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Features
Dual Marked with Device Part Number and DLA Standard Microcircuit Drawing ac/dc Signal &Power Switching Compact Solid-State Bidirectional Switch Manufactured and Tested on a MIL-PRF-38534Certifi ed Line QML-38534 MIL-PRF-38534 Class H Modifi ed Space Level Processing Available (Class E) Hermetically Sealed 8-Pin Dual In-Line Package Small Size and Weight Performance Guaranteed over -55°C to 125°C Connection A0.8 A, 1.0 Ω Connection B1.6 A, 0.25 Ω 1500 Vdc Withstand Test Voltage High Transient Immunity 5 Amp Output Surge Current
Applications
Military and Space High Reliability Systems Standard 28 Vdc and 48 Vdc Load Driver Standard 24 Vac Load Driver Aircraft Controls ac/dc Electromechanical and Solid State Relay Replacement I/O Modules Harsh Industrial Environments
Description
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and SMD 5962-93140 are single channel power MOSFET opto- couplers, constructed in eight-pin, hermetic, dual-in-line, ceramic packages. The devices operate exactly like a solid- state relay. The products are capable of operation and storage over the full military temperature range and may be pur- chased as a standard product (HSSR-7110), with full MIL- PRF-38534 Class H testing (HSSR-7111 and HSSR- 7112), with MIL-PRF-38534 Class E testing (Class K with excep- tions) (HSSR-711E) or from the DLA Standard Microcircuit Drawing (SMD) 5962-93140. Details of the Class E program may be found on page 11 of this datasheet. Functional Diagrams CONNECTION A AC/DC CONNECTION NC NC CONNECTION B DC CONNECTION IF V F IO V O NC NC IF V F IO V O TRUTH TABLE INPUT OUTPUT H CLOSED L OPEN CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
All devices are manufactured and tested on a MIL- PRF-38534 certifi ed line and are included in the DLA Qual- ifi ed Manufacturers List, QML-38534 for Hybrid Microcir- cuits. Each device contains an AlGaAs light emitting diode optically coupled to a photovoltaic diode stack which drives two discrete power MOSFETs. The device oper- ates as a solid-state replacement for single-pole, normally open, (1 Form A) relay used for general purpose switching of signals and loads in high reliability applications. The devices feature logic level input control and very low output on-resistance, making them suitable for both ac and dc loads. Connection A, as shown in the Functional Diagram, allows the device to switch either ac or dc loads. Connection B, with the polarity and pin confi guration as shown, allows the device to switch dc loads only. The ad- vantage of Connection B is that the on-resistance is sig- nifi cantly reduced, and the output current capability in- creases by a factor of two. The devices are convenient replacements for mechanical and solid state relays where high component reliability with standard footprint lead confi guration is desirable. Devices may be purchased with a variety of lead bend and plating options. See Selection Guide table for details. Standard Microcircuit Drawing (SMD) parts are available for each package and lead style. The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and SMD 5962-93140 are designed to switch loads on 28 Vdc power systems. They meet 80 V surge and ± 600 V spike requirements. Selection Guide – Lead Confi guration Options Avago Technologies’ s Part Number and Options Commercial HSSR-7110 MIL-PRF-38534 Class H HSSR-7111 HSSR-7112 MIL-PRF-38534 Class E HSSR-711E Standard Lead Finish Gold Plate Gold Plate Gold Plate Solder Dipped* Option #200 Option -200 Option -200 Butt Joint/Gold Plate Option #100 Option -100 Gull Wing/Soldered* Option #300 Option -300 Crew Cut/Gold Plate Option #600 SMD Part Number Prescript for all below 5962- 5962- Gold Plate 9314001HPC 9314002HPC 9314001EPC Solder Dipped* 9314001HPA 9314002HPA 9314001EPA Butt Joint/Gold Plate 9314001HYC 9314002HYC Butt Joint/Soldered* 9314001HYA 9314002HYA Gull Wing/Soldered* 9314001HXA 9314002HXA Crew Cut/Gold Plate 9314001HZC Crew Cut/Soldered* 9314001HZA * Solder Contains Lead CAUTION: Maximum Switching Frequency – Care should be taken during repetitive switching of loads so as not to exceed the maximum output current, maximum output power dissipation, maximum case temperature, and maximum junction temperature.
Maximum Output MOSFET Junction to Case – θJC = 15°C/W ESD Classifi cation Outline Drawing 8-pin DIP Through Hole Device Marking 3.81 (0.150 ) MIN. 4.32 (0.170 ) MAX. 9.40 (0.370) 9.91 (0.390) 0.51 (0.020 ) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.76 (0.030) 1.27 (0.050) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008 ) 0.33 (0.013 ) 7.16 (0.282 ) 7.57 (0.298 ) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). COMPLIANCE INDICATOR, * DATE CODE, SUFFIX A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 COUNTRY OF MFR. AVAGO CAGE CODE* AVAGO DESIGNATOR DLA SMD* PIN ONE/ ESD IDENT AVAGO P/N DLA SMD* * QUALIFIED PARTS ONLY (IF NEEDED) Absolute Maximum Ratings Parameter S ymbol Min. Ma x. Uni tsN o te Storage Temperature Range TS -65°+ 150° C Operating Ambient Temperature TA -55°+ 125° C Junction Temperature TJ +150° C Operating Case Temperature TC +145° C1 Lead Solder Temperature (1.6 mm below seating plane) 260° for 10 sC Average Input Current IF 20 mA Peak Repetitive Input Current (Pulse Width < 100 ms; duty cycle < 50%) IFPK 40 mA Peak Surge Input Current (Pulse Width < 0.2 ms; duty cycle < 0.1%) IFPK surge 100 mA Reverse Input Voltage VR 5V Average Output Current - Figure 2 Connection A Connection B IO 0.8 1.6 A A Single Shot Output Current - Figure 3 Connection A (Pulse width < 10 ms) Connection B (Pulse width < 10 ms) IOPK surge 5.0 10.0 A A Output Voltage Connection A Connection B VO -90 V V Average Output Power Dissipation - Figure 4 800 mW 2
Recommended Operating Conditions Parameter S ymbol Min. Ma x. Units Note Input Current (on) IF(ON) 52 0 m A 1 0 Input Current (on) IF(ON) 10 20 mA 11 Input Voltage (off ) VF(OFF) 0 0.6 V Operating Temperature T A -55 +125 °C Hermetic Optocoupler Options Note: Dimensions in millimeters (inches). Option Description 100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product. 200 Lead fi nish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product. DLA Drawing part numbers contain provisions for lead fi nish. 300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product. This option has solder dipped leads. 600 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product. Note: Solder contains lead. 1.14 (0.045) 1.40 (0.055) 4.32 (0.170) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 0.51 (0.020) MIN. 4.57 (0.180) MAX. 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 1.40 (0.055) 1.65 (0.065) 9.65 (0.380) 9.91 (0.390) 5˚ MAX. 4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 3.81 (0.150) MAX. 1.02 (0.040) TYP. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 7.36 (0.290) 7.87 (0.310) 0.20 (0.008) 0.33 (0.013) 1.07 (0.042) 1.31 (0.052)
TA =-55°C to +125°C, unless otherwise specified. See note 9. Parameter S ym. Group A, Sub-group Test Conditions Min. Typ.* Ma x. Uni ts Fig. No tes Output Withstand Voltage |VO(OFF)| 1, 2, 3V F = 0.6 V, IO = 10 PA 90 110 V 5 Output On-Resistance Connection A R(ON) 1, 2, 3 IF = 10 mA, IO = 800 mA, (pulse duration ≤ 30 ms) 0.40 1.0 : 6, 7 3, 11 IF = 5 mA, IO = 800 mA, (pulse duration ≤ 30 ms) 1.0 3, 10 Output On-Resistance Connection B R(ON) 1, 2, 3 IF = 10 mA, IO = 1.6 A, (pulse duration ≤ 30 ms) 0.12 0.25 : 6, 7 3, 11 IF = 5 mA, IO = 1.6 A, (pulse duration ≤ 30 ms) 0.25 3, 10 Output Leakage Current IO(OFF) 1, 2, 3V F = 0.6 V, VO = 90 V1 0 -4 10 PA8 Input Forward Voltage VF 1, 2, 3 IF = 10 mA 1.0 1.24 1. 7 V91 1 IF = 5 mA 10 Input Reverse Breakdown Voltage VR 1, 2, 3 IR = 100 PA 5.0 V Input-Output Insulation II-O 1R H ≤ 65%, t = 5 s, VI-O = 1500 Vdc, TA = 25°C
1.0 PA4 , 5
Turn On Time t ON 9, 10, 11 IF = 10 mA, VDD = 28 V, IO = 800 mA 1.25 6.0 ms 1, 10, 11, 12, 13 IF = 5 mA, VDD = 28 V, IO = 800 mA 6.0 10 Turn Off Time t OFF 9, 10, 11 IF = 10 mA, VDD = 28 V, IO = 800 mA 0.02 0.25 ms 1, 10, 14, 15 IF = 5 mA, VDD = 28 V, IO = 800 mA 0.25 10 Output Transient Rejection dVo dt 9V PEAK = 50 V, CM = 1000 pF, CL = 15 pF, RM ≥ 1 M:
1000 V/ Ps1 7
9V DD = 5 V, VI-O(PEAK) = 50 V, RL = 20 k:, CL = 15 pF
500 V/ Ps1 8
All typical values are at TA = 25°C, IF(ON) = 10 mA, VF(OFF) = 0.6 V unless otherwise specified.
- Maximum junction to case thermal resistance for the device is 15°C/W, where case temperature, TC, is measured at the center of the package
- For rating, see Figure 4. The output power PO rating curve is obtained when the part is handling the maximum average output current IO as
- During the pulsed RON measurement (IO duration <30 ms), ambient (TA) and case temperature (TC) are equal.
- Device considered a two terminal device: pins 1 through 4 shorted together and pins 5 through 8 shorted together.
- T his is a momentary withstand test, not an operating condition.
- For a faster turn-on time, the optional peaking circuit shown in Figure 1 may be implemented.
- VOS is a function of IF, and is defined between pins 5 and 8, with pin 5 as the reference. VOS must be measured in a stable ambient (free of tem-
- Z ero-bias capacitance measured between the LED anode and cathode.
- Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD, Class H and Class E parts receive 100% testing at 25°C, 125°C and -55°C
(Subgroups 1 and 9, 2 and 10, 3 and 11 respectively).
- Applies to HSSR-7112 and 5962-9314002Hxx devices only.
IF (VCC-VOH ) < 600 mV, OMIT R2. R3, C = OPTIONAL PEAKING CIRCUIT. Figure 1. Recommended Input Circuit.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-1944EN AV02-3835EN - October 2, 2012 Design Considerations for Replacement of Electro- Mechanical Rela ys The HSSR-7110 family can replace electro-mechanical re- lays with comparable output voltage and current ratings. The following design issues need to be considered in the replacement circuit. Input Circuit: The drive circuit of the electro-mechanical relay coil needs to be modifi ed so that the average for- ward current driving the LED of the HSSR- 7110 does not exceed 20 mA. A nominal forward drive current of 10 mA is recommended. A recommended drive circuit with 5 volt VCC and CMOS logic gates is shown in Figure 1. If higher VCC voltages are used, adjust the current limiting resistor to a nominal LED forward current of 10 mA. One impor- tant consideration to note is that when the LED is turned off , no more than 0.6 volt forward bias should be applied across the LED. Even a few microamps of current may be suffi cient to turn on the HSSR- 7110, although it may take a considerable time. The drive circuit should maintain at least 5 mA of LED current during the ON condition. If the LED forward current is less than the 5 mA level, it will cause the HSSR-7110 to turn on with a longer delay. In addition, the power dissipation in the output power MOSFETs in- creases, which, in turn, may violate the power dissipation guidelines and aff ect the reliability of the device. Output Circuit: Unlike electromechanical relays, the de- signer should pay careful attention to the output on-resis- tance of solid state relays. The previous section, “On- Re- sistance and Rating Curves” describes the issues that need to be considered. In addition, for strictly dc applications the designer has an advantage using Connection B which has twice the output current rating as Connection A. Fur- thermore, for dc-only applications, with Connection B the on-resistance is considerably less when compared to Con- nection A. Output over-voltage protection is yet another important design consideration when replacing electro-mechanical relays with the HSSR-7110. The output power MOSFETs can be protected using Metal oxide varistors (MOVs) or TransZorbs against voltage surges that exceed the 90 volt output withstand voltage rating. Examples of sources of voltage surges are inductive load kickbacks, lightning strikes, and electro-static voltages that exceed the speci- fi cations on this data sheet. For more information on out- put load and protection refer to Application Note 1047. References: 1. Application Note 1047, “Low On-Resistance Solid State Relays for High Reliability Applications. ” 2. Reliability Data for HSSR-7111, HSSR-7112, and HSSR-711E. MOV is a registered trademark of GE/RCA Solid State. TransZorb is a registered trademark of General Semicon- ductor. MIL-PRF-38534 Class H, Class E and DLA SMD Test Pro- gram Class H: Avago Technologies’ s Hi-Rel Optocouplers are in compli- ance with MIL-PRF-38534 Class H. Class H devices are also in compliance with DLA drawing 5962-93140. Testing consists of 100 % screening and quality confor- mance inspection to MIL-PRF-38534. Class E: Class E devices are in compliance with DLA drawing 5962- 9314001Exx. Avago Technologies has defi ned the Class E device on this drawing to be based on the Class K require- ments of MIL-PRF-38534 with exceptions. The exceptions are as follows: 1. Nondestructive Bond Pull, Test method 2023 of MIL- STD-883 in device screening is not required. 2. Particle Impact Noise Detection (PIND), Test method 2020 of MIL-STD-883 in device screening and group C testing is not required. 3. Die Shear Strength, Test method 2019 of MIL-STD-883 in group B testing is not required. 4. Internal Water Vapor Content, Test method 1018 of MIL- STD-883 in group C testing is not required. 5. Scanning Electron Microscope (SEM) inspections, Test method 2018 of MIL-STD-883 in element evaluation is not required.