HSMX-C1XX AVAGO | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

  • High brightness
  • Small size
  • Industrial standard footprint
  • Diffused optics
  • Top emitting or right angle emitting
  • Compatible with IR soldering
  • Compatible for use with light piping
  • Available in 8 mm tape on 7" diameter reel
  • Reel sealed in zip locked moisture barrier bags

Applications

  • LCD backlighting
  • Push button backlighting
  • Front panel indicator
  • Symbol indicator
  • Microdisplays
  • Small message panel signage

Description

These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C130, C150, C170, C177, C190, C191, C197), in side emitting packages (HSMx-C110, C120) or in a reverse mount package (C265). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C130, C170, C177, C190, C191 and C197 packages, and 3000 units per reel for HSMx- C110, C150 and C265 packages. All packages are compatible with IR soldering and binned by both color and intensity. HSMQ-C110, HSMQ-C120, HSMQ-C150, HSMQ-C170, HSMQ-C177, HSMQ-C190, HSMQ-C191, HSMQ-C197, HSMQ-C265, HSMR-C110, HSMR-C120, HSMR-C130, HSMR-C150, HSMR-C170, HSMR-C177, HSMR-C190, HSMR-C191, HSMR-C197, HSMR-C265 CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details. HSMx-C1xx High Performance Chip LED Data Sheet

NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) POLARITY CATHODE LINE 1.5 (0.059) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) CATHODE LINE 3.2 (0.126 ) HSMx-C110 2.0 (0.079 ) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) 1.4 (0.055)DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) HSMx-C170 CATHODE LINE HSMx-C190 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) 0.7 (0.028) MIN. CATHODE LINE HSMx-C191 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.6 (0.023) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN.

Package Dimensions, continued NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 1.6 (0.063) 0.5 (0.020) POLARITY CATHODE MARK 1.0 (0.039) 3 – 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 0.6 (0.024) CATHODE LINE HSMx-C120 HSMx-C150 3.2 (0.126 ) 0.5 (0.020) 0.50 ± 0.20 (0.020 ± 0.008) 0.6 (0.024) POLARITY CATHODE MARK 1.1 (0.043) 0.50 ± 0.20 (0.020 ± 0.008) 2.0 (0.079)DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.6 (0.063) CATHODE LINE CATHODE MARK 1.25 (0.049) 2.00 (0.079) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) POLARITY 0.40 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL 1.10 (0.043) MIN. 0.40 ± 0.15 (0.016 ± 0.006) CATHODE LINE HSMx-C177 0.80 (0.031) 1.60 (0.063) POLARITY 0.70 (0.028) MIN. CATHODE LINE 0.30 ± 0.15 (0.012 ± 0.006) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) SOLDERING TERMINAL CATHODE MARK HSMx-C197

Absolute Maximum Ratings at TA = 25˚C HSMQ-Cxxx Parameter HSMR-Cxxx Units DC Forward Current [1] 20 mA Power Dissipation 78 mW Reverse Voltage (I R = 100 µA) 5 V LED Junction Temperature 95 ˚C Operating Temperature Range –30 to +85 ˚C Storage Temperature Range –40 to +85 ˚C Soldering Temperature See reflow soldering profile (Figures 11 & 12) Device Selection Guide Package Dimension (mm) [1], [2] InGaN Green InGaN Blue Package Description 3.2(L) x 1.5(W) x 1.0(H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused 1.6(L) x 1.0(W) x 0.6(H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused 1.6(L) x 0.8(W) x 0.35(H) – HSMR-C130 Untinted, Diffused 3.2(L) x 1.6(W) x 1.1(H) HSMQ-C150 HSMR-C150 Untinted, Diffused 2.0(L) x 1.25(W) x 0.8(H) HSMQ-C170 HSMR-C170 Untinted, Diffused 2.0(L) x 1.25(W) x 0.4(H) HSMQ-C177 HSMR-C177 Untinted, Diffused 1.6(L) x 0.8(W) x 0.8(H) HSMQ-C190 HSMR-C190 Untinted, Diffused 1.6(L) x 0.8(W) x 0.6(H) HSMQ-C191 HSMR-C191 Untinted, Diffused 1.6(L) x 0.8(W) x 0.4(H) HSMQ-C197 HSMR-C197 Untinted, Diffused 3.4(L) x 1.25(W) x 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused Note: 1. Derate linearly as shown in Figure 4. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Package Dimensions, continued 1.6 (0.063) 0.12 (0.005) 0.3 ± 0.15 (0.012 ± 0.006) 0.23 (0.009) CATHODE MARK 0.35 (0.014) 0.3 ± 0.15 (0.012 ± 0.006) 1.15 (0.045) LED DIE DIFFUSED EPOXY PCB BOARD 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. /;/; POLARITY (0.625) SOLDERING TERMINAL HSMx-C130 3.4 (0.134) 0.3 (0.012) 0.50 ± 0.15 (0.020 ± 0.006) 1.1 (0.043) POLARITY CATHODE MARK (ETCHED) 1.1 (0.043) 0.50 ± 0.15 (0.020 ± 0.006) 1.2 (0.047) 1.25 (0.049) LED DIE UNDIFFUSED EPOXY PC BOARD SOLDERING TERMINAL GREEN SOLDER MASK CATHODE LINE HSMx-C265

Optical Characteristics at TA = 25˚C Luminous Color, Viewing Luminous Intensity Peak Dominant Angle Efficacy I V (mcd) Wavelength Wavelength 2 θ1/2 ηV @ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees [3] (lm/w) HSMQ-C110 Green 45 150 520 527 130 500 HSMQ-C120 Green 45 145 520 527 155 500 HSMQ-C150/170/190/191 Green 45 145 520 527 140 500 HSMQ-C177/197 Green 45 145 520 527 130 500 HSMQ-C265 Green 45 140 520 527 150 500 HSMR-C110 Blue 18 60 469 473 130 88 HSMR-C120 Blue 18 55 469 473 155 88 HSMR-C130 Blue 18 55 469 473 145 88 HSMR-C150/170/190/191 Blue 18 55 469 473 140 88 HSMR-C177/197 Blue 18 55 469 473 130 88 HSMR-C265 Blue 18 45 469 473 150 88 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA = 25˚C Forward Voltage Reverse Breakdown Capacitance C Thermal VF (Volts) V R (Volts) (pF), V F = 0, Resistance @ IF = 20 mA @ I R = 100 µA f = 1 MHz R θJ–PIN (˚C/W) HSMQ-C110/C150 3.4 3.9 5 140 450 HSMR-C110/C150 3.4 3.9 5 140 450 HSMQ-C120 3.4 3.9 5 100 450 HSMR-C120/C130 3.4 3.9 5 100 450 HSMQ-C170/C190/C191 3.4 3.9 5 110 300 HSMR-C170/C190/C191 3.4 3.9 5 110 300 HSMQ-C177/C197 3.4 3.9 5 110 350 HSMR-C177/C197 3.4 3.9 5 110 350 HSMQ-C265 3.4 3.9 5 65 300 HSMR-C265 3.4 3.9 5 65 300 VF Tolerance: ±0.1 V Blue Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contac t your Avago representative for information on currently available bins. Color Bin Limits[1] InGaN Green Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Tolerance: ±1 nm Tolerance: ±1 nm

Figure 21. Tape dimensions.

  1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

Figure 22. Tape leader and trailer dimensions.

  1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

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