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3.2 mm x 5.0 mm Ceramic Package SMD VCXO, TTL / HC-MOS I604 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 08/11 Specifications subject to change without notice Page 1 Recommended Pad Layout Dimension Units: mm Pin Connection
1 V Control
2 E/D(N.C.)
3 GND
4 Output
5 N.C.(E/D)
6 VDD
Product Features: Applications: Small Surface Mount Package SD/HD Video CMOS/TTL Compatible Logic Levels Sonet /SDH Compatible with Leadfree Processing VoIP T1/E1, T3/E3 Base Station Frequency 77.760 MHz to 200.000 MHz Output Level (HCMOS) V OH = 90% VDD Min. VOL = 10% VDD Max. Duty Cycle 50% ±10% Std.(5% optional) Rise / Fall Time 10.0 nS Max. Output Load 15pF Frequency Stability See Table Below Start-up Time 10 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % 3.3 VDC, 2.5 VDC ±2.0 VDC for 5.0 VDC Pull Range ±100 ppm min. (Std). See Table Below. Current 50.0 mA Max. Enable/Disable(Pin 2 or Pin 5) 70% VDD Min. / 30%VDD Max. Linearity 10% Aging ±5ppm/year Max. (±3ppm optional) Phase Jitter (12kHz to 20kHz) 6.0 pS Max. Period Jitter (PK-PK) 100pS Max. Temperature Operating Storage See Below -55 C to +125 C NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available at all voltages. Part Number Guide Sample Part Number: I604-1BC3H2-77.760 Package Operating Temperature Stability (in ppm) Pullability Supply Voltage Enable / Disable Frequency I604 - 1 = 0 C to +70 C F = 20 B = 50 PPM Min. 5 = 5.0 VDC H2 = Enable(pin 2) - 77.760 MHz 2 = -40 C to +85 C A = 25 C = 100 PPM Min.* 3 = 3.3 VDC H5 = Enable(pin 5) B = 50 K = 150 PPM Min.* 6 = 2.5 VDC
3.2 mm x 5.0 mm Ceramic Package SMD VCXO, TTL / HC-MOS I604 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 08/11 Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: Frequency Quantity per Reel 1000 A 16 +/-.3 B 8 +/-.2 C 7.5 +/-.2 D 17.5 +/-1 E 50 / 60 / 80 F 180 / 250