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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 12

Technical content

Features

  • Small size
  • Industry standard footprint
  • Operating temperature range of –40°C to +85°C
  • Compatible with IR soldering
  • Available in 8 mm tape on 7” diameter reel
  • Reel sealed in zip-locked moisture barrier bags

Applications

  • Membrane switch indicator
  • LCD backlighting
  • Pushbutton backlighting
  • Front panel indicator
  • Symbol backlighting
  • Keypad backlighting

Description

This chip-type LED utilizes Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output. These chipLEDs come in top mounting, top emitting packages (HSMx-C150/170/177/190/191/197), top moun- ting, side emitting packages (HSMx-C110/120) or reverse mounting, top emitting package (HSMx-C265). All packages are binned by both color and intensity. In order to facilitate pick and place operation, these chipLEDs are shipped in Tape & Reel, with 4000 units per reel for HSMx-C120/170/ 177/190/191/197 and 3000 units per reel for HSMx-C110/C150/265. These packages are compatible with reflow soldering process. HSME-C110/C120/C150/C170/C177/C190/ C191/C197/C265

1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.6 (0.023) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. HSMx-C190 2.00 (0.079 ) 0.30 (0.012) 0.40 ± 0.15 (0.016 ± 0.006) 0.30 (0.012) POLARITY 0.80 (0.031) 0.40 ± 0.15 (0.016 ± 0.006) 1.40 (0.055)DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) CATHODE LINE HSMx-C170 CATHODE MARK 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) POLARITY CATHODE LINE 1.5 (0.059) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) CATHODE LINE HSMx-C110 3.2 (0.126 ) Package Dimensions Notes: 1. All dimensions in millimeters (inches).

1.6 (0.063) 0.5 (0.020) POLARITY CATHODE MARK 1.0 (0.039) 3 – 0.3 (0.012) 1.2 (0.047) 0.3 (0.012) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 0.6 (0.024) CATHODE LINE 0.80 (0.031) 1.60 (0.063) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) 0.70 (0.028) MIN. 0.30 ± 0.15 (0.012 ± 0.006)CATHODE LINE CATHODE MARK HSMx-C197 POLARITY SOLDERING TERMINAL 3.2 (0.126 ) 0.5 (0.020) 0.5 ± 0.2 (0.020 ± 0.008) 0.6 (0.024) POLARITY CATHODE MARK 1.1 (0.043) 0.5 ± 0.2 (0.020 ± 0.008) 2.0 (0.079)DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.6 (0.063) CATHODE LINE HSMx-C150 3.40 (0.134) 0.30 (0.012) 2– 1.10 (0.043) POLARITY CATHODE MARK (ETCHED) 1.10 (0.043) 2– 0.50 ± 0.15 (0.020 ± 0.006) 1.20 (0.047) LED DIE UNDIFFUSED EPOXY PC BOARD 1.25 (0.049) CATHODE LINE HSMx-C265 Notes: 1. All dimensions in millimeters (inches). Package Dimensions, continued

1.25 (0.049) 2.00 (0.079) DIFFUSED EPOXY PC BOARD 0.40 (0.016) 0.16 (0.006) 0.40 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL HSMx-C177 1.10 (0.043) POLARITY CATHODE LINE Package Dimensions, continued Notes: 1. All dimensions in millimeters (inches).

Package Dimension (mm) [1,2] AlInGaP Green Package Description 1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused 2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused 1.6 (L) x 1.0 (W) x 0.6 (H) HSME-C120 Untinted, Non-diffused 3.2 (L) x 1.5 (W) x 1.0 (H) HSME-C110 Untinted, Non-diffused 3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted. Absolute Maximum Ratings at TA = 25°C Parameter HSME-C110/120/170/177/ 190/191/197/150/265 Units DC Forward Current [1,2] 20 mA Power Dissipation 52 mW Reverse Voltage (IR = 100 µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range –40 to +85 °C Storage Temperature Range –40 to +85 °C Soldering Temperature See reflow soldering profile (Figures 6 & 7) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive current above 5 mA is recommended for best long term performance. Electrical Characteristics at TA = 25°C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Reverse Breakdown VR (Volts) @ IR = 100 µA Capacitance C (pF), VF = 0, f = 1 MHz Thermal Resistance RθJ–PIN (°C/W) HSME-C110/120 2.1 2.6 5 18 550 HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450 HSME-C265 2.1 2.6 5 16 450

Optical Characteristics at TA = 25°C Part Number Luminous Intensity IV (mcd) @ 20 mA[1] Peak Wavelength λpeak (nm) Color, Dominant Wavelength λd[2] (nm) Viewing Angle 2θ1/2 Degrees[3] Luminous Efficacy ηV (lm/w) HSME-C110 18 52 570 572 130 570 HSME-C120 18 52 570 572 155 570 HSME-150/170/ 18 50 570 572 170 570 HSME-C177/197 18 50 570 572 130 570 HSME-C265 18 50 570 572 150 570 Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (IV) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 U 450.00 715.00 Tolerance: ± 15% Green Color Bin Limits[1] Bin ID Dom. Wavelength (nm) Min. Max. A 561.5 564.5 B 564.5 567.5 C 567.5 570.5 D 570.5 573.5 E 573.5 576.5 Tolerance: ± 1 nm Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits.

Figure 16. Tape dimensions.

  1. All dimensions in millimeters (inches).

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Figure 17. Tape leader and trailer dimensions.