HSMP-383X AVAGO | Alldatasheet
Document overview
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- PDF pages: 7
Technical content
Features
- Diodes Optimized for: Low Capacitance Switching Low Current Attenuator
- Surface Mount SOT-23 Package Single and Dual Versions Tape and Reel Options Available
- Low Failure in Time (FIT) Rate[1]
- Lead-free Note: 1. For more information see the Surface Mount PIN Reliability Data Sheet. Package Lead Code Identification (Top View) Description/Applications The HSMP-383x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. The HSMP-386x series Total Capacitance (CT) and Total Resistance (RT) are typical specifications. For applications that require guaranteed performance, the general purpose HSMP-383x series is recommended. A SPICE model is not available for PIN diodes as SPICE does not provide for a key PIN diode characteristic, carrier lifetime. COMMON CATHODE COMMON ANODE SERIES SINGLE
Absolute Maximum Ratings [1] TC = 25°C Symbol Parameter Units Absolute Maximum I f Forward Current (1 ms Pulse) Amp 1 P t Total Device Dissipation mW[2] 250 P iv Peak Inverse Voltage — Same as VBR T j Junction Temperature °C 150 T STG Storage Temperature °C -65 to 150 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to this device. 2. CW Power Dissipation at TLEAD = 25°C. Derate to zero at maximum rated temperature. PIN General Purpose Diodes, Electrical Specifications T C = 25°C Minimum Maximum Maximum Part Package Breakdown Series Total Number Marking Lead Voltage Resistance Capacitance HSMP- Code Code Configuration VBR (V) RS (Ω) CT (pF) 3830 K0 0 Single 200 1.5 0.3
3832 K2 2 Series
3833 K3 3 Common Anode
3834 K4 4 Common Cathode
Test Conditions VR = VBR IF = 100 mA V R = 50 V Measure f = 100 MHz f = 1 MHz IR ≤ 10 mA Typical Parameters at T C = 25°C Part Number Series Resistance Carrier Lifetime Reverse Recovery Time Total Capacitance HSMP- RS (Ω) τ (ns) Trr (ns) CT (pF) 383x 20 500 80 0.20 @ 50 V Test Conditions I F = 1 mA IF = 50 mA VR = 10 V f = 100 MHz I R = 250 mA IF = 20 mA 90% Recovery
Figure 2. RF Capacitance vs. Reverse Bias.
1 GHz
100 MHz
1 MHz
Figure 4. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuators. Figure 5. 2nd Harmonic Input Intercept Point vs. Forward Bias Current for Switches.
50 Ohm Microstrip and
Figure 1. Forward Current vs. Forward Voltage. Figure 6. Reverse Recovery Time vs. Forward Current for Various Reverse Voltage. Figure 3. RF Resistance at 25C vs. Forward Bias Current.
Ordering Information
Specify part number followed by option. For example: HSMP - 383x - XXX Bulk or Tape and Reel Option Part Number Surface Mount PIN Diode Package Dimensions Outline 23 (SOT-23) Recommended PCB Pad Layout for Avago’s SOT-23 Products Package Characteristics Profile Option Descriptions -BLKG = Bulk -TR1G = 3K pc. Tape and Reel, Device Orientation; See Figure 13 -TR2G = 10K pc. Tape and Reel, Device Orientation; See Figure 13 Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement. ” e B C E XXX L D A Notes: XXX-package marking Drawings are not to scale DIMENSIONS (mm) MIN. 0.79 0.000 0.30 0.08 2.73 1.15 0.89 1.78 0.45 2.10 0.45 MAX. 1.20 0.100 0.54 0.20 3.13 1.50 1.02 2.04 0.60 2.70 0.69 SYMBOL A B C D e E L 0.039 0.039 0.079 2.0 0.031 0.8 Dimensions in inches mm 0.035 0.9
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Figure 13. Options -TR1, -TR2 for SOT-23 Packages. Note: "AB" represents package marking code.