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5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS I607 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 1 Pin Connection
1 Control Voltage
2 Enable / Disable
3 Ground
4 Output
5 N.C.
6 Vdd
5.08 4.2 2.0 Bypass =0.01 uF 7.0 0.3 5.0 0.2 Dimension Units: mm Recommended Pad Layout 5.08 2.0 Max. Product Features: Applications: Small Surface Mount Package SD/HD Video Low Noise Wireless Base Stations Pb Free/ RoHS Complient Sonet /SDH Compatible with Leadfree Processing Server and Storage Frequency 1 MHz to 77.760 MHz Output Level LVDS LVPECL Vod = 393 mV Typ., 475 mV Max. ‘0’ = Vcc - 1.63 V Max. ‘1’ = Vcc - 1.02 V Min. Duty Cycle 50% ±10% Rise / Fall Time 0.6 nS Max. Output Load LVDS LVPECL 100 Differential 50 to Vcc - 2.0 VDC Frequency Stability 50 ppm Max. Start-up Time 10 mS Max. Supply Voltage 3.3 VDC ± 5% Current LVDS = 90 mA Max., LVPECL = 130 mA Max. Linearity 15% Max. Pullability See Table Below Control Voltage 1.65 VDC ± 1.5 VDC Input Impedance 50K Min. Jitter <1.0 pS RMS (12 kHz to 20 MHz)* Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. *Frequency related, for additional information contact your sales representative. Not available for all temperature ranges. Part Number Guide Sample Part Number: I607–1BC8H–77.760 Package Operating Temperature Stability (in ppm) Pullability Output Enable / Disable Frequency I607 1 = 0 C to +70 C D = 15 B = 50 ppm 8 = LVDS H = Enable -77.760 MHz 3 = -20 C to +70 C A = 25 C = 100 ppm 9 = LVPECL 2 = -40 C to +85 C B = 50 C = 100
5 mm x 7 mm Ceramic Package SMD VCXO, LVPECL / LVDS I607 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: Frequency Quantity per Reel 1000 A 16 +/-.3 B 8 +/-.2 C 7.5 +/-.2 D 17.5 +/-1 E 50 / 60 / 80 F 180 / 250