HSMW-C120 AVAGO | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Features

  • White color
  • Small size
  • Industry standard footprint
  • Compatible with reflow soldering
  • Compatible with automatic placement equipment
  • Operating temperature range –30˚C to +85˚C
  • Come in 8 mm tape on 7" diameter reels

Applications

  • LCD backlighting
  • Keypad backlighting
  • Pushbutton backlighting
  • Symbol backlighting HSMW-C120, HSMW-C130, HSMW-C191, HSMW-C197, HSMW-C265 HSMW-Cxxx White ChipLEDs Data Sheet CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED. HSMW-C197 HSMW-C120 HSMW-C130 1.6 (0.063) 0.5 (0.020) POLARITY 1.0 (0.039) 3 Ð 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) LED DIE PC BOARD SOLDERING TERMINAL 0.6 (0.024) CATHODE LINE DIFFUSED EPOXY LED Die Cathode Mark DIFFUSED EPOXY PCB BOARD Soldering Terminal Cathode Line Polarity (0.80) 0.031 0.8 0.063 1.6 0.045 1.15 0.014 0.35 0.005 0.12 0.009 0.23 0.012\.006 0.3\0.15 0.028 0.7 MIN. 0.012\.006 0.3\0.15 1.6 (0.063 ) 0.3 (0.012) 0.30 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.6 (0.023) 0.30 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. 1.6 (0.063 ) 0.3 ± 0.15 (0.012 ± 0.006) POLARITY 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. 0.4 (0.016) 0.16 (0.006)

Package Dimensions, continued NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED. HSMW-C265 3.4 (0.134 ) 0.3 (0.012) 0.50 ± 0.15 (0.020 ± 0.006) 1.1 (0.043) POLARITY CATHODE MARK 1.1 (0.043) 0.50 ± 0.15 (0.020 ± 0.006) 1.2 (0.047) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) CATHODE LINE

Absolute Maximum Ratings at TA = 25˚C Parameter HSMW-Cxxx Units DC Forward Current[1] 20 mA Power Dissipation 78 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –30 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 10 & 11) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25˚C Reverse Forward Voltage Breakdown Capacitance C Thermal VF (Volts) VR (Volts) (pF), VF = 0, Resistance @ IF = 20 mA[1] @ IR = 100 µA f = 1 MHz RθJ-PIN (˚C/W) HSMW-Cxxx 3.6 3.9 5 55 450 Note: 1. VF tolerance: ± 0.1 V. Device Selection Guide Package Dimension (mm) White Package Description 1.6 (L) x 0.6 (W) x 1.0 (H) HSMW-C120 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.35 (H) HSMW-C130 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.6 (H) HSMW-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSMW-C197 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H)[2] HSMW-C265 Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package.

Optical Characteristics at TA = 25˚C Luminous Intensity Chromaticity Luminous Iv (mcd) Coordinates[2] Viewing Angle Efficacy @ 20 mA[1, 4] Typ. 2 θ1/2 Degrees[3] ηv (lm/w) Part Number Min. Typ. x y Typ. Typ. HSMW-C120 45 160 0.29 0.27 155 240 HSMW-C130 45 150 0.29 0.27 145 240 HSMW-C191 71.5 200 0.29 0.27 140 240 HSMW-C197 45 160 0.29 0.27 130 240 HSMW-C265 71.5 180 0.29 0.27 150 240 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4. Luminous intensity (Iv) tolerance: ± 15%. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.Tolerance: ± 15%

Figure 10. Recommended reflow soldering profile. Figure 13. Recommended soldering pattern for HSMW-C130, HSMW-C191, and HSMW-C197. Figure 14. Recommended soldering pad pattern for HSMW-C265.

  1. DIMENSIONS ARE IN MILLIMETERS (INCHES).

Figure 12. Recommended soldering pad pattern for HSMW-C120. Figure 11. Recommended Pb-free reflow soldering profile.

255 C (+5/-0)

  • THE TIME FROM 25 C TO PEAK TEMPERATURE = 6 MINUTES MAX.

Figure 17. Tape dimensions.

  1. DIMENSIONS ARE IN MILLIMETERS (INCHES).

Figure 18. Tape leader and trailer dimensions.

  1. Humidity Indicator Card is > 10% when read at
  2. Device expose to factory conditions < 30°C/60% RH

Baking recommended condition: 60 ± 5°C for 20 hours. Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.