IAM-91563

IAM-91563 AVAGO | Alldatasheet

Document overview

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• PDF pages: 14

Technical content

Features

• Lead-free Option Available
• +0 dBm Input IP3 at .9 GHz
• Single +3V Supply
• 8.5 dB SSB Noise Figure at .9 GHz
• 9.0 dB Conversion Gain at .9 GHz
• Ultra-miniature Package

Applications

• Downconverter for PCS, PHS, ISM, WLL, and other Wireless Applications

Description

Avago’s IAM-9563 is an economical 3V GaAs MMIC mixer used for frequency down-conversion. RF frequency cover- age is from 0.8 to 6 GHz and IF coverage is from 50 to 700 MHz. Packaged in the SOT-363 package, this 4.0 sq. mm. package requires half the board space of a SOT-43 and only 5% the board space of an SO-8 package. At .9 GHz, the IAM-9563 provides 9 dB of conversion gain, thus eliminating an RF or IF gain stage normally needed with a lossy mixer. LO drive power is nominally only -5 dBm, eliminating an LO buffer amplifier. The 8.5 dB noise figure is low enough to allow the system to use a low cost LNA. The -6 dBm Input IP 3 provides adequate system linearity for most commercial applications, but is adjustable to 0 dBm. The circuit uses GaAs PHEMT technology with proven reli - ability, and uniformity. The MMIC consists of a cascode FET structure that provides unbalanced gm modulation type mixing. An on-chip LO buffer amp drives the mixer while bias circuitry allows a single +3V supply (through a choked IF port). The LO port is internally matched to 50 Ω. The RF and IF ports are high impedance and require external matching networks. Surface Mount Package: SOT-363 (SC-70) MGA-86563 Pkg Pin Connections and Package Marking IF and Vd GND 91LO GND RF

4 SOURCE

Note: . Package marking provides orientation and identification. LO SOURCE BYPASS 4RF GROUND 2, 5 IF and Vd Simplified Schematic Attention: Observe precautions for handling electrostatic sensitive devices. ESD Human Body Model (Class 0) Refer to Avago Application Note A004R: Electrostatic Discharge Damage and Control.

Thermal Resistance [2]: θch-c = 30°C/W Notes: . Permanent damage may occur if any of these limits are exceeded. . TC = 5°C (TC is defined to be the temperature at the package pins where contact is made to the circuit board). Symbol Parameters and Test Conditions Units Min. Typ. Max. Std Dev[2] Gtest Gain in test circuit[] RF=890 MHz, IF=50 MHz dB 4.0 9.0 NFtest Noise Figure in test circuit[] RF=890 MHz, IF=50 MHz dB 8.5 .0 Id Device Current mA 6.0 9.0 .0 NF Noise Figure (RF & IF with external matching, f = 0.9 GHz dB 7.0 IF=50 MHz, LO power=-5 dBm) f = .9 GHz 8.5 0.5 f = .4 GHz .0 f = 4.0 GHz 6.5 f = 6.0 GHz 8.0 Gc Conversion gain (RF and IF with external matching, f = 0.9 GHz dB .0 IF=50 MHz, LO power=-5 dBm) f = .9 GHz 9.0 .5 f = .4 GHz 7.7 f = 4.0 GHz 4.6 f = 6.0 GHz .7 P dB Output power @ dB compression (RF and IF with f = 0.9 GHz dBm -6.7 external matching, IF=50 MHz, LO power =-5 dBm) f = .9 GHz -8.0 .3 f = .4 GHz -8.7 f = 4.0 GHz -5.0 f = 6.0 GHz -7.8 RLRF RF port return loss f = 0.5 - 6.0 GHz dB -.7 0. RLLO LO port return loss f = 0.5 - 6.0 GHz dB -9.4 0.3 RLIF IF port return loss f = 50 - 700 MHz dB -3.7 0. IP3 Input Third Order Intercept Point RF = .9 GHz, IF = 50 MHz dBm -6.0 .3 Id = 9.0 mA, LO power = -5 dBm IP3 Input Third Order Intercept Point RF = .9 GHz, IF = 50 MHz dBm 0 . Id = 5 mA, LO power = - dBm ISOLL-R LO-RF Isolation RF = .9 GHz dB 8 ISOLR-I RF-IF Isolation (No Match) dB ISOLR-I LO-IF Isolation (No Match) dB 4 Notes: . Guaranteed specifications are 00% tested in the circuit in Figure 8 in the Applications Information section. . Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during the initial characterization of this product, and is intended to be used as an estimate for distribution of the typical specification. Absolute Symbol Parameter Units Maximum[1] Vd Device Voltage, RF output to ground V 6.0 VRF, VLO RF voltage or LO voltage to ground V +0.5, -.0 Pin CW RF Input Power dBm +3 Tch Channel Temperature °C 50 TSTG Storage Temperature °C -65 to 50

IAM-91563 Typical Reflection Coefficients, TC=25°C, ZO = 50 Ω, Vd =3 V Frequency (GHz) RF (Mag) RF (Ang) LO (Mag) LO (Ang) IF (Mag) IF (Ang) 0. 0.43 - 0.64 -8 0. 0.39 -6 0.63 -9 0.5 0.39 -0 0.6 - 0.6 0.39 - 0.6 - 0.7 0.40 -4 0.6 -3 0.8 0.9 -8 0.39 -4 0.9 0.9 - 0.39 -6 0.9 -3 0.38 -7 . 0.9 -5 0.39 -7 . 0.9 -8 0.39 -9 .3 0.88 -9 0.40 - .4 0.87 -3 0.39 - .8 0.8 -37 0.39 -7 .9 0.8 -37 0.38 -9 0.8 -39 0.39 -9 . 0.8 -40 0.38 -3 . 0.8 -4 0.38 -3 .3 0.8 -4 0.37 -3 .5 0.80 -45 0.36 -34 .6 0.80 -45 0.36 -35 3 0.8 -5 0.34 -37 3. 0.83 -53 0.33 -38 3. 0.83 -55 0.33 -39 3.3 0.83 -56 0.3 -39 3.4 0.85 -59 0.3 -40 3.8 0.83 -7 0.30 -45 3.9 0.83 -7 0.30 -43 4 0.8 -73 0.9 -46 4.4 0.84 -85 0.7 -49 4.5 0.84 -87 0.8 -50 4.6 0.85 -9 0.6 -5 4.9 0.85 -00 0.7 -54 5 0.85 -03 0.5 -54 5.5 0.84 -7 0.7 -6 5.6 0.83 - 0.5 -6 5.8 0.8 -5 0.5 -65 5.9 0.8 -8 0.6 -67 6 0.80 -30 0.4 -65

250 MHz

1640 MHz

1890 MHz

less applications with RF bands from 800 MHz to 6 GHz. a cascode connected pair of FETs as shown in Figure 7. of - dBm will boost the input IP3 to approximately 0 dBm. (Id) parameters shown in the table of Electrical Specifications. Figure 17. Cascode FET Mixer. ductance mixer. ” The IF is taken from the drain of FET. amount of LO input power required by the mixer. Figure 18. Test Circuit. of these guaranteed parameters is 00% tested.

the center of the Smith chart. the inductance of the paths to ground. Figure 28. PCB Layout.

1.9 GHz Design Example

assemble the mixer and verify performance. Figure 29. Schematic of Example Application Circuit. Figure 30. RF Input Impedance Match. Figure 31. IF Input Impedance Match.

wanted RF feedback through bias lines. “de-Q” the bias circuit and eliminate resonance effects. Table 1. Component Values for 1.9 GHz Downconverter. series inductance in C), as well as other circuit parasitics. to fully analyze and account for these circuit variables. Figure 32. Complete 1.9 GHz Mixer.

Outline 63 (SOT-363/SC-70) Note: For lead-free option, the part number will have the character “G” at the end. Part Number Ordering Information No. of Part Number Devices Container IAM-9563-TR 3000 7" Reel IAM-9563-TR 0000 3" Reel IAM-9563-BLK 00 antistatic bag IAM-9563-TRG 3000 7" Reel IAM-9563-TRG 0000 3" Reel IAM-9563-BLKG 00 antistatic bag EHE D e b AA2 L c DIMENSIONS (mm) MIN. MAX.SYMBOL

0.650 BCS

.80 .80 0.80 0.80 0.00 0.0 0.5 0.0 0.0 .35 .40 .00 0.0 0.40 0.30 0.0 0.30 E D HE A A A Q e b c L NOTES: . All dimensions are in mm. . Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to EIAJ SC70. 5. Die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. Package surface to be mirror finish.

Tape Dimensions and Product Orientation For Outline 63 Device Orientation For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4218EN AV02-1701EN - December 9, 2008 P F W C D E 10 MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 10 MAX. DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER P D .40 ± 0.0 .40 ± 0.0 .0 ± 0.0 4.00 ± 0.0 .00 + 0.5 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.57 ± 0.004 0.039 + 0.00 CAVITY DIAMETER PITCH POSITION D E .55 ± 0.0 4.00 ± 0.0 .75 ± 0.0 0.06 + 0.00 0.57 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W t 8.00 + 0.30 - 0.0 0.54 ± 0.0 0.35 + 0.0 0.000 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F P 3.50 ± 0.05 .00 ± 0.05 0.38 ± 0.00 0.079 ± 0.00 DISTANCE WIDTH TAPE THICKNESS C Tt 5.40 ± 0.0 0.06 ± 0.00 0.05 + 0.004 0.005 ± 0.0004 COVER TAPE USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL END VIEW 8 mm 4 mm TOP VIEW 91 91 91 91