HSDL-9100 AVAGO | Alldatasheet
Document overview
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Technical content
Features
- Excellent optical isolation resulting in near zero optical cross-talk
- High efficiency emitter and high sensitivity photodiode for high signal-to-noise ratio
- Low cost & lead-free miniature surface-mount package Height – 2.70 mm Width – 2.75 mm Length – 7.10 mm
- Detect objects from near zero to 60mm
- Low dark current
- Guaranteed Temperature Performance -40°C to 85°C
- Lead-free and RoHS Compliant
Applications
- Mobile phones
- Notebooks
- Industrial Control
- Printers, Photocopiers and Facsimile machines
- Home Appliances
- Vending Machines Order Information Part Number Packaging Type Package Quantity HSDL-9100-001 Tape and Reel PCB Substrate, moulded package 500 HSDL-9100-021 Tape and Reel PCB Substrate, moulded package 2500 HSDL - 9100 Surface-Mount Proximity Sensor Data Sheet
Figure 1. Block Layout of HSDL-9100
- ILed = 300mA Pulse, 5% Duty Cycle (Kodak 18% Reflectance Gray Card)
1 LED_A LED Anode 1
2 LED_K LED Cathode -
3 DET_A Photodiode Anode -
4 DET_K Photodiode Cathode -
LED Forward Current Vs Forward Voltage @ Across Temperature 0.0 0.0 0.0 0.0 0.1 0.1 Forward Voltage (V) Forward Current (A) (Photodiode) Forward Current Vs Forward Voltage@Across Temp 000.0E+0 0.0E- 0.0E- 0.0E- 0.0E- 100.0E- 10.0E- Forward Voltage (V) Forward Current (A) (Photodiode) Rise/Fall Time Vs Load Resistance@Room Temp, ILED=00mA Pulse 000.0E+0 100.0E+0 00.0E+0 00.0E+0 00.0E+0 00.0E+0 00.0E+0 00.0E+0 00.0E+0 00.0E+0 1.0E+ 0.1 1 1 0 100 1000 10000 Load Resistance (kohm) Response Time (us) (Rise (Fall) Mean (Fall) Power Dissipation Vs Temperature 100 0 1 0 0 0 0 0 0 0 0 0 Power (mW) Temperature (˚C) Forward Current (A) Vs Temperature (degC) @Vcc=1V and 1.V 0.01 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.0 0.1 -0 -0 0 0 0 0 0 100 Forward Current (A) 1.V Temperature (˚C) Typical Characteristics LED Forward Current Vs Temperature 100 0 1 0 0 0 0 0 0 0 0 0 Temperature (˚C) Forward Current
1.0E- 10.0E- 100.0E- 1.0E- -0 -0 0 0 0 0 0 100 V V V (Photodiode) Dark Current Vdet = //V vs Across Temperature Dark Current (A) Temperature (˚C) Output Voltage vs Distance @ Room Temp and RL = 100K Ohm ILED = 100mA, 00mA and 00mA Pulse Distance (mm) Output Voltage (mV) 00mA 00mA 100mA 1 0 0 0 0 0 0 0 100 10 00 00 01.0E+0 10.0E+0 100.0E+0 1.0E+ Output Voltage Vs Edge Distance @ Room Temp and RL=100K Ohm ILED=00mA, D=//mm 100 1000 -10 - - - - 0 Edge Distance (mm) Output Voltage (mV) mm mm mm Distance = D(mm) Distance = -D(mm) mm LED PIN 1% Reflection Gray Card The diagram below illustrates the explanation of edge distance. Edge detection is labeled as D in the diagram below.
Figure 5. Package outline dimensions
Figure 6. Tape and Reel Dimensions
Baking should only be done once. age. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. baked before reflow to prevent damage to the parts. Figure 7. Baking conditions chart
to printed circuit board connections. of both the PC board and HSDL-9100 castellations. allow the solder within the connections to freeze solid. 25°C (77°F) should not exceed 6°C per second maximum. minimal stresses on the HSDL-9100 transceiver. Figure 8. Reflow graph
Figure 15. HSDL9100 configuration with controller chipset increase/decrease of the LED current supply.
10 Ohm
0 Ohm
00 Ohm
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