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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Features

  • Common anode
  • Small 2.5 x 1.0 x 1.0 mm package
  • Diffused optics
  • Available in 8 mm tape on 7" diameter reels
  • High brightness using AlInGaP and InGaN die technology
  • Compatible with reflow soldering

Applications

  • Backlighting
  • Status indicator
  • Front panel indicator
  • Office automation, home appliances, industrial equipment

Description

The HSMF-C113 / C115 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme. The small size, narrow footprint, and low profile make this LED excellent for back-lighting, status indication, and front panel illumination applications. In order to facilitate pick and place operation, this ChipLED is shipped in tape and reel, with 3000 units per reel. The package is compatible with reflow soldering and binned by both color and intensity.

POLARITY HSMF-C113 HSMF-C115 InGaN BLUE InGaN BLUE AlInGaP RED AlInGaP RED AlInGaP GREEN InGaN GREEN Package Dimensions Notes: 1. All Dimensions in millimeteres (inches) 2. Tolerance is ±0.1mm (±0.004 in) unless otherwise specified 1 2 3 4 R0.50 [.020] 2.50 [.098] 2.10 [.083] 1.00 [.039] 0.50 [.020] 1.00 [.039] Anode Mark 0.50 [.020] 0.40 [.016] LED Dies 0.50 [.020] 0.35 [.014] 0.35 [.014] 0.30 [.012] 0.35 [.014] 0.35 [.014] 0.30 [.012]

Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP Red AlInGaP Green InGaN Green InGaN Blue Units DC Forward Current[1,3] 20 20 20 20 mA Power Dissipation[1] 48 52 78 78 mW DC Forward Current[2] 15 15 15 15 mA Power Dissipation[2] 36 39 59 59 mW Reverse Voltage (IR = 100mA) 5 5 5 5 V LED Junction Temperature 95 95 95 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See IR soldering profile (Figure 6 & 7) Notes: 1. Applies when single LED is lit up. 2. Applies when all 3 LEDs are lit up simultaneously. 3. Derate linearly as shown in Figure 4. 4. Drive currents above 5 mA are recommended for best long term performance. Electrical Characteristics at TA = 25°C Part Number Forward Voltage VF (Volts)[1] @ IF = 20mA Reverse Breakdown VR (Volts) @ IR = 100mA Capacitance C(pF), @ VF = 0, f = 1MHz Thermal Resistance RqJ-PIN (°C/W) AlInGaP Red 1.9 2.0 5 12 550 AlInGaP Green 2.0 2.6 5 15 300 InGaN Green 3.4 3.9 5 65 400 InGaN Blue 3.4 3.9 5 65 400 Notes: 1.Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV [1] (mcd) @ 20mA Peak Wavelength lpeak (nm) Color, Dominant Wave- length ld [2] (nm) Viewing Angle 2q1/2 [3] (Degrees) Luminous Ef- ficacy hV (lm/W) Min. Typ. Typical Typical Typical Typical AlInGaP Red 28.5 80.0 637 626 120 155 AlInGaP Green 18.0 50.0 570 572 125 570 InGaN Green 71.5 170.0 523 525 125 443 InGaN Blue 28.5 60.0 468 470 125 89 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.

Light Intensity (IV) Bin Limits[1] Bin ID Intensity (mcd) Minimum Maximum A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 Tolerance : ±15% Notes: 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. AlInGaP Red Color Bin Limits[1] Bin ID Dom. Wavelength (nm) Minimum Maximum -- 620.0 635.0 Tolerance : ±1nm AlInGaP Green Color Bin Limits[1] Bin ID Dom. Wavelength (nm) Minimum Maximum A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance : ±1nm InGaN Green Color Bin Limits[1] Bin ID Dom. Wavelength (nm) Minimum Maximum A 515.0 520.0 B 520.0 525.0 C 525.0 530.0 D 530.0 535.0 Tolerance : ±1nm InGaN Blue Color Bin Limits[1] Bin ID Dom. Wavelength (nm) Minimum Maximum A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 Tolerance : ±1nm Notes: 1. Bin categories are established for classifi-cation of products. Products may not be available in all categories. Please contact your Avago Technologies representative for information on current available bins. CAUTION: 1. The above optical performance specifications are valid in the case when single LED is lit up. 2. The above product specifications DO NOT provide any guarantee on color mixing, color consistency over time, or uniformity in luminous intensity when more than 1 LED is lit. 3. Please refer to Avago Technologies Application Brief AB D-007 for additional details / explanation on driving the part in parallel circuit.

Figure 12. Tape leader and trailer dimensions. Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Storage Condition: 5 to 30°C @ 60%RH max.

  1. Humidity Indicator Card is > 10% when read at 23 ± 5°C.
  2. Device expose to factory conditions <30°C/60%RH more than 672 hours.

Recommended baking condition: 60±5°C for 20 hours.