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Features: LED with AlInGaP die Bicolor right angle chipLED Compatible with reflow soldering Tape in 8mm carrier tape on a 7 inch diameter reel Applications: Backlighting Status indicator Front panel indicator Office automation, home appliances, industrial equipment Package Dimensions Notes: 1. All dimensions are in mm. 2. Tolerance ±0.1mm unless otherwise specified. CAUTIO N: This LED is class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details.
Absolute Maximum Value at T A = 25°C Parameter AlInGaP Unit Forward current1 30 mA Power dissipation 72 mW Operating temperature -30 to 85 °C Storage temperature -40 to 85 °C Note: 1. Derate as shown in Figure 5. Optical Characteristics at T A = 25°C, I F = 20mA Color Luminous Intensity (mcd) 1 Peak Wavelength (nm) Dominant Wavelength (nm) 2 Viewing Angle (°) 3 Deep Red 18.0 66.0 660.0 639.0 120 Green 18.0 33.0 571.0 570.0 120 Notes: 1. The luminous intensity is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. The dominant wavelength is derived from the CIE chromaticity diagram and represents the perceived color of the device. 3. Θ1/2 is the off axis angle where the luminous intensity is ½ the peak intensity. Electrical Characteristics at T A = 25°C, I F = 20mA Color Forward Voltage (V) 1 Reverse Voltage (V) 2 at 100μA Min. Max. Min. Deep Red 1.6 2.4 5 Green 1.6 2.4 5 Notes: 1. Forward voltage tolerance ±0.1V. 2. Reverse voltage indicates product final test. Long term reverse bias is not recommended.
Intensity Bin (CAT) Bin ID Luminous Intensity (mcd) Min. Max. M 18.0 28.5 N 28.5 45.0 P 45.0 71.5 Q 71.5 112.5 R 112.5 180.0 Tolerance ±15% Color Bin (BIN) – Deep Red Color Bin (B IN) - Green Bin ID Dominant Wavelength (nm) Bin ID Dominant Wavelength (nm) Min. Max. Min. Max. - 630.0 650.0 A 561.5 564.5 Tolerance ±1nm B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance ±1nm
Recommended reflow soldering condition: (a) Reflow soldering must not be done more than 2 times. Do observ e necessary precautions of handling moisture sensitive device as stated in below section. (b) Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. (c) It is preferred to use reflow soldering to solder the LED. But if unavoidable (such as rework), manual hand soldering can be used but must be strictly controlled to condition below: - Soldering iron tip temperature = 310°C max - Soldering duration = 2sec max - Number of cycle = 1 only - Power of soldering iron = 50W max (d) Do not touch the LED package body with the soldering iron except for the soldering terminals as it may cause damage to the LED. (e) User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering.
- Handling of moisture sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Do refer to Avago Application Note AN5305 , Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. (a) Before use - An unopened moisture barrier bag (MBB) can be stored at <40° C/90%RH for 12 months. If the actu al shelf life has exceeded 12 m onths and the humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is recommended that the MBB not be opened prior to assembly (e.g. for IQC). (b) Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30°C / 60%RH at all times and all high temperature related processes including soldering, curing or rework need to be completed within 672 hours. (c) Control for unfinished reel - Unused LEDs must be stored in a sealed MBB with desiccant or desiccator at <5%RH. (d) Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure that all LEDs have not exceeded their floor life of 672 hours. (e) Baking is required if: - The HIC indicator is not blue at 10% and is pink at 5%. - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. The recommended baking condition is: 60±5ºC for 20hrs Baking should only be done once. Disclaimer Avago’s products are not specifica lly designed, manufactured or au thorized for sale as parts, co mponents or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for us e in medical devices or applications. Customer is solely respon sible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. June 10, 2014