HSMB-CXXX AVAGO | Alldatasheet

Document overview

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Technical content

Features

  • Small Size
  • Industry Standard Footprint
  • Compatible with IR Solder
  • Diffused Optics
  • Operating Temperature Range of –30°C to +85°C
  • Right Angle Package Available
  • SiC Blue Color
  • Available in 8 mm Tape on 7" (178 mm) Diameter Reels

Applications

  • Keypad Backlighting
  • Push-Button Backlighting
  • LCD Backlighting
  • Symbol Backlighting
  • Front Panel Indicator

Description

These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB- C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 and HSMB-C191 have the industry standard 1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for HSMB-C190 and 0.6 mm for HSMB-C191) and wide view- ing angles make these LEDs exceptional for backlighting applications. The HSMB-C110 is a right-angle package with the univer- sally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder pro- cesses. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium.

HSMB-C190 Pkg Dimen - b (C170) 2.0 (0.079 ) 0.3 (0.012) 0.4 ± 0.15 (0.016 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) 1.4 (0.055) 0.62 (0.024) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.25 (0.049) CATHODE LINE HSMB-C190 Pkg Dimen - a (C190) 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.8 (0.031) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN. HSMx-C190 Pkg Dimen - a (C150) 3.2 (0.126 ) 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 0.6 (0.024) POLARITY CATHODE MARK 1.1 (0.043) 0.50 ± 0.2 (0.020 ± 0.008) 2.0 (0.079) 0.8 (0.031) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 1.6 (0.063) CATHODE LINE 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) POLARITY CATHODE LINE 1.5 (0.059) LED DIE CLEAR EPOXY PC BOARD SOLDERING TERMINAL 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) CATHODE LINE HSMB-C110 3.2 (0.126 )

NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Absolute Maximum Ratings at TA=25°C Parameter HSMB-C190/C170/C110/C150/C191 Units DC Forward Current [1] 20 mA Peak Pulsing Current [2] 100 mA Power Dissipation 92 mW Reverse Voltage (IR = 100 µA) 5 V Maximum LED Junction Temperature 95 °C Operating Temperature Range -30 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. HSMx-C191 1.6 (0.063 ) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 (0.012) POLARITY CATHODE MARK 0.6 (0.023) 0.3 ± 0.15 (0.012 ± 0.006) 1.0 (0.039) 0.4 (0.016) LED DIE DIFFUSED EPOXY PC BOARD SOLDERING TERMINAL 0.8 (0.031) CATHODE LINE 0.7 (0.028) MIN.

Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Intensity (mcd) Bin ID Min. Max. Bin ID Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Optical Characteristics at TA=25°C Luminous Peak Dominant Viewing Intensity[1] Wavelength Wavelength Angle 2θ1/2 Part No. Color Iv (mcd) @ 20 mA λpeak (nm) λd (nm) (degrees)[2] HSMB- SiC Blue 1.80 6.0 428 466 170 C190/C170/ C150/C191 HSMB-C110 SiC Blue 1.80 6.5 428 466 130 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA=25°C Reverse Forward Voltage Breakdown Thermal Capacitance C VF (Volts) VR (Volts) Resistance (pF) @ VF = 0 V, Part No. @ IF = 20 mA @ IR = 100 µA RθJ-P (°C/W) f = 1 MHz HSMB-C190/C170/C150/C191 3.8 4.6 5 300 67 HSMB-C110 3.8 4.6 5 300 67 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently avail- able bins. Tolerance: ±1 nm Note: 1. Bin categories are established for class- ification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Blue Color Bins[1] Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 VF Tolerance: ±0.1 V Tolerance: ±15%

For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-0417EN AV02-0613EN - July 27, 2007 Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours.