I202 ILSI | Alldatasheet
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Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP I202 / I203 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_B Specifications subject to change without notice Page 1 20.7 5.1 Max. 6 Min. 0.048 0.36 6 Min. 5.1 Max. 0.36 0.48 7.62 7.62 7.62 15.24 12.6 12.6 1 2 Dimension Units: mm Pin Connection
1 Control Voltage
2 GND
3 Output
4 Vcc
12.6 Product Features: Applications: CMOS/TTL Compatible Logic Levels Server & Storage Low Noise Sonet /SDH Compatible with Leadfree Processing 802.11 / Wifi RoHS Compliant T1/E1, T3/E3 NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 4) and GND (pin 2) to minimize power supply noise. * Frequency, supply, and load related parameters. Frequency related, for additonal information contact your sales representative. Frequency 1 MHz to 51.840 MHz Output Level HC-MOS TTL ‘0’ = 0.1 Vcc Max., ‘1’ = 0.9 Vcc Min. ‘0’ = 0.4 VDC Max., ‘1’ = 2.4 VDC Min. Duty Cycle 50% ±5% Rise / Fall Time 10 nS Max.* Output Load HC-MOS TTL Fo < 50 MHz = 10 TTL, Fo > 50 MHz = 5 LSTTL 15 pF Frequency Stability See Frequency Stability Table Supply Voltage See Input Voltage Table, tolerance ±10 % Current 50 mA Max.* VCC = 5.0 VDC Slope Positive Jitter <1.0 pS RMS (12 kHz to 20 MHz)** Operating See Operating Temperature Table in Part Number Guide Storage -55° C to +125° C Part Number Guide Sample Part Number: I202-1BC3-27.000 MHz Package Operating Temperature Frequency Stability Pullability Supply Voltage Frequency I202 - I203 - 1 = 0° C to +70° C F = ±20 ppm B = ±50 ppm min. 5 = 5.0 VDC - 27.000 MHz 3 = -20° C to +70° C X = ±30 ppm C = ±100 ppm min. 3 = 3.3 VDC 4 = -30° C to +75° C B = ±50 ppm K = ±150 ppm min. 2 = -40° C to +85° C C = ±100 ppm L = ±200 ppm min.
Leaded Oscillator, VCXO, TTL / HC-MOS Metal Package, Full Size DIP and Half DIP I202 / I203 Series ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com 10/10_B Specifications subject to change without notice Page 2 Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4- (Sn / Cu / Ag over Ni over Kovar base metal). Environmental Specifications Thermal Shock MIL-STD-883, Method 1011, Condition A Moisture Resistance MIL-STD-883, Method 1004 Mechanical Shock MIL-STD-883, Method 2002, Condition B Mechanical Vibration MIL-STD-883, Method 2007, Condition A Resistance to Soldering Heat J-STD-020C, Tabl e 5-2 Pb-free devices (except 2 cycles max) Hazardous Substance Pb-Free / RoHS / Green Compliant Solderability JESD22-B102-D Method 2 (Preconditioning E) Terminal Strength MIL-STD-883, Method 2004, Test Condition D Gross Leak MIL-STD-883, Method 1014, Condition C Fine Leak MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s Solvent Resistance MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: XXXX (Part Number detail = I203-XXXX-Freq.) Line 3: Frequency