Z8F80639070 INFINEON | Alldatasheet
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Evaluation Design Guide Please read the Important Notice and Warnings at the end of this document rev. 1.0 www.infineon.com 2024-06-05 Z8F80639070 Generic Power Board for 12 V application s OptiMOS™ -7 40 V SSO8 MOSFET s and MOTIX™ MCU TLE9879QXA40 Design Overview This document outlines the Generic Power Board for 12V applications, suitable for automotive inverter applications to control fans or pumps driven by BLDC motors. The system is controlled by a system- on-chip MOTIX™ MCU , which features integrated MOSFET driver s in combination with OptiMOSTM-7 40V leadless MOSFETs. The design is capable of driving loads up to 400W, powered by a 12 V battery. This manual includes a detailed description of the design, along with schematics and measurement reports. EMC compliance has been tested in line with the CISPR25 standard and an analysis of the th ermal performance is also provided. Generic Power Board: Top View Highlighted Components
- TLE9879QXA40
- IAUCN04S7N009
- IAUCN04S7N005 Target Applications
- Automotive fans and pumps
- Radiator fans, water pumps
- 400 W BLDC Motor for 12 V application Highlighted Design Aspects Pout 400 W EMC optimized Thermally optimized
Evaluation Design Guide Please read the Important Notice and Warnings at the end of this document rev. 1.0 www.infineon.com 2024-06-05 Z8F80639070 Generic Power Board: Overview Input connector Vbatt+ [X4] Connectors for external input filter inductor Input filter Reverse polarity protection Input connector Vbatt- (ground) [X7] Output connector Phase 1 to Phase 3 [X1, X2, X3] Common shunt resistor Inverter switches for three half- bridges OptiMOS 40V PG-TDSON package M3 holes for mounting heat sink [P1, P2, P3, P4] DC- link M3 holes for mounting board Switch [S1] Interface connector [H2] (for instance for Hall sensor) Reset button [S2] Debugger interface 1 [H1] Debugger interface 2 [H3] Measurement interface [X21, X22] Embedded BLDC driver circuit (TLE9879QXA40 - ARM Cortex M3 core based)
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Evaluation Design Guide 4 of 41 rev. 1.0 2024-06-05 Important Notice The Evaluation Boards and Reference Board s and the information i n this document are solely intended to support designers of applications to evaluate the use of products of Infineon Technologies in the intended application. Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards provided by Infineon Technologies . The design of the Evaluation Boards and Reference Boards is tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime. The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions . Evaluation Boards and Reference Boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD). Evaluation Boards and Reference Boards are not commercialized products and are solely intended to be used for evaluation and testing purposes . They shall in particular not be used for reliability testing or production. Hence, the Evaluation Boards and Reference Boards may not comply with CE or similar standards (including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the country in which they are operated by the customer. The customer shall ensure that each Evaluation Boards and Reference Board will be handled in a way which is compliant with all relevant requirements and standards in the country in which they are operated. The Evaluation Boards and Reference Boards and any information in this document are addressed only to qualified and skilled technical staff , for laboratory usage, and shall be used and manage d according to the terms and conditions set forth in this document and in any other related documentation provided with the respective Evaluation Boards or Reference Board. It is the responsibility of customer’s technical departments to evaluate the suitability of the Evaluation Boards and Reference Boards for the intended application and the completeness and correctness of the information provided in this document with respect to such application. The customer accepts that the Evaluation Boards and Reference Boards are not intended to be used for life - endangering applications such as medical, nuclear, military, life -critical or other applications, where failure of the Evaluation Boards and Reference Boards or any results from the use thereof can reasonably be expected to result in personal injury. The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and Infineon Technologies disclaims any and all warranties, express or implied, including but not limited to warranties of non-infringement of third-party rights and implied warranties of fitness for any purpose, or for merchantability. Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation Boards and Reference Boards and/or from any information provided in this document. The customer is obliged to defend, indemnify and hold harmless Infineon Technologies fro m and against any claims or damages arising out of or resulting from any use thereof. Infineon Technologies reserves the right to change this document and/or any information provided herein at any time without further notice.
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1 System Description
The inverter design described in this document presents a solution for an engine cooling fan with power capability up to 400W . It is also applicable to similar systems with equal or lower power requirements. This solution can be used for similar applications w ith smaller or equal output power. The circuit features an integrated 3 -phase motor control solution. The system-on-chip microcontroller belongs to the MOTIX™ MCU family, combining an Arm® Cortex® -M3 microcontroller with application specific modules , inclu ding an integrated 3-phase MOSFET driver, power supply and LIN-transceiver. Paired with the OptiMOSTM-7 40V MOSFETs in PG-TDSON-8 package (SSO8) the board system is optimized for minimal PCB size within this power class. The reference design aims to use standard PCB materials and processes.
1.1 Design Specifications
The design specifications correspond to the used components and related design considerations . These specifications should align with the values provided in the product datasheets . In case of discrepancies, the values in the datasheets shall take precedence. Table 1 Design Specifications Parameter Symbol Values Unit Comment Min. Typ. Max. System Parameters Input voltage VIN -0.3 12 40 V P_1.1.1 (TLE9879QXA40) Functional input voltage VIN 7 12 18 V Specified for Design Output current peak IOUT - - 44 A Peak current (<10 s), air cooling attached (>1.3 m/s) Output current continuous IOUT - 20 35 A Specified for Design Hall Sensor Inputs VHALL -0.3 5 5.5 V Specification related to GPIO Port 0,1 LIN interface VLIN -28 12 40 V P_1.1.7 (TLE9879QXA40) ADC Inputs VADC -0.3 5 5.5 V Specification related to GPIO Port 2 Phase 1, 2, 3 VSH -8.0 12 48 V P_1.1.11 (TLE9879QXA40) Thermal Operating temperature TA -40 25 105 °C Specified for Design
Evaluation Design Guide 6 of 41 rev. 1.0 2024-06-05 Electromagnetic Compatibility Conducted emissions Class 2 CISPR25, 150 kHz -108 MHz Mechanical Specification Dimensions 168 mm x 107 mm x 15 mm (L x W x H) 1 PCB 6-layer, top/bottom layer 2 oz, inner layers 1 oz, standard FR4, 168mm x 107 mm (L x W), thickness 1.6 mm 1 A possibly mounted heatsink is not considered. The overall high is given by using C19, C28 and C37 in circuit DC link.
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1.2 Overview
Figure 1 presents the 3D CAD view of the system. The board is equipped with seven MOSFETs equipped in a PG- TDSON-8 package (SSO8), one microcontroller with LIN and integrated 3-phase BLDC MOSFET gate driver. The board allows for the configuration of the common low-side shunt-resistor of the B6-bridge using three resistors connected in parallel. All active components, including the seven MOSFETs and the driver IC, are arranged over a large-area on the bo ard to distribute heat evenly across the PCB. The shunt resistors , serving as passive components, also act as additional heat sources, collecting all return current from the three legs of the bridge. The board is designed to dissipate heat from the shunt resistors effectively through thermal pads. As the power circuitry part of the PCB does not have any surface -mounted components on the bottom side , a simple flat heatsink can be attached to the underside of the board. Only the controller side features through-hole connectors and a switch. Figure 1 View to the evaluation Generic Power Board (top and bottom view)
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1.3 Highlighted Products
The components highlighted with a grey background are used on the Generic Power Board.
1.3.1 OptiMOSTM-7 40 V SSO8 (TDSON-8) MOSFET
The SSO8 package features a compact 33mm² footprint and provides and drain -to-source on-state resistance RDS(on) typically ranging from 0. 42 mΩ to 3 mΩ. Its current rating is up to 3 times higher than that of the S3O8 (TSDSON-8) package. When combined with Infineon’s OptiMOS ™-7 40 V power MOS technology, the TDSON package delivers a compact yet powerful solution for automotive 3-phase motor drives up to 400W, maintaining Infineon’s renowned quality and robustness for automotive packages. Table 2 Automotive SSO8 MOSFET with 40 V OptiMOS TM-7 Package Silicon Technology Product Max RDS(on) [mΩ] SSO8 (TDSON-8) OptiMOSTM-7 IAUCN04S7L005 0.5 IAUCN04S7L006 0.6 IAUCN04S7L009 0.9 IAUCN04S7L011 1.1 IAUCN04S7L014 1.4 IAUCN04S7L019 1.9 IAUCN04S7L028 2.8 IAUCN04S7N005 0.5 IAUCN04S7N006 0.6 IAUCN04S7N009 0.9 IAUCN04S7N012 1.2 IAUCN04S7N015 1.5 IAUCN04S7N020 2.0 IAUCN04S7N030 3.0
Evaluation Design Guide 9 of 41 rev. 1.0 2024-06-05 1.3.2 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3 The TLE987x family caters to a broad spectrum of start 3-phase b rushless DC moto r control applications , including auxiliary pumps and fans. It provides a high level of integration and low system cost, optimizing these application segments. Additionally, it offers scalability with varying flash memory sizes and MCU system clock frequencies, supporting a wide array of motor control algorithms, both sensor-based and sensor-less. For further details about the product family, please visit Infineon’s website at the link provided below.
- www.infineon.com/tle987x Table 3 Product Family of 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3 Grade Product Flash RAM Frequency Interface Tjmax Grade-0 TLE9873QXW40 48 kByte 3 kByte 40 MHz PWM + LIN 175 °C TLE9877QXW40 64 kByte 6 kByte 40 MHz PWM + LIN 175 °C TLE9879QXW40 128 kByte 6 kByte 40 MHz PWM + LIN 175 °C Grade-1 TLE9871QXA20 36 kByte 3 kByte 24 MHz PWM 150 °C TLE9872QXA40 256 kByte 8 kByte 40 MHz PWM + LIN 150 °C TLE9872-2QXA40 256 kByte 8 kByte 40 MHz PWM + LIN 150 °C TLE9877QXA20 64 kByte 6 kByte 24 MHz PWM + LIN 150 °C TLE9877QXA40 64 kByte 6 kByte 40 MHz PWM + LIN 150 °C TLE9879QXA20 128 kByte 6 kByte 24 MHz PWM + LIN 150 °C TLE9879-2QXA40 128 kByte 6 kByte 40 MHz PWM + LIN 150 °C TLE9879QXA40 128 kByte 6 kByte 40 MHz PWM + LIN 150 °C
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2 Getting Started
2.1 Toolchain Installation
To prepare the board for operation , the software listed in Table 4 must be installed. The µVision software is a development tool provided by Arm® Keil® . Although the shareware version of µVision has a code length limitation, it still allows for editing, compiling and debugging. The Infineon Config Wizard is used to configure the peripherals of the E mbedded Power IC. This tool can be accessed from the µVision pull-down menu, enabling users to adjust parameters through its user interface and subsequently generate the corresponding software code. Infineon also provides standard motor drive software codes for the Embedded Power IC , which can be downloaded via the Pack Installer within the µVision software. Table 4 Software Toolchain Installation Guide Steps Company Description STEP1 Download and Install Keil® µVision5 Arm® Keil®
- Arm® Keil® µVision is an integrated development environment which consists of code editor, compiler and debugger.
- To learn how to use Arm® Keil® µVision 5, check out our video "Get your motor spinning". STEP2 Download Config Wizard Infineon Technologies
- Infineon provides the Config Wizard free of charge, which is designed for configuration of chip modules. Config Wizard supports easy configuring of Embedded Power IC peripherals.
- Config Wizard can be installed via the Infineon Developer Center. If you don’t have this Infineon toolbox yet, please go to Infineon Developer Center Launcher and enjoy the release management for updates. STEP3 Download and Install Segger J-Link Driver XMC Link based on SEGGER J-Link technology
- XMC Link is a debug probe for all XMC microcontrollers
- The debug probe is based on Segger J-Link debug firmware, which enables use with DAVE and all major third-party compiler/IDEs known from the wide ARM ecosystem STEP4 Download the SDK via µVision5 Pack Installer Infineon Technologies
- The Embedded Power Software Development Kit (SDK) is a low-level driver library which can be downloaded within Keil® µVision via the "Pack Installer" For the toolchain installation and free motor drive software, please visit the website at the link below. Getting Started - Toolchain Installation Guide for TLE987X EVALB For more information about the tool chain installation steps, please watch the video at the link below. Getting Started - Toolchain Installation Guide for TLE987X EVALB - Video
2.1.1 Configuration
To configure the system, follow these steps: open a motor drive code project in µVision5, then navigate to “Tools” and select “Config Wizard”. Next, set up the parameters for the motor, speed/current controller and the TLE987x peripherals. Given that the Embedded Power IC employs a current-source gate driving scheme, the switching speed is set by the “Gate Charge/Discharge” parameters in the BDRV tap of the peripherals, rather than by the gate resistors. For further configuration details, please visit the Infineon website for Embedded Power ICs.
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3 System Design
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3.1 Electrical Design and Components
3.1.1 Input Filter
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3.1.2 Reverse Polarity Protection
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3.1.3 DC-link Electrolytic Capacitor
3.1.4 Shunt Resistor
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3.1.5 Snubber
3.1.6 Gate Driver
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3.1.7 Gate driver circuit
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3.1.8 Heatsink
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3.2 Switching Performance
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3.3 EMC performance
3.3.1 Measurement configuration
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3.3.2 Measurement results
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3.4 Thermal performance
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4 Project Collaterals
4.1 Schematics
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4.2 Bill of Material
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4.3 Layout
4.3.1 PCB Stack
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4.3.2 Layout Printing
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5 Abbreviations and definitions
ADC Analogue-to-Digital Conversion BDRV Bridge Driver Module of Embedded Power IC BLDC Brushless Direct Current BOM Bill of material CISPR Comité International Spécial des Perturbations Radioélectriques DC Direct Current DIL Dual-In-Line DUT Device Under Test ECF Engine Cooling Fan EMC Electromagnetic Compatibility ESR Equivalent Series Resistant FOC Field Oriented Control GPIO General Purpose Input/Output IC Integrated Circuit LIN Local Interconnect Network LISN Line Impedance Stabilization Network MCU Microcontroller Unit MI Modulation Index MLCC Multi-Layer-Ceramic Capacitor MOSFET Metal Oxide Semiconductor Field Effect Transistor PCB Printed Circuit Board PG-TDSON Plastic Green- Thin Dual Small-Outline Non-leaded PWM Pulse Width Modulation RAM Random Access Memory RBP Reverse Battery Protection RC Resistor-Capacitor RISC Reduced Instruction Set Computer RMS Root-Mean-Square value S3O8 Shrink Super Small-Outline 8 pin SDK Software Development Kit SMD Surface-Mounted Device SMT Surface-Mounted Technology SoC System On a Chip
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6 Reference documents
This document should be read in conjunction with the following documents: [1] TLE9879QXA40 data sheet, Infineon Technologies AG, https://www.infineon.com/dgdl/Infineon- TLE9879QXA40-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c81ae03fc0181d840096a3c2f [2] XMC Link user’s manual, Infineon Technologies AG, https://www.infineon.com/dgdl/Infineon- XMC_Link_Board_Users_Manual.pdf-UserManual-v01_00- EN.pdf?fileId=5546d462518ffd850152451695e45edc [3] TLE986x_TLE987x Bridge Driver Application Note, 2022-05-02, Infineon Technologies AG, Rev 1.03 https://www.infineon.com/dgdl/Infineon-AppNote-TLE986x-TLE987x-FAQ-Application-Hints_3- ApplicationNotes-v01_03-EN.pdf?fileId=5546d4625b62cd8a015ba9870bd91373 [4] IAUCN04S7N005 datasheet, Infineon Technologies AG, https://www.infineon.com/dgdl/Infineon- IAUCN04S7N005-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8900bb5701890621ba151fdb [5] IAUCN04S7N009 datasheet, Infineon Technologies AG https://www.infineon.com/dgdl/Infineon- IAUCN04S7N009-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d1b852e018d21fc142b1f38 [6] Analytical calculation of the RMS current stress on the DC-link capacitor of voltage-PWM converter [7] Snubber Capacitors Application Guide, 2018-01, Cornell Dubilier [8] ERU chokes datasheet, TDK, https://www.tdk-electronics.tdk.com/inf/30/ds/B82559B_A019.pdf [9] Heat sink profile, RS-Online, https://de.rs-online.com/web/p/kuhlkorper/1686330 [10] Thermal interface material TIM, DOWSIL TC-4060 Thermal Gel, https://www.dow.com/en-us/pdp.dowsil- tc-4060-thermal-gel.512275z.html?productCatalogFlag=1&#tech-content [11] Motor load, Nanotc DB42S02, https://en.nanotec.com/products/635-db42s02 [12] Current controlled hysteresis break, Mobac HB-50-2DS, https://www.mobac.de/fileadmin/user_upload/Mobac/PDF/strom/strom-stand-bs.pdf [13] User Manual TLE987x Microcontroller with LIN and BLDC MOSFET driver for automotive applications https://www.infineon.com/dgdl/Infineon-TLE987x_UM-UserManual-v01_08- EN.pdf?fileId=8ac78c8c81ae03fc0181d38669525fab [14] Reverse Polarity Protection for Embedded Power ICs Application Note, https://www.infineon.com/dgdl/Infineon-Reverse_Polarity_Protection-AN-v01_00- EN.pdf?fileId=5546d46267c74c9a01684be08bf45dfb [15] Generic power evaluation board design for 12 V application - SSO8 and TLE9879QXA40 https://www.infineon.com/dgdl/Infineon-EvaluationDesignGuide_MOSFET_GenericPowerBoard_V10.pdf- UserManual-v01_00-EN.pdf?fileId=8ac78c8c850f4bee0185babcb612156d
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Revision history
Major changes since the last revision Date Version Description 2024/06/05 1.0 First revision
81726 Munich, Germany
© 2024 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document? Email: erratum@infineon.com Document reference IMPORTANT NOTICE The information contained in this application note is given as a hint for the implementation of the product only and shall in no event be regarded as a description or warranty of a certain functionality, condition or quality of the product. Before implementation of the product, the recipient of this application note must verify any function and other technical information given herein in the real application. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non - infringement of intellectual property rights of any third party) with respect to any and all information given in this application note. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s tec hnical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. For further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office (www.infineon.com). WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. Edition 2024-06-05 Trademarks All referenced product or service names and trademarks are the property of their respective owners. Z8F80639070