table 3-14).
3.6.4 Open Output Protection
Open output protection prevents the device from operating when no load on output is detected. It is detected when the time to achieve IMAX (see Figure 11) exceeds the value of the parameter Open_out_timeout (see Table 3-14)2. If the open output condition is detected, the device enters error auto-restart mode with 4 tries (restarts) – constant Err_restart_tries (see Table 3-14). In each attempt, the device executes the reference resistor reading procedure (I-set procedure, see Section 3.3.3). The duration of the I-set procedure is defined by the parameter RC_measurement_timeout (duration = 2 · RC_measurement_timeout, see Table 3-19). The restart timeout startup delay is predefined by the constant Err_restart_time (see Table 3-14). After 4 failed attempts, the device enters latch mode. The total duration of the restart attempt can be obtained as the sum of the two above -mentioned times (I-set procedure + restart timeout) . If the LED lighting load is connected (or replaced) at the output between two restart attempts , the I-set procedure will detect the new R_iset resistance and the buck converter will try to start with the newly determined reference current. 1 To minimize the impact of fluctuations on the exact VIN voltage value, filtering is implemented using a first-order filter whose coefficient is defined by the constant Vin_filt_coef (see Table 3-14) 2 During buck ‘on time’ TON (see Figure 11), the gate driver stays constantly ‘high’ until IMAX is reached, or Open_out_timeout expires. This can lead to a long ‘high’ time. In case there is a ‘high side driver’ circuit between the ILD2111 gate drive an d MOSFET gate, proper functionality for all operating conditions needs to be considered. A stable OCP1 value (I MAX) is obtained by filtering defined by the constant Alt_OCP1_filt_stable (see Table 3-14)
Datasheet 33 Revision 1.0, 2015-04-08
3.6.5 Output Overvoltage Protection – VOUT Overvoltage
Output overvoltage protection prevents the device from operating wh en the high voltage at the output VOUT is detected1. If the output voltage is higher than the maximum value VOUT > Vout_max, the device enters error auto-restart mode with 4 tries (restarts) – constant Err_restart_tries (see Table 3-14). After 4 failed attempts, the device enters latch mode. The m aximum output operating voltage value is programmable (parameter Vout_max, Table 3-9). Output voltage is checked during the steady-state condition, after completing soft-start. The restart timeout startup delay is predefined by the constant Err_restart_time (see Table 3-14).
3.6.6 Output Overpower Protection – POUT Overpower
Output overpower protection prevents damage to output components due to high output power 2. The maximum allowed output power value (parameter Pout_max, see Table 3-9) is set by the constants Pout_corr_LC and Pout_corr_HC (Pout_max_lc = Pout_corr_LC · Pout_max and Pout_max_hc = Pout_corr_HC · Pout_max) for low current and high current range respectively (see Table 3-14). The parameter Ref_current _HCTH decides between the low current and high current range (see Table 3-14). If the output power exceeds the maximum allowed operational value, the device enters error auto -restart mode with 4 tries (restarts) – constant Err_restart_tries (see Table 3-14). After 4 failed attempts , the device enters latch mode. Output overpower is checked during the steady -state condition after completing soft -start. The restart timeout startup delay is predefined by the constant Err_restart_time (see Table 3-14). 1 Output voltage is internally calculated, based on VIN and T ON / T PWM duty factor. Output voltage can be calculated approximately as VOUT = D * VIN = (TON / TPWM) * VIN (all resistances and voltage drops of used components are neglected). To minimize the impact of fluctuations on the exact TPWM period value, filtering is implemented using a first-order filter whose coefficient is defined by the parameter Tpwm_filt_coef (see Table 3-14). 2 Output power is internally calculated, based on V IN, IOUT and TON / TPWM ratio. The actual T ON / TPWM ratio (for true output power) also depends on parasitic effects (e.g. MOSFET diode reverses recovery time, additional circuit like high side driver). These parasitic effects are unknown to the chip calculation and need to be considered for choosing appropriate Pout_max values. To minimize the impact of fluctuations on the calculated POUT value, filtering is implemented using a first-order filter whose coefficient is defined by the parameter Pout_filt_coef (see Table 3-14) before comparing the output power against Pout_max_lc or Pout_max_hc thresholds.
Datasheet 34 Revision 1.0, 2015-04-08
3.6.7 Overtemperature Protection
The ILD2111 supports overtemperature protection by means of internal and external temperature sensors. If both internal temperature protection and external temperature protection requests for the current level change, the lower current level will prevail. If the external sensor is not used (disabled by configuration), only the internal temperature protection is processed.
3.6.7.1 Internal Temperature Sensor – Internal PWM Dimming 1
Internal temperature -based protection uses internal temperature sensor measurement for reduction of the output current in the case that device temperature increases. For this purpose, two temperature thresholds - T1 and T2 - are defined (parameters ITP_temperature_hot – T1 and ITP_temperature_critical – T2 increasing in value – see Table 3-10) as well as one up -slope ( constant ITP_PWM_inc_step - Table 3-15 and parameter ITP_PWM_inc_time_step - Table 3-10) and one down -slope (constant ITP_PWM_dec_step - Table 3-15 and parameter ITP_PWM_dec_time_step - Table 3-10). Temperature thre sholds can be set in steps of 1 °C and slopes as percentages of the average current per minute. The o utput current level is reduced by PWM modulation with a programmable frequency rate – see Figure 28. There are three temperature-related operating conditions: - Normal T<=T1 - Hot T1<T<=T2 - Critical T>T2 Temperature measurement may lead to a change of operating state: In the critical state, the output current is off. An output current restart could be in hot or normal state (default). If the device starts in hot mode, then the current is adjusted with the dedicated constant value (ITP_startup_PWM_hot = 50 %, see Table 3-15). If it is in norm al mode, it will start with 100 % of the rated current. In the hot state , the current will be reduced (decreased) according to a constant-defined limit (TP_PWM_duty_min = 50 %, see Table 3-18) and down -slope. If the device starts in hot mode , it will start with 100% of the rated current , but then the current is adjusted wit h the dedicated para meter (ITP_startup_PWM_hot = 50%). In normal mode, the full current level (100%) is started and kept stable (no change in current level). The c omplete device behavior regarding operating temperature conditions is shown in Figure 23, Figure 24 and Figure 28.
Figure 23. Internal Temperature Protection Behavior
Figure 24. Internal Temperature Protection
3.6.7.2 External Temperature Sensor – Internal PWM Dimming 2
coefficient is defined by the constant ETP_filt_coef (see Table 3-15) before comparing against thresholds. Figure 25. External Temperature Measurement The threshold levels vary according to the PTC resistance/temperature curve.
Datasheet 39 Revision 1.0, 2015-04-08
3.6.8 Overcurrent Protection – Level 2 (OCP2)
To avoid damage to the shunt resistor or MOSFET due to the rapid increase (inrush) of the current through the shunt resistor (detected as the voltage at the CS pin), the overcurrent protection OCP2 is implemented as a hardware threshold . If the OCP2 threshold is reached 1 (regardless of the cause of its appearance ), the gate driver ( power MOSFET) will be turned off automatically and can only be turned on again by firmware intervention. In the case of an OCP2 event, the firmware checks an internal counter of OCP2 events and applies a delay according to the table Table 3-7. After the delay the engine is reinitialized and the device starts operation. The OCP2 counter will be reset after a predefined time (constant Err_cnt_clear_time , see Table 3-14) in case there are no new OCP2 error events in the meantime. Otherwise, if the OCP2 event occurs again before the counter is reset, the number of errors is increased in increments up to the limit. Table 3-7. OCP2 Error Restart Delay Number of the OCP2 events Previous value of the OCP2 counter Next value of the OCP2 counter Restart delay 1 0 1 100 µs 2 1 2 500 µs 3 2 3 2500 µs ≥4 3 3 OCP2_restart_delay [ms] The time loop defined by the constant OCP2_restart_delay (see Table 3-14) is repeated until the device is switched off or when the cause of the OCP2 event is removed. If the OCP2 condition is removed and the device is in internal or external PWM dimming, the device continues to operate in one of two mod es (internal or external dimming), depending on which of the conditions for these modes is fulfilled.
3.6.9 Functional Protections
Beside previous protections related to an application, ILD2111 incorporated the functional protections in order to achieve high reliability of the operation.
3.6.9.1 Code Memory Protections
During the startup of the device , after a reset or power -up, firmware is copied from the OTP memory to the RAM. The firmware is then executed fro m the RAM. The firmware is signed with a CRC value (Cyclic Redundancy Check). During the process of copying , the CRC value is calculated and then compared to the signed CRC value. In the case of a mismatch the firmware will not start in order to prevent misbehavior. During run time the RAM is protected by a parity check over one memory cell. RAM parity protection is a hardware feature which detects parity errors when RAM is accessed (read/write). In the event of a parity error, a hardware reset is issued and the device will restart accordingly.
3.6.9.2 Firmware Hang Protection
During run-time, the execution of the firmware can become erratic due to a hardware fault . In order to prevent such firmware “hangs” a watch dog timer (WDT) is utilized. The WDT is a hardware feature and if it is not serviced before a specific timeout, the device will reset and restart accordingly.
3.6.9.3 Parameter Memory Protection
The parameter memory is a dedicated part of the RAM. The device blank check s part of this area and also checks for the parameter “CRC error”. More details can be found in Section 3.9.2. 1 The digital representative of the OCP2 comparator output is digitally filtered. The n umber of successive samples that have reached OCP2 level, after which OCP2 event will be acknowledged, is defined by the parameter OCP2_filt_stable (see Table 3-14).
3.7 External PWM Dimming
measured at the PWM input pin – see Figure 27. Figure 27. External PWM Dimming described in the following section 3.8.
3.8 Output Current PWM Modulation
- External PWM dimming signal (Section 3.7) and
- Internal PWM dimming signal ( internal temperature protection – see Section 3.6.7.1 and external
temperature protection – see Section 3.6.7.2). values (external epwm_duty or internal ipwm_duty). Figure 28. Output Current PWM Modulation slope time (TON_FIRST) is included in the calculation. expected inaccuracy due to longer rising TON_FIRST and falling TOFF_LAST times. Figure 29. Output Current IMEAN Dimming Range Limitation
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3.9 Configuration
This section provides an overview of the parameters that can be configured via the UART interface.
3.9.1 Overview of Configurable Parameters
The ILD2111 provides a generic firmware version that includes all parameters set to zero. The parameter values need to be specified by the user according to the target application. Please refer to the corresponding electrical characteristics in Section 4 for the min imum and maximum tolerances. Parameter Lists The parameter list contains the following groups: - Configurable parameters (see Section 3.9.1.1) - Variable values that can be changed (modified) by the user according to the desired application. - Design constants (see Section 3.9.1.2) - Constant values that cannot be changed and that are specified by the application.
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3.9.1.1 Configurable Parameters
The configurable parameters are arranged in the following tables: 1. Hardware configuration - Table 3-8. 2. Protections - Table 3-9. 3. Temperature guard - Table 3-10. 4. Startup & shutdown - Table 3-11. 5. Output current set - Table 3-12. Table 3-8. Configurable Parameters – Hardware Configuration Parameter Name Minimum Value Maximum Value Vin_current_range 0.209 mA 1.6 mA This bit field selects the measurement range for the current measurement (full scale value) 00B - Range 00 => IMEA = 209 µA (RSHUNT = 6690 Ω) 01B - Range 01 => IMEA = 1.6 mA (RSHUNT = 1490 Ω) Current_sense_OCP1 0.4 V 0.6 V This bit field defines range (gain) for the CS OCP1 DAC, CS S&H and CS peak detector 10B - Range 10 = OCP1 = 0.6 V / OCP2 = 0.8 V (gain = 4) 11B - Range 11 = OCP1 = 0.4 V / OCP2 = 0.6 V (gain = 6) GD_voltage 4.5 V 15 V Gate voltage settings 000B – 15 V 001B – 13.5 V 010B – 12 V 011B – 10.5 V 100B – 9 V 101B – 7.5 V 110B – 6 V 111B – 4.5 V GD_current 30 mA 118 mA Gate current settings 00110B – 30 mA 00111B – 33 mA 01000B – 35 mA 01001B – 38 mA 01010B – 41 mA 01011B – 45 mA 01100B – 49 mA 01101B – 53 mA 01110B – 57 mA 01111B – 62 mA 10000B – 67 mA 10001B – 73 mA 10010B – 79 mA 10011B – 85 mA 10100B – 93 mA 10101B – 100 mA 10110B – 109 mA 10111B – 118 mA
Datasheet 44 Revision 1.0, 2015-04-08 Table 3-9. Configurable Parameters - Protections Parameter Name Minimum Value Maximum Value ETP_comp_Vcc Vcc voltage compensation for external temperature measurement enabled/disabled ETP_enable External temperature protection feature enabled/disabled Vin_min_start 0 Lowest possible input voltage V IN for buck converter to be able to start operation. Vin_min_oper 0 Lowest possible input voltage V IN allowed during operation. Vin_max_start 0 Highest possible input voltage VIN for buck converter to be able to start operation Vin_max_oper 0 Highest possible input voltage VIN allowed during operation. Vout_min 0 Minimum output voltage . Output voltage lower than this value will trigger output undervoltage protection. Vout_max 0 Maximum output voltage . Output voltage higher than this value will trigger output overvoltage protection. Pout_max
0 Maximum allowed output power – Output power
higher than this value will trigger output overpower protection. The o utput power limit can be for Ref_currents < Ref_current_HCTH or for R ef_currents ≥ Ref_current_HCTH , see Table 3-14 Err_refcurrent_max Maximal hysteretic value of shutdown output current (ERROR CURRENT) - IERROR, see Figure 13 Err_refcurrent_min Minimal hysteretic value of shutdown output current (ERROR CURRENT) - IERROR, see Figure 13 Table 3-10. Configurable Parameters – Temperature guard Parameter Name Minimum Value Maximum Value ITP_temperature_hot1) -40 °C 150 °C Hot temperature threshold for internal sensor. ITP_temperature_critical1) -40 °C 150 °C Critical temperature threshold for internal sensor. ETP_temperature_hot 0 V 1.6 V Hot temperature voltage threshold for external sensor. ETP_temperature_critical 0 V 1.6 V Critical temperature voltage threshold for external sensor. ITP_PWM_inc_time_step 1 s 100 s Internal temperature protection time step (in seconds) for current increasing ( change of internal PWM duty). ITP_PWM_dec_time_step 1 s 100 s Internal temperature protection time step (in seconds) for current decreasing ( change of internal PWM duty). ETP_PWM_inc_time_step 1 s 100 s External temperature protection time step (in seconds) for current increasing ( change of internal PWM duty).
Datasheet 45 Revision 1.0, 2015-04-08 Parameter Name Minimum Value Maximum Value ETP_PWM_dec_time_step 1 s 100 s External temperature protection time step (in seconds) for current decreasing ( change of internal PWM duty). Vcc_reference
11 V 24 V Reference value of Vcc voltage for external
temperature measurement compensation. 1) Absolute maximum ratings and operation conditions need to be considered . Table 3-11. Configurable Parameters – Startup & Shutdown1) Parameter Name Minimum Value Maximum Value Softstart_time_step 0 65535 Reference current ramp increment time interval (tCSUS) in system timer ticks (100 µs). Softshutdown_time_step 0 65535 Reference current ramp decrement time interval (tCSDS) in system timer ticks (100 µs). 1) See Section 3.3.5.
Datasheet 46 Revision 1.0, 2015-04-08 Table 3-12. Configurable Parameters – Output Current Set1) Parameter Name Minimum Value Maximum Value Curr_ripple_perc 1 100 Current ripple percentage which is used during the startup sequence. Ref_current_01 Reference current 01 which is assigned to the first FRC current group (FRC current group 1). Ref_current_02 Reference current 02 which is assigned to the first FRC current group (FRC current group 1). Ref_current_03 Reference current 03 which is assigned to the first FRC current group (FRC current group 1). Ref_current_04 Reference current 04 which is assigned to the first FRC current group (FRC current group 1). Ref_current_05 Reference current 05 which is assigned to the second FRC current group (FRC current group 2). Ref_current_06 Reference current 06 which is assigned to the second FRC current group (FRC current group 2). Ref_current_07 Reference current 07 which is assigned to the second FRC current group (FRC current group 2). Ref_current_08 Reference current 08 which is assigned to the second FRC current group (FRC current group 2). Ref_current_09 Reference current 09 which is assigned to the third FRC current group (FRC current group 3). Ref_current_10 Reference current 10 which is assigned to the third FRC current group (FRC current group 3). Ref_current_11 Reference current 11 which is assigned to the third FRC current group (FRC current group 3). Ref_current_12 Reference current 12 which is assigned to the third FRC current group (FRC current group 3). Ref_current_13 Reference current 13 which is assigned to the fourth FRC current group (FRC current group 4). Ref_current_14 Reference current 14 which is assigned to the fourth FRC current group (FRC current group 4). Ref_current_15 Reference current 15 which is assigned to the fourth FRC current group (FRC current group 4). Ref_current_16 Reference current 16 which is assigned to the fourth FRC current group (FRC current group 4). 1) See Section 3.3.3.
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3.9.1.2 Design Constants
Design constants are arranged in the following tables: 1. Hardware configuration - Table 3-13. 2. Protections - Table 3-14. 3. Temperature guard - Table 3-15. 4. Startup & shutdown - Table 3-16. 5. Control loop - Table 3-17. 6. Dimming - Table 3-18. 7. Output current set - Table 3-19. 8. Frequency ripple controller - Table 3-20. Table 3-13. Design Constants – Hardware Configuration Parameter Name Value Description V_ADC_th 0.6075 V Ref capacitor discharge ADC voltage threshold. ETP_temperature_disconnected 4000 i.u External sensor disconnection threshold value. Table 3-14. Design Constants – Protections Parameter Name Value Description Ref_current_HCTH 800 mA First reference current value for HC range. The value should be selected from the reference current list. Pout_corr_LC 1 POUT correction factor for low current (LC) range. Pout_corr_HC 1 POUT correction factor for high current (HC) range. Err_restart_tries 4 Number of auto-restart attempts before entering latch mode. Err_current_time 500 ms Time interval ( error time) after decreasing ramp to imply minimum current before turn off. Err_restart_time 1000 ms Error auto-restart time interval. Err_cnt_clear_time 65000 ms Time after which error restart attempts counter will be cleared. Open_out_timeout 300 ms Open output detection time (timeout). Alt_OCP1_filt_stable 2 ALTOCP1 filter length (OCP1 level). OCP2_filt_stable 6 Number of samples that have reached OCP2 level, after which OCP2 event will be handled. Pout_filt_coef 16 Output power first order filter coefficient. This parameter can be 2 n (n = 0, 1, 2, 3, 4, 5, 6, 7, 8). Pout filteri ng before comparing against Pout_max_XX, (XX = LC, HC) threshold. Vin_filt_coef 16 Vin voltage first order filter coeff icient. This parameter can Tpwm_filt_coef 4 Tpwm (Buck cycle period) first order filter coeff icient. This parameter can be 2n (n = 0, 1, 2, 3, 4, 5, 6, 7, 8). OCP2_restart_delay 130 ms Final delay time after four OCP2 events are detected. Buck_steady_delay 32 Number of averaged PWM cycles for steady state operation where calculation & protection are handled.
Datasheet 48 Revision 1.0, 2015-04-08 Table 3-15. Design Constants – Temperature Guard Parameter Name Value Description ITP_PWM_inc_step 1 Internal temperature protection current increase step ( internal PWM dimming). ITP_PWM_dec_step 1 Internal temperature protection current decrease step (internal PWM dimming). ITP_startup_PWM_hot 50% Internal temperature protection current de -rating PWM duty value for starting in the hot condition. ETP_PWM_inc_step 1 External temperature protection current increase step (internal PWM dimming). ETP_PWM_dec_step 1 External temperature protection current decrease step (internal PWM dimming). ETP_startup_PWM_hot 50% External temperature protection current de -rating PWM duty value for starting in the hot condition. ETP_filt_coef 64 External temperature measurement first order filter coefficient. External temperature filtering before comparing against thresholds. This parameter can be 2 n (n = 0, 1, 2, 3, 4, 5, 6, 7, 8). Vcc_filt_coef 16 Vcc voltage first order filter coeff icient. This parameter can be Table 3-16. Design Constants – Startup and Shutdown Parameter Name Value Description Softstart_start_curr 5% Softstart starting value of reference current ramp (% of the I_ref_01 current value). Ripple is given as a percentage. Softstart_curr_step 0.5% Softstart reference current ramp increment step value (% of the I_ref_01 current value). Softshutdown_curr_step 0.5% Soft shutdown reference current ramp decrement step value (% of the I_ref_01 current value).
Datasheet 49 Revision 1.0, 2015-04-08 Table 3-17. Design Constant – Control Loop Parameter Name Value Description PI_gain_shift_softstart_lc 3 PI regulator gain boost value for low current range during startup. The error signal is multiplied with 2PI_gain_shift_softstart_lc PI_gain_shift_softstart_hc 2 PI regulator gain boost value for high current range during startup. The error signal is multiplied with 2PI_gain_shift_softstart_hc PI_gain_shift_lc 1 PI regulator gain boost value for low current range during normal operation. The e rror signal is mu ltiplied with 2PI_gain_shift_lc. PI_gain_shift_hc 0 PI regulator gain boost value for high current range during normal operation. The e rror signal is mu ltiplied with 2PI_gain_shift_hc. Table 3-18. Design Constant – Dimming Parameter Name Value Description TP_PWM_period 3.2 ms Temperature protection internal IPWM period - defines the frequency of the internal IPWM dimming (fPWM = 1 / TP_PWM_period). fPWM ~ 300 Hz. TP_PWM_duty_min 50% Temperature protection internal IPWM ON time - defines the duty factor (in %) of the internal IPWM dimming. EPWM_detection_timeout 50 ms Timeout for external EPWM detection. LFPWM_threshold_divider 1 Number of divisions by two of measured T PWM to get the hysteretic controller threshold. This parameter can be n = 0, LFPWM_flicker_free_threshold 30 Number of switching cycles that are considered flicker -free (threshold divider is not implemented th en for hysteresis controller).
Datasheet 50 Revision 1.0, 2015-04-08 Table 3-19. Design Constant – Output Current Set Parameter Name Value Description Reference_time_011) * Discharge time threshold for Ref_current_01 Reference_time_021) * Discharge time threshold for Ref_current_02 Reference_time_031) * Discharge time threshold for Ref_current_03 Reference_time_041) * Discharge time threshold for Ref_current_04 Reference_time_051) * Discharge time threshold for Ref_current_05 Reference_time_061) * Discharge time threshold for Ref_current_06 Reference_time_071) * Discharge time threshold for Ref_current_07 Reference_time_081) * Discharge time threshold for Ref_current_08 Reference_time_091) * Discharge time threshold for Ref_current_09 Reference_time_101) * Discharge time threshold for Ref_current_10 Reference_time_111) * Discharge time threshold for Ref_current_11 Reference_time_121) * Discharge time threshold for Ref_current_12 Reference_time_131) * Discharge time threshold for Ref_current_13 Reference_time_141) * Discharge time threshold for Ref_current_14 Reference_time_151) * Discharge time threshold for Ref_current_15 Reference_time_161) * Discharge time threshold for Ref_current_16 RC_cap_charge_time 500 µs Time for charging ref capacitor. RC_measurement_timeout 40000 µs Maximal time to determine that no external resistor has been connected during current set determination. CS_blanking_time 0.758 µs Configurable leading edge blanking time. CS_sample_time 0.622 µs Configurable CS sample time - delay until sampling starts. Toff_min 0.4 µs Minimal TOFF time. It is 10% of T SWMIN = 1 / f SWMAX, fSWMAX = 250 kHz. 1) The calculated Reference_time values* (dependent on the selected reference resistors and reference capacitor) will be assigned automatically to the appropriate reference current parameter Ref_current – see Section 3.3.3.
Datasheet 51 Revision 1.0, 2015-04-08 Table 3-20. Design Constant - Frequency Ripple Controller Parameter Name Value Description Curr_ripple_max_01_04 157 mA Maximum allowed ripple value for reference currents group 1. FRC is enabled. Curr_ripple_min_01_04 87 mA Minimum allowed ripple value for reference currents group 1. FRC is enabled. Curr_ripple_max_05_08 149 mA Maximum allowed ripple value for reference currents group 2. FRC is enabled. Curr_ripple_min_05_08 87 mA Minimum allowed ripple value for reference currents group 2. FRC is enabled. Curr_ripple_max_09_12 149 mA Maximum allowed ripple value for reference currents group 3. FRC is enabled. Curr_ripple_min_09_12 87 mA Minimum allowed ripple value for reference currents group 3. FRC is enabled. Curr_ripple_max_13_16 140 mA Maximum allowed ripple value for reference currents group 4. FRC is enabled. Curr_ripple_min_13_16 87 mA Minimum allowed ripple value for reference currents group 4. FRC is enabled. FRC_freq_max_limit_01_04 120 kHz Maximum allowed switching frequency (defines minimum allowed switching period) for reference currents group 1. FRC_freq_min_limit_01_04 110 kHz Minimum allowed switching frequency (defines maximum allowed switching period) for reference currents group 1. FRC_freq_max_limit_05_08 140 kHz Maximum allowed switching frequency (defines minimum allowed switching period) for reference currents group 2. FRC_freq_min_limit_05_08 126 kHz Minimum allowed switching frequency (defines maximum allowed switching period) for reference currents group 2. FRC_freq_max_limit_09_12 145 kHz Maximum allowed switching frequency (defines minimum allowed switching period) for reference currents group 3. FRC_freq_min_limit_09_12 130 kHz Minimum allowed switching frequency (defines maximum allowed switching period) for reference currents group 3. FRC_freq_max_limit_13_16 130 kHz Maximum allowed switching frequency (defines minimum allowed switching period) for reference currents group 4. FRC_freq_min_limit_13_16 110 kHz Minimum allowed switching frequency (defines maximum allowed switching period) for reference currents group 4. FRC_reg_interval_start 1024 Frequency-ripple control execution interval, during startup, in averaging intervals (averaging interval = 16 Buck cycles). FRC_reg_interval_oper 12288 Frequency-ripple control execution interval during normal operation, in averaging intervals (averaging interval = 16 Buck cycles). FRC_pass_oper_th 64 Number of FRC executions before co nsidered steady and can switch to operational execution interval.
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3.9.2 Configuration Procedure – Parameter Handling
The UART interface is configured at the pin REF/SC. The UART interface uses a single line for receiving and transmitting data. Firmware parameters are configured by means of communication protocol comm ands (Infineon proprietary protocol). Parameters are stored in on-chip OTP memory (default parameter block and parameter patches). Parameters can be accessed after the chip startup phase when VCC exceeds the VEXT threshold (see Table 4-4) and a UART connection at the REF/SC pin is detected. During startup , the application checks the default parameter block , RAM content that was copied from OTP memory. If no default parameter block is detected or if an error is found (CRC mismatch) , buck operation will be disabled, and the device will report an error and enter the idle state. Reading and writing of the parameters are related to RAM parameter values. Write operation s change the working value of the selected parameter, affecting chip operation after exiting configuration mode. The number of write operations is not limited. Since the default parameter block may be corrupted or in the case that the user wants to change some of the parameter values (or the whole parameter block) , a patching feature can be used to change the parameters . In general, the patches will have the same structure as the default parameter block but the length will be arbitrary and up to the size of the full (default) block. A Cyclic Redundancy Check (CRC) in the patch will not reflect the patch data CRC , but rather the CRC of all the default parameters with the implemented patch. The patching procedure will be repeated for all found and consistent patches – see the parameter-handling flowchart in Figure 30.
appropriate parameters from the patch. Replace CRC in the Default block. Figure 30. Parameter Handling to be used as working values after the next chip reset. More information about .dp vision can be found in the User’s Manual document for this tool. 1 During burning, the OTP programming voltage VPP (see Table 4-15) must have a stable value.
Electrical Characteristics
Datasheet 54 Revision 1.0, 2015-04-08
4 Electrical Characteristics
4.1 Definitions
Figure 31 illustrates the definition for the voltage and current parameters used in this datasheet. VPIN PIN GND +IPIN ILD2111 Figure 31. Voltage and Current Definitions1 1) Absolute Maximum Ratings, Table 4-1. 2) Thermal Characteristics, Table 4-2. 3) Operating Range, Table 4-3. 4) Electrical Characteristics of the Power Supply, Table 4-4. 5) Electrical Characteristics of Pin VIN, Table 4-5. 6) Electrical Characteristics of Pin REF/SC, Table 4-6. 7) Electrical Characteristics of Pin CS, Table 4-7. 8) Electrical Characteristics of Gate Driver Pin GD0, Table 4-8. 9) Electrical Characteristics of Digital Input Pin PWM, Table 4-9. 11) Electrical Characteristics of the A/D Converter, Table 4-11. 12) Electrical Characteristics of the Reference Voltage VREF, Table 4-12. 13) Electrical Characteristics of the Clock Oscillators, Table 4-13. 14) Electrical Characteristics for Internal Temperature Protection, Table 4-14. 15) Electrical Characteristics of the OTP Programming, Table 4-15. 1 Currents flowing out of the device (ILD2111) are marked with a negative sign in the ‘Symbol’ column.
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4.2 Absolute Maximum Ratings
Attention: Stresses above the values listed below may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. These values are not tested during production test. Table 4-1. Absolute Maximum Ratings1 Parameter Symbol Values Unit Note / Test Condition Min. Max. Voltage at pin VCC VVCC -0.5 26 V Voltage that can be applied to pin VCC by an external voltage source Voltage at pin GD0 VGD0 -0.5 VVCC+0.3 V Voltage at pin PWM VPWM -0.5 VVCC+0.3 V Junction temperature TJ -40 125 ºC Storage temperature TS -55 150 ºC Soldering temperature TSOLD - 260 ºC Wave soldering 1) Latch-up capability ILU - 150 mA 2) Pin voltages according to absolute maximum ratings ESD capability HBM VHBM - 2000 V 3) Excluded pin VIN ESD capability HBM VHBM - 1500 V 3) Pin VIN ESD capability CDM VCDM - 500 V 4) Input Voltage Limit VIN_DC -0.5 3.6 V Voltage externally supplied to the pins REF/SC, CS, TS, PWM 5) Voltage at pin VIN VINEXT - 26 V Maximum voltage that can be applied to pin VIN by an external voltage source Maximum current into pin VIN IAC - 10 mA 1) According to JESD22A111 Rev A. 2) Latch-up capability according to JEDEC JESD78D, TA=85°C. 3) ESD-HBM according to ANSI/ESDA/JEDEC JS-001-2012. 4) ESD-CDM according to JESD22-C101F. 5) Permanently applied as DC value. 1 Absolute maximum ratings ( Table 4-1) are defined as ratings which, when exceeded, may lead to destruction of the integrated circuit. For the same reaso n, make sure that any capacitor connected to pin VCC is discharged completely, before assembling the application circuit.
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4.3 Package Characteristics
Table 4-2. Package Characteristics Parameter Symbol Values Unit Note / Test Condition Min. Max. Thermal resistance for PG-DSO-8-58 RthJA - 178 K/W JEDEC 1s0p for 140 mW power dissipation - 164 K/W JEDEC 1s0p for 180 mW power dissipation - 154 K/W JEDEC 1s0p for 220 mW power dissipation - 100 K/W JEDEC 2s2p for 140, 180, 220 mW power dissipation
4.4 Operating Conditions
Table 4-3 shows the recommended operating conditions under which the electrical characteristics shown in Section 4.5 are valid. Table 4-3. Operating Range Parameter Symbol Values Unit Note / Test Condition Min. Max. Junction temperature TJ -40 125 ºC Lower VCC limit VVCC VUVOFF V Device is held in reset when VCC < VUVOFF Voltage externally supplied to VCC pin VVCCEXT - 24 V Maximum voltage that can be applied to the pin VCC by an external voltage source Gate driver pin voltage VGD -0.3 VVCC+0.3 V
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4.5 DC Electrical Characteristics
The electrical characteristics involve the spread of values given within the specified supply voltage and junction temperature range T J from -40°C to +125 °C. Typical values represent the median values related to TA = 25°C. All voltages refer to GND, and the assumed supply voltage is VVCC = 18 V, if not specified otherwise. The following characteristics are specified: Table 4-4. Electrical Characteristics of the Power Supply Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. VCC Externally Powered Startup VCC_ON_EXT threshold VEXT 7 - 11 V VCC_ON_EXT delay tEXT - - 2000 ns Reaction time of VCC_EXT monitor 1) VCC System Turn Off VCC_UVOFF current IVCCUVOFF 5 20 40 µA VVCC < VEXT(min) – 0.3 V UVOFF threshold VUVOFF - 6.0 - V UVOFF threshold tolerance UVOFF -5 - 5 % This value defines the tolerance of VUVOFF UVOFF filter constant tUVOFF 550 - - ns 1) 1 V overdrive ADC Measurement of VCC Maximum Error for ADC measurement (8 bit result) TE0VCC - - 4.5 LSB8 1) TE256VCC - - 8.9 LSB8 1) 1) Not tested in production test. Table 4-5. Electrical Characteristics of Pin VIN Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Voltage at pin VIN VVIN 0 - 24 V Maximum voltage that can be applied to the pin VIN by an external voltage source Maximum current into pin VIN IAC - - 10 mA For measurement path Nominal current for measurement path IMEAS 0 - 1.6 mA Current range 01b 2) 0 - 209 µA Current range 00b 2) Reduced measurement range for current path RRIMEAS 4 - 80 % Current range 01b 3) 4 - 80 % Current range 00b 3) Nominal measurement path resistor value RSHUNT - 1.49 - kΩ Current range 01b - 6.69 - kΩ Current range 00b Measurement path resistor tolerance RSHUNT -20 - 20 % Already reflected in RRIMEAS Maximum error for corrected ADC measurement (8 bit result) TET0I01 - - 4.1 LSB8 1) TET256I01 8.4 LSB8 1) 1) Not tested in production test. 2) Defined by the parameter Vin_current_range (See Table 3-8). 3) Operational values.
Datasheet 58 Revision 1.0, 2015-04-08 Table 4-6. Electrical Characteristics of Pin REF/SC Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Digital Input Stage Characteristics Input capacitance CINPUT - - 10 pF 1) Input low voltage VIL - - 1.0 V Input high voltage VIH 2.0 - - V Input leakage current, no pull device ILK -10 - 10 µA VREF/SC = 0 V / 3 V -1 - 1 µA 1) TJ = 85°C VREF/SC = 0 V / 3 V Input low current with active weak pull-up WPU -ILPU 30 - 90 µA Measured at max. VIL Digital Output Stage Characteristics Output low voltage VOL - - 0.8 V IOL = 2 mA Output high voltage VOH 2.2 - - V IOH = -2 mA Output sink current IOL - - 2 mA Output source current -IOH - - 2 mA Output rise time (0 → 1) tRISE - - 25 ns 20 pF load, push/pull output 1) Output fall time (1 → 0) tFALL - - 25 ns 20 pF load, push/pull or open-drain output 1) Maximum output switching frequency fSWITCH 15 - - MHz 1) Analog Buffer and ADC channel Characteristics Nominal range VMFIO 0 - VREF V Reduced operating range RRVMFIO 4 - 96 % 2) Maximum error for measurement (8 bit result) TE0VMF0 - - 3.3 LSB8 1) TE256VMF0 - - 5.6 LSB8 1) Pull-Up Resistor Characteristics Pull-up resistor value RPU - 30 - kΩ Pull-up resistor tolerance RPU -20 - 20 % Overall tolerance 1) Not tested in production test. 2) Operational values.
Datasheet 59 Revision 1.0, 2015-04-08 Table 4-7. Electrical Characteristics of Pin CS Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Input Clamping Characteristics Input voltage negative clamping level -VINPCLN 600 1000 1500 mV Analog clamp structure activated OCP2 Comparator Characteristics OCP2 threshold voltage, derived from VVDDP, given values assuming VVDDP = 3.3 V VOCP2 - 0.6 - V Current sense range 11b - 0.8 - V Current sense range 10b Threshold voltage tolerance VOCP2 -5 - 5 % Voltage divider tolerance Delay from VCS crossing VCSOCP2 to begin of GD0 turn-off (IGD0 > 2 mA) tCSGD0OCP2 125 155 190 ns 2) dVCS/dt = 100 V/µs fMCLK = 66 MHz GD0 driven by QR_GATE FIL_OCP2.STABLE = 3 OCP1 Comparator Characteristics Operating range VOCP1 0 - VREF/6 V Current sense range 11b 0 - VREF/4 V Current sense range 10b OCP1 threshold voltage step width VOCP1ST - 1.581 - mV Current sense range 11b - 2.371 - mV Current sense range 10b OCP1 threshold at full scale setting (CS_OCP1LVL=FFH) VOCP1FS 392 403 430 mV Current sense range 11b 583 605 627 mV Current sense range 10b OCP1 integral nonlinearity VOCP1INL -1.9 - 1.9 LSB8 Current sense range 11b -2.9 - 2.9 LSB8 Current sense range 10b Delay from VCS crossing VCSOCP1 to begin of GD0 turn-off (IGD0 > 2 mA) tCSGD0OCP1 180 260 345 ns 2) dVCS/dt = 53 mV/µs fMCLK = 66 MHz GD0 driven by QR_GATE 120 185 250 ns 2) dVCS/dt = 272 mV/µs fMCLK = 66 MHz GD0 driven by QR_GATE 100 130 165 ns 2) dVCS/dt = 100 V/µs fMCLK = 66 MHz GD0 driven by QR_GATE OCP1 comparator input single pulse width filter tOCP1PW 60 - 95 ns Shorter pulses than min. are suppressed, longer pulses than max. are passed 2) Sample & Hold Characteristics Nominal S&H operating range VCSH 0 - VREF/6 V Current sense range 11b 0 - VREF/4 V Current sense range 10b Reduced S&H operating range RRCVSH 4 - 90 % 3) S&H settling time for ADC sampling tCSHSTC - - 300 ns STC = 5 1) Defined by the parameter Current_sense_OCP1 (See Table 3-8). 2) Not tested in production test. 3) Operational values. The absolute error of the OCP1 comparator is limited according to |VOCP1 - VOCP1Nom| ≤ |VOCP1FS - VOCP1ST * 255| + |VOCP1INL|
Datasheet 60 Revision 1.0, 2015-04-08 If the voltage at pin CS V CS(t) is a linear rising signal starting below the OCP1 threshold, the delay between the time when the voltage crosses the threshold and the CS comparator output rising edge t CSGD0OCP1 is a function of the slope. Two representative slopes are specified to characterize this dependency. Table 4-8. Electrical Characteristics of Gate Driver Pin GD0 Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. APD low voltage (active pull down while device is not powered or gate driver is not enabled) VAPD - - 1.6 V IGD = 5 mA 4) RPPD value RPPD - 600 - kΩ Permanent pull-down resistor inside gate driver RPPD tolerance RPD -25 - 25 % Permanent pull-down resistor inside gate driver Driver Output low impedance RGDL - - 6.5 Ω Driver stage enabled and at low state Output voltage at high state VGDH 4.5 - 15 V Programming options 1) Output voltage tolerance VGDH -5 - 5 % Tolerance of programming options if VGDH > 10 V -0.5 - 0.5 V Tolerance of programming options if VGDH < 10 V Rail-to-rail output high voltage VGDHRR VVCC - 0.5 - VVCC V If VVCC < programmed VGDH and output at high state Nominal output high current 2) -IGDH 30 - 118 mA Programming options 3), CLOAD = 2 nF Output high current tolerance IGDH -20 - 20 % Output high current settling time tIGDHST - - 40 ns Start of high state to output current stable 4) Discharge current IGDDIS 500 - - mA VGD = 4 V and driver at low state 4) 1) Defined by the parameter GD_voltage (See Table 3-8). 2) If open drain mode is selected, then -IGDH = 0. 3) Defined by the parameter GD_current (See Table 3-8). 4) Not tested in production test. Table 4-9. Electrical Characteristics of Digital Input Pin PWM Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Input capacitance CINPUT - - 25 pF 1) Input low voltage VIL - - 1.0 V Input high voltage VIH 2.1 - - V Input low current with active weak pull-up WPU -ILPU 30 - 90 µA Measured at max. VIL Input high current with active weak pull-down WPD IHPD 110 - 300 µA Measured at min. VIH Maximum input frequency fINPUT 15 - - MHz 1) Not tested in production test.
Datasheet 61 Revision 1.0, 2015-04-08 Table 4-10. Electrical Characteristics of Pin TS Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Nominal S&H input voltage range VZSH 0 - 2/3 * VREF V Reduced S&H input voltage range RRZVSH 4 - 95 % 2) Maximum Error for ADC measurement (8 bit result) TE0ZVS0 - - 6.3 LSB8 1) TE256ZVS0 - - 6.3 LSB8 1) Maximum Error for corrected ADC measurement (8 bit result) TET0ZVS0 - - 2.8 LSB8 1) TET256ZVS0 - - 4.6 LSB8 1) S&H settling time for ADC sample tZSHSTC - - 300 ns STC = 5 Voltage Drop of sampled input voltage if ADC measurement is started 100 μs after end of sampling phase VZDROP 0 - 3 LSB8 TJ = 85°C 1) 0 5 - LSB8 TJ = 125°C 1) 1) Not tested in production test. 2) Operational values. Table 4-11. Electrical Characteristics of the A/D Converter 1) Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Usable sample time tS 24 * tMCLK - 64 * tMCLK ns Selected by STC between 5 and 15 Conversion time for STC = 5 tC(STC=5) - 57 * tMCLK - ns 2) Conversion time for STC = 15 tC(STC=15) - 97 * tMCLK - ns 2) Integral non-linearity INL - - 1 LSB8 3) Differential non-linearity DNL - - 0.8 LSB8 1) The sample time tS of the A/D converter is given by tS = (STC+1) * 4 * tMCLK. The conversion time tC (including sample time) is given by tC = 33 * tMCLK + (STC+1) * 4 * tMCLK. 2) Any conversion needs exact these numbers of clock cycles by design. 3) ADC capability measured via channel MFIO without errors due to switching of neighboring pins, measured with STC = 5. Table 4-12. Electrical Characteristics of the Reference Voltage VREF Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Reference voltage VREF - 2.428 - V VREF tolerance VREF -1 - 1 % Trimmed, TA = 25°C VREF tolerance VREF -2 - 2 % Trimmed, over full temperature range and aging 1) 1) Not tested in production test.
Datasheet 62 Revision 1.0, 2015-04-08 Table 4-13. Electrical Characteristics of the Clock Oscillators Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Master clock oscillation period tMCLK 20.0 20.9 22.0 ns Referred as 50 MHz fMCLK Table 4-14. Electrical Characteristics of the internal Temperature Sensor Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Temperature sensor output voltage operating range VADCTEMP 0 - 190/255 * VREF V VADCTEMP = VREF/255 * (40 + temperature in °C) Temperature sensor tolerance TEMP -8 - 8 K Incl. ADC conversion accuracy at 4 σ 1) 1) Not tested in production test. Table 4-15. Electrical Characteristics of the OTP Programming Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. OTP programming voltage at the VCC pin VPP 7.35 7.5 7.65 V 1) 2) OTP programming current IPP - 1.6 - mA Programming of 4 bit in parallel 2) 1) Operational values. 2) Not tested in production test.
5 Outline Dimensions
Outline dimensions are shown in Figure 32. Figure 32. PG-DSO-8-58
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