HSMP-3860

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 10

Technical content

Features

• Unique Configurations in Surface Mount Packages – Add Flexibility – Save Board Space – Reduce Cost
• Switching – Low Distortion Switching – Low Capacitance
• Attenuating – Low Current Attenuating for Less Power Consumption
• Matched Diodes for Consistent Performance
• Better Thermal Conductivity for Higher Power Dissipation
• Low Failure in Time (FIT) Rate[1]
• Lead-free Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Description/Applications The HSMP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenu- ators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (C T) and Total Resistance (R T) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. Pin Connections and Package Marking, SOT-363 Notes: 1. Package marking provides orientation, identification, and date code. 2. See “Electrical Specifications” for appropriate package marking. LUx1

Package Lead Code Identification, SOT-23, SOT-143 (Top View) Package Lead Code Identification, SOT-323 (Top View) COMMON□ CATHODE COMMON□ ANODE SERIES SINGLE COMMON□ CATHODE F COMMON□ ANODE E SERIES C SINGLE B Package Lead Code Identification, SOT-363 (Top View) UNCONNECTED□ TRIO L 12 3 65 4 Electrical Specifications TC = 25°C, each diode PIN General Purpose Diodes, Typical Specifications TA = 25°C Package Minimum Typical Typical Part Number Marking Lead Breakdown Series Resistance Total Capacitance HSMP- Code Code Configuration Voltage VBR (V) RS (Ω) CT (pF) 3860 L0 0 Single 50 3.0/1.5* 0.20

3862 L2 2 Series

3863 L3 3 Common Anode

3864 L4 4 Common Cathode

386L LL L Unconnected Trio Test Conditions VR = VBR IF = 10 mA VR = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 µA IF = 100 mA* Absolute Maximum Ratings[1] TC = +25°C Symbol Parameter Unit SOT-23 SOT-323 If Forward Current (1 µs Pulse) Amp 1 1 PIV Peak Inverse Voltage V 50 50 Tj Junction Temperature °C 150 150 Tstg Storage Temperature °C -65 to 150 -65 to 150 qjc Thermal Resistance[2] °C/W 500 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. T C = +25°C, where TC is defined to be the temperature at the package pins where contact is made to the circuit board. ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge. RING QUAD D See separate data sheet HSMP-386D

Figure 1. RF Capacitance vs. Reverse Bias.

1 GHz

100 MHz

1 MHz

Figure 3. 2nd Harmonic Input Intercept Point

50 Microstrip and

Figure 4. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. Figure 2. Typical RF Resistance vs. Forward Bias Figure 5. Forward Current vs. Forward

125 C 25 C –50 C

Figure 18. Surface Mount Assembly Profile. zone (TMAX) should not exceed 260°C.

Outline 23 (SOT-23) Package Characteristics Outline SOT-323 (SC-70, 3 Lead) Outline 363 (SC-70, 6 Lead) e B C E XXX L D A Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 SYMBOL A B C D e E L e B C E XXX L D A Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.80 0.00 0.15 0.08 1.80 1.10 1.80 0.26 MAX. 1.00 0.10 0.40 0.25 2.25 1.40 2.40 0.46 SYMBOL A B C D e E L 1.30 typical 0.65 typical EHE D e b AA2 DIMENSIONS (mm) MIN. 1.15 1.80 1.80 0.80 0.80 0.00 0.15 0.08 0.10 MAX. 1.35 2.25 2.40 1.10 1.00 0.10 0.30 0.25 0.46 SYMBOL E D HE A e b c L

0.650 BCS

L c

Note: "AB" represents package marking code. "C" represents date code. END VIE W 8 mm 4 mm TOP VIEW ABC ABC ABC ABC END VIE W 8 mm 4 mm TOP VIEW Note: "AB" represents package marking code. "C" represents date code. ABC ABC ABC ABC Device Orientation Tape Dimensions and Product Orientation For Outline SOT-23 For Outlines SOT-23, -323 For Outline SOT-363 9 □ MAX A 0 P P 0 D P 2 E F W D 1 Ko 8 □ MAX B 0 13.5 □ MAX DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A 0 B 0 K 0 P D 1 3.15 ± 0.10 2.77 ± 0.10 1.22 ± 0.10 4.00 ± 0.10 1.00 + 0 .05 0.124 ± 0.004 0.109 ± 0.004 0.048 ± 0.004 0.157 ± 0.004 0.039 ± 0.002 CAVITY DIAMETER PITCH POSITION D P 0 E 1.50 + 0.10 4.00 ± 0.10 1.75 ± 0.10 0.059 + 0.004 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 - 0.10 0.229 ± 0.013 0.315 + 0.012 - 0.004 0.009 ± 0.0005 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F P 2 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE BETWEEN CENTERLINE

Tape Dimensions and Product Orientation For Outlines SOT-323, -363 P P 0 P 2 F W C D 1 D E A 0 An t 1 (CARRIER TAPE THICKNESS) T t (COVER TAPE THICKNESS) An B 0 K 0 DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER A 0 B 0 K 0 P D 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.0□4 ± 0.004 0.0□4 ± 0.004 0.04□ ±□ 0.004 0.15□ ± 0.004 0.0□□ + 0.010 CAVITY DIAMETER PITCH POSITION D P 0 E 1.55 ± 0.05 4.00 ± 0.10 1.□5 ± 0.10 0.0□1 ± 0.002 0.15□ ± 0.004 0.0□□ ± 0.004 PERFORATION WIDTH THICKNESS W t □.00 ± 0.□0 0.254 ± 0.02 0.□15 ± 0.012 0.0100 ± 0.000□ CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F P 2 □.50 ± 0.05 2.00 ± 0.05 0.1□□ ± 0.002 0.0□□ ± 0.002 DISTANCE ANGLE WIDTH TAPE THICKNESS C T t 5.4 ± 0.10 0.0□2 ± 0.001 0.205 ± 0.004 0.0025 ± 0.00004 COVER TAPE For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4028EN AV02-0293EN - October 21, 2013