HSMW-CL25 AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Small size top firing
  • Small 1.6 (L) x 0.8 (W) x 0.25 (H) mm package
  • Diffused optics
  • Compatible with IR Reflow
  • High brightness using InGaN die technology
  • Available in 8mm Tape on 7” (178 mm) Diameter Reels Advantages
  • High package thermal dissipation capability due to the superior package leadframe design
  • Small footprint to overcome space count
  • Low thickness to overcome space constrains
  • Short lead times and competitive pricing CAUTION: HSMW-CL25 LEDs are Class 1B ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

Package Dimension (mm) Die Technology Colors Testing Current (mA) Parts per Reel Package Description .6 (L) x 0.8 (W) x 0.25 (H) InGaN White 5 4000 Untinted, Diffused Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004 in.) unless otherwise specified Absolute Maximum Ratings at T A = 25°C Parameter HSMW-CL25 Units DC Forward Current[] 0 mA Power Dissipation 39 mW Reverse Voltage (IR = 00mA) 5 V LED Junction Temperature 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4.

  1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED
  2. The chromaticity coordinates, are derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
  3. q1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.

Figure 1. SMT White Color Bin Structure (CIE 1931 Chromaticity Diagram)