HSMA1XXX HSMC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 4
Technical content
Features
- For surface mounted applications
- Metal-Semiconductor junction with guardrjng
- Epitaxial construction
- Very low forward voltage drop
- High Current Capability
- Plastic material has UL flammability classification 94V-0
- For use in low voltage, high frequency inverters free wheeling And polarity orotection applications Mechanical Data
- Package: JEDEC DO-214AC(SMA) molded plastic
- Polarity: Indicated by cathode band
- Weight: 0.002 ounce, 0.064 gram Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%. Ratings Symbol HSMA 120 HSMA 130 HSMA 140 HSMA 150 HSMA 160 HSMA 170 HSMA 180 HSMA 190 HSMA
1100 Unit
Repetitive Peak Reverse Voltage VRRM 20 30 40 50 60 70 80 90 100 V Surge Peak Reverse Voltage VRSM 14 21 28 35 42 49 56 63 70 V DC Blocking Voltage VDC 20 30 40 50 60 70 80 90 100 V Average Forward Rectified Current (TL=100oC) I FAV 1 A Peak Forward Surge Current, 50Hz Half Sine-wave (TA=25oC) IFSM 30 A Instantaneous Forward Voltage VF 0.50 0.70 0.79(0.69@ Tj=100oC) V Leakage Current (TJ=25oC, VR=VRRM) 0.5 mA Leakage Current (TJ=100oC, VR=VRRM) IR 10.0 5.0 mA Typical Junction Capacitance CJ 110 30 pF Thermal Resistance Junction to Lead RθJL 30 25 30 Operating Junction Temperature Range TJ -55 to +125 °C Storage Temperature Range TSTG -55 to +150 °C
MICROELECTRONICS CORP. Spec. No. : HSMA2009021 Issued Date : 2009.03.05 Revised Date : Page No. : 2/4 HSMA120 thru HSMA160 HSMC Product Specification Characteristics Curve(HSMA120 to HSMA160) 120 to140 HSMA150 &160
MICROELECTRONICS CORP. Spec. No. : HSMA2009021 Issued Date : 2009.03.05 Revised Date : Page No. : 3/4 HSMA120 thru HSMA160 HSMC Product Specification Characteristics Curve(HSMA170 to HSMA1100)
MICROELECTRONICS CORP. Spec. No. : HSMA2009021 Issued Date : 2009.03.05 Revised Date : Page No. : 4/4 HSMA120 thru HSMA160 HSMC Product Specification DO-214AC(SMA) Dimension Marking: Note: Green label is used for pb-free packing DIM Min. Max. A 1.27 1.63 B 2.40 2.65 C 4.00 4.60 D 1.90 2.25 E 0.80 1.50 F 0.10 0.20 G 4.80 5.20 H 0.15 0.31 Unit: mm A B C H E G D F 2-Lead DO-214AC(SMA) Plastic Surface Mounted Package Marking: Note: Green label is used for pb-free packing DIM Min. Max. A 1.27 1.63 B 2.40 2.65 C 4.00 4.60 D 1.90 2.25 E 0.80 1.50 F 0.10 0.20 G 4.80 5.20 H 0.15 0.31 Unit: mm A B C H E G D F 2-Lead DO-214AC(SMA) Plastic Surface Mounted Package Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712