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Leaded Oscillator, OCXO Metal Package, Full Size DIP I401 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 01/11_C Specifications subject to change without notice Page 1 12.6 20.7 15.24 Dimension Units: mm Pin Connection
1 Control Voltage
2 GND
3 Output
4 Vcc
0.86 0.048 6 Min. 10 Max. 7.62 Product Features: Applications: Available in Both Sinewave and Telecommunications HCMOS/TTL Compatible outputs Data Communications RoHS Compliant Instrumentation Test and Measurement NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Frequency, supply, and load related parameters. Frequency 1.000 MHz to 50.000 MHz Output Level HC-MOS TTL Sine ‘0’ = 0.1 Vcc Max., ‘1’ = 4.5 VDC Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. +4dBm, ±3dBm Duty Cycle 50% ±10% or ±5% See Table Rise / Fall Time 10 nS Max. Output Load HC-MOS TTL Sine See Output Table 15 pF 50 ohms Frequency Stability See Frequency Stability Table Supply Voltage See Supply Voltage Table Current (Warm Up) Current @ 25 C 400 mA @ 5 VDC, 170 mA @ 12 VDC Max. 120 mA @ 5 VDC, 60 mA @ 12 VDC Typ. Control Voltage 2.5 VDC ±2.0 VDC, ±8 ppm Min. Slope Positive Operating See Operating Temperature Table in Part Number Guide Storage -55 C to +125 C Part NumberGuide Sample Part Number: I401-5151YV-20.000 MHz Package Input Voltage Operating Temperature Symmetry (Duty Cycle) Output Frequency Stability (in ppm) Voltage Control Frequency I401 - 3 = 3.3 V 7 = 0 C to +50 C 5 = 45 / 55 Max. 1 = 10 TTL / 15pF HC-MOS N = 1.0 V = Controlled -20.000 MHz 5 = 5.0 V 1 = 0 C to +70 C 6 = 40 /60 Max. 3 = 15pF HC-MOS Y = 0.5 F = Fixed 9 = 12 V 6 = -10 C to +75 C 6 = 30pF 1 = 0.25 3 = -20 C to +70 C A = Sine 2 = 0.1 3 = 0.05*
Leaded Oscillator, OCXO Metal Package, Full Size DIP I401 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 01/11_C Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e1 (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXXXX (Part Number detail = I401-XXXXXX-Freq.) Line 2: Frequency