I606 ILSI | Alldatasheet
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10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS I606 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 1 Pin Connection
1 Voltage Control
2 Enable/Disable
3 GND
4 Output
5 Comp. Outout
6 Vcc
Dimension Units: mm 0.5 Typ. 10.2 Max. 14.3 Max. 6.0 Max. 2.54 0.8 8.8 3.0 Recommended pad layout Product Features: Applications: Small Surface Mount Package SD/HD Video Low Noise Wireless Base Stations Pb Free/ RoHS Complient Sonet /SDH Compatible with Leadfree Processing Server and Storage Frequency 1 MHz to 180.000 MHz Output Level LVDS LVPECL Vod = 393 mV Typ., 475 mV Max. ‘0’ = Vcc - 1.63 V Max. ‘1’ = Vcc - 1.02 V Min. Duty Cycle 50% ±10% Rise / Fall Time 0.6 nS Max. Output Load LVDS LVPECL 100 Ω Differential 50 Ω to Vcc - 2.0 VDC Frequency Stability 50 ppm Max. Start-up Time 10 mS Max. Supply Voltage 3.3 VDC ± 5% Current LVDS = 90 mA Max., LVPECL = 130 mA Max. Linearity 15% Max. Pullability See Table Below Control Voltage 1.65 VDC ± 1.5 VDC Input Impedance 50K Ω Min. Jitter <1.0 pS RMS (12 kHz to 20 MHz)* Operating See Operating Temperature Table in Part Number Guide Storage -55° C to +125° C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. *Frequency related, for additional information contact your sales representative. Not available for all temperature ranges. Part Number Guide Sample Part Number: I606–1BC8H–155.520 Package Operating Temperature Stability (in ppm) Pullability Output Enable / Disable Frequency I606 1 = 0° C to +70° C D = ±15 B = ±50 ppm 8 = LVDS H = Enable -155.520 MHz 3 = -20° C to +70° C A = ±25 C = ±100 ppm 9 = LVPECL 2 = -40° C to +85° C B = ±50 C = ±100
10 mm x 14 mm, FR-4 SMD VCXO, LVPECL / LVDS I606 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_C Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code (YWW) Line 2: XXXXX (I606-XXXXX- Freq) Line 3: Frequency Quantity per Reel 1000 A 16 +/-.3 B 8 +/-.2 C 7.5 +/-.2 D 17.5 +/-1 E 50 / 60 / 80 F 180 / 250