DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 2
Technical content
5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS I605 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 12/10_C Specifications subject to change without notice Page 1 Pin Connection
1 Control Voltage
2 Enable / Disable
3 Ground
4 Output
5 N.C.
6 Vdd
5.08 4.2 2.0 Bypass =0.01 uF 7.0 0.3 5.0 0.2 Dimension Units: mm Recommended Pad Layout 5.08 2.0 Max. Product Features: Applications: Small Surface Mount Package SD/HD Video Based Output for many frequencies Wireless Base Stations CMOS/TTL Compatible Logic Levels Sonet /SDH Compatible with Leadfree Processing VoIP T1/E1, T3/E3 Frequency 1 MHz to 170.000 MHz Output Level HC-MOS TTL ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Duty Cycle 50% ±5% Rise / Fall Time 10.0 nS Max. Output Load 15pF, Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 TTL Frequency Stability 50 ppm Max. Start-up Time 10 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Pull Range See Pullability Table Current 50 mA Max** Linearity 10% Max. Temperature Operating Storage See Operating Temperature Table in Part Number Guide -55 C to +125 C Phase Jitter <3 pS RMS NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available at all frequencies. ** Frequency, supply, and load related parameters. Part Number Guide Sample Part Number: I605-1BC3H-20.000 Package Operating Temperature Stability (in ppm) Pullability Supply Voltage Enable / Disable Frequency I605 - 1 = 0 C to +70 C *D = 15 B = 50 PPM Min. 5 = 5.0 VDC H = Enable - 20.000 MHz 6 = -10 C to +70 C A = 25 C = 100 PPM Min. 3 = 3.3 VDC 3 = -20 C to +70 C B = 50 4 = -30 C to +75 C C = 100 2 = -40 C to +85 C
5 mm x 7 mm Ceramic Package SMD VCXO, TTL / HC-MOS I605 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 12/10_C Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: Frequency Quantity per Reel 1000 A 16 +/-.3 B 8 +/-.2 C 7.5 +/-.2 D 17.5 +/-1 E 50 / 60 / 80 F 180 / 250