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Surface Mount Oscillator, OCXO ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 04/11_B Specifications subject to change without notice Page 1 12.0 22.1 17.78 25.4 2.54 2.54 7.62 7.62 17.78 3.56 3.30 23.5 3 4 Recommended Land Pattern Dimension Units: mm Pin Function
1 V control
2 N.C.
3 Vdd
4 Output
5 N.C. 6 N.C
7 GND
Product Features: Applications: Available in Both Sinewave and Telecommunications HCMOS outputs Data Communications RoHS Compliant Instrumentation Test and Measurement Part Number Guide Sample Part Number: I414-325A4V-20.000 MHz NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Frequency, supply, and load related parameters. Frequency 10.000 MHz, 13.000 MHz and 20.000 MHz Output Level HC-MOS Sine ‘0’ = 10% Vcc Max., ‘1’ = 90% VDC typ. +4dBm, ±3dBm Duty Cycle (HC-MOS) 50% ±5% Rise / Fall Time 10 nS Max. @ Fo <16 Mhz, 5 nS Max. @ Fo >16 Mhz. Output Load HC-MOS Sine 15 pf 50 ohms Frequency Stability See Frequency Stability Table Supply Voltage 3.3 V ±5% Current (Warm Up) Current @ 25 C 1200 mA Max. 400 mA Control Voltage Pullability 1.65VDC ±1.65 VDC ≥ ±0.5PPM Operating See Operating Temperature Table in Part Number Guide Storage -40 C to +85 C Package Input Voltage Operating Temperature Symmetry (Duty Cycle) Output Frequency Stability (in ppm) Voltage Control Frequency I414 - 3 = 3.3V 7 = 0 C to +50 C 5 = 45 / 55 Max. 3 = 15pF HC-MOS Y = 0.5 V = Controled -20.000 MHz 1 = 0 C to +70 C A = Sine 1 = 0.25 F = Fixed 2 = -40 C to +85 C
Surface Mount Oscillator, OCXO ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 04/11_B Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXXXX (Part Number detail = I414-XXXXXX-Freq.) Line 2: Frequency