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LED with InGaN material Small size Industrial standard footprint Diffused optics Compatible with reflow soldering Available in 8mm tape on 7” diameter reel Application LCD backlighting Push button backlighting Front panel indicator Symbol indicator Package Dimension Note: 1. All dimensions in mm (inches). 2. Tolerance ±0.1mm (0.004inch) unless otherwise specified. Caution: LEDs are class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Absolute Maximum Ratings (TA = 25°C) Parameter InGaN White Unit DC Forward Current1 20 mA Power Dissipation 78 mW Junction Temperature 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Note: 1. Derate as shown in Figure 10. Electrical / Optical Characteristics (TA = 25°C, IF =20mA) Parameter Min Typ Ma x Unit Luminous Intensity, Iv1 180 370 mcd Viewing Angle, 2θ1/22 170 degree Forward Voltage, Vf3 2.9 3.9 V Reverse Voltage, Vr4 @Ir =100μA 5 V Thermal Resistance, RθJ-P 300 °C/W Note: 1. The luminous intensity is measured at the mechanical axis of the lamp package which may not be aligned with the peak of the spatial radiation pattern. 2. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. 3. Vf tolerance ±0.1V. 4. Indicates product final test condition, long term reverse bias is not recommended. Intensity Bin Limits Bin ID Min. (mcd) Max. (mcd) S 180 285 T 285 450 U 450 715 V 715 1125 W 1125 1800 X 1800 2850 Y 2850 4500 Tolerance ±15%
Figure 1. Chromaticity diagram
Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: - Soldering iron tip temperature = 310°C max - Soldering duration = 2sec max - Number of cycle = 1 only - Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering.
- Handling of moisture sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity Indicato r Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). (b) Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all time s and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. (c) Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. (d) Control of assembled boards - If the PCB soldered with the LEDs is to be subjecte d to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. (e) Baking is required if: - The HIC indicator is not blue at 10% and is pink at 5%. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. The recommended baking condition is: 60±5ºC for 20hrs Baking should only be done once. Disclaimer Avago’s products are not specifically designed, manufactur ed or authorized for sale as parts, components or assemblies for the planning, constructi on, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely resp onsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademar ks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved.