HSDL-5400

HSDL-4420-011 LITEON | Alldatasheet

Document overview

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Technical content

Features

• Subminiature flat top and dome package Size – 2x2 mm
• IR emitter 875 nm TS AlGaAs Intensity – 17 mW/sr Speed – 40 ns
• Wide range of drive currents 500 µA to 500 mA
• IR detector PIN photodiode High sensitivity Speed – 7.5 ns
• Flexible lead configurations Surface mount or through hole

Applications

• Short distance IR links
• IrDA compatible
• Small handheld devices Pagers Industrial handhelds
• Diffuse LANs
• Wireless audio HSDL-44xx IR Emitter Series HSDL-54xx IR Detector Series High-Performance IR Emitter and IR PIN Photodiode in Subminiature SMT Package Data Sheet

Part Number Device Description [1] Device Outline Drawing HSDL-4400 LED, Flat Top, 110 deg A HSDL-4420 LED, Dome, 24 deg B IR Detectors Part Number Device Description [1] Device Outline Drawing HSDL-5400 PIN Photodiode, Flat Top, 110 deg C HSDL-5420 PIN Photodiode, Dome, 28 deg D Package Configuration Options Option Package Code Package Configuration Description Outline Drawing

011 Gull Wing Lead, Tape and Reel [2] E, J, M

021 Yoke Lead, Tape and Reel [2] Surface Mount Lead F, K, M

031 Z-Bend, Tape and Reel [2] G, L, M

1L1 2.54 mm (0.100 in) Center Long Leads; 10.4 mm (0.410 in) Thru Hole Lead H 1S1 Lead Spacing Short Leads; 3.7 mm (0.145 in) I No Option Straight Leads [3] Prototyping A, B, C, D Notes: 1. IR Emitters have untinted, nondiffused lenses and IR Detectors have black tinted, nondiffused lenses. 2. Emitters and detectors are supplied in 12 mm embossed tape on 178 mm (7 inch) diameter reels, with 1500 units per reel. Minim um order quantity and order increment are in quantity of reels only. 3. Emitters and detectors are supplied in bulk form in bags of 50 units. 4. The HSDL-44xx and HSDL-54xx families are not designed to be used in medical devices with life support functions or in safety equipment (or similar applications where components failures would result in loss of life or physical harm), eg. in automotive, medical or airline in dustries.

NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD. 3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES. 4. CATHODE STRIPE MARKING IS DARK BLUE. Package Dimensions (A) Flat Top Emitters (B) Dome Emitters 1.14 1.40 (0.045) (0.055) 0.58 0.43 (0.023) (0.017) 1.91 2.16 (0.075) (0.085) 0.18 0.23 (0.007) (0.009) 0.76 (0.030) MAX. 1.91 2.41 (0.075) (0.095) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 4 0.46 0.56 (0.018) (0.022) 1.40 1.65 (0.055) (0.065) 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. NOTE 3 ANODE 1.65 1.91 (0.065) (0.075) DIA. CATHODE 11.68 10.67 (0.460) (0.420) BOTH SIDES NOTE 2 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. NOTE 3 ANODE 1.65 1.91 (0.065) (0.075) DIA. CATHODE 0.46 0.56 (0.018) (0.022) NOTE 2 11.68 10.67 (0.460) (0.420) BOTH SIDES 0.94 1.24 (0.037) (0.049) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 4 2.92 (0.115) MAX. 0.76 0.89 (0.030) (0.035) 0.63 0.38 (0.025) (0.015) 0.18 0.23 (0.007) (0.009) 1.91 2.16 (0.075) (0.085) 2.03 (0.080) 1.78 (0.070) 0.79 (0.031) 0.53 (0.021)

(D) Dome Detectors (C) Flat Top Detectors NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES). 2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD. 3. CATHODE STRIPE MARKING IS DARK BLUE. 1.14 1.40 (0.045) (0.055) 0.58 0.43 (0.023) (0.017) 1.91 2.16 (0.075) (0.085) 0.18 0.23 (0.007) (0.009) 0.76 (0.030) MAX. 1.91 2.41 (0.075) (0.095) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 3 0.46 0.56 (0.018) (0.022) 1.40 1.65 (0.055) (0.065) 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. CATHODE 1.65 1.91 (0.065) (0.075) DIA. ANODE 11.68 10.67 (0.460) (0.420) BOTH SIDES NOTE 2 0.25 (0.010) MAX.* 0.20 (0.008) MAX. 0.50 (0.020) REF. CATHODE 1.65 1.91 (0.065) (0.075) DIA. ANODE 0.46 0.56 (0.018) (0.022) NOTE 2 11.68 10.67 (0.460) (0.420) BOTH SIDES 0.94 1.24 (0.037) (0.049) 2.08 2.34 (0.082) (0.092) CATHODE STRIPE NOTE 3 2.92 (0.115) MAX. 0.76 0.89 (0.030) (0.035) 0.63 0.38 (0.025) (0.015) 0.18 0.23 (0.007) (0.009) 1.91 2.16 (0.075) (0.085) 2.03 (0.080) 1.78 (0.070) 0.79 (0.031) 0.53 (0.021)

0.76 (0.030) MAX. (F) “Yoke” Lead, Options 021 0.76 (0.030) MAX. Package Dimensions The following notes affect the package outline drawings E through I. 1. The pinout represents the HSDL-54xx IR detectors where the protruding support tab is closest to the anode lead. While the pinout is reversed for the HSDL-44xx IR emitters where the pro- truding support tab is closest to the cathode lead. 2. The protruding support tab of the HSDL-54xx is connected to the cathode lead. While the protruding support tab of the HSDL-44xx is connected to the anode lead. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES) (E) Gull Wing Lead, Option 011

(G) Z-Bend Lead, Options 031 0.76 (0.030) MAX. (H) Thru Hole Lead Option 1L1 (I) Thru Hole Lead Option 1S1

Package Dimensions: Surface Mount Tape and Reel Options (J) 12 mm Tape and Reel, Gull Wing Lead, Option 011 GULL WING LEAD SUBMINIATURE PACKAGE NOTES: 1. EMPTY COMPONENT POCKETS SEALED WITH TOP COVER TAPE. 2. 7 INCH REEL – 1500 PIECES PER REEL. 3. MINIMUM LEADER LENGTH AT EITHER END OF THE TAPE IS 500 mm. 4. THE MAXIMUM NUMBER OF CONSECUTIVE MISSING DEVICES IS TWO. 5. IN ACCORDANCE WITH ANSI/EIA RS-481 SPECIFICATIONS, THE CATHODE IS ORIENTED TOWARDS THE TAPE SPROCKETS HOLE.

(K) 12 mm Tape and Reel, “Yoke” Lead, Option 021 “YOKE” LEAD SUBMINIATURE PACKAGE

(L) 12 mm Tape and Reel, Z-Bend Lead, Option 031 Z-BEND LEAD SUBMINIATURE PACKAGE

(M) 12 mm Tape and Reel Convective IR Reflow Soldering For information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Components.

HSDL-44xx Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Ref. Peak Forward Current (Duty Factor = 20%, I FPK 500 mA Fig. 7, 8 Pulse Width = 100 µs) DC Forward Current I FDC 100 mA Fig. 6 Power Dissipation P DISS 100 mW Reverse Voltage (IR = 100 µA) V R 5V Transient Forward Current (10 µs Pulse) I FTR 1.0 A [1] Operating Temperature T O -40 85 °C Storage Temperature T S -55 100 °C Junction Temperature T J 110 °C Lead Solder Temperature 260/5 s °C [1.6 mm (0.063 in.) from body] Reflow Soldering Temperatures Convection IR 235/90 s °C Fig. 20 Vapor Phase 215/180 s °C Note: 1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and the wire bonds. HSDL-44xx Electrical Characteristics at T A = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Forward Voltage V F 1.30 1.50 1.70 V I FDC = 50 mA Fig. 2

2.15 I FPK = 250 mA

Forward Voltage ∆VF/∆T -2.1 mV/ °CI FDC = 50 mA Fig. 3 Temperature Coefficient -2.1 I FDC = 100 mA Series Resistance R S 2 Ω IFDC = 100 mA Diode Capacitance C O 50 pF 0 V, 1 MHz Reverse Voltage V R 52 0 V I R = 100 µA Thermal Resistance, R qjp 170 °C/W Junction to Pin

HSDL-44XX Optical Characteristics at T A = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Radiant On-Axis Intensity HSDL-4400 I E 1 3 8 mW/sr I FDC = 50 mA Fig. 4, 5 6I FDC = 100 mA

15 I FPK = 250 mA

HSDL-4420 I E 9 17 30 mW/sr I FDC = 50 mA Fig. 4, 5

32 I FDC = 100 mA

85 I FPK = 250 mA

Radiant On-Axis Intensity ∆IE/∆T -0.35 %/ °CI FDC = 50 mA Temperature Coefficient -0.35 I FDC = 100 mA Viewing Angle HSDL-4400 2 q1/2 110 deg I FDC = 50 mA Fig. 9 HSDL-4420 2 q1/2 24 deg I FDC = 50 mA Fig. 10 Peak Wavelength lPK 850 875 900 nm I FDC = 50 mA Fig. 1 Peak Wavelength ∆l/∆T 0.25 nm/ °CI FDC = 50 mA Temperature Coefficient Spectral Width at FWHM ∆l 37 nm I FDC = 50 mA Fig. 1 Optical Rise and Fall t r/tf 40 ns I FPK = 50 mA Times, 10%-90% Bandwidth f c 9M H z I FDC = 50 mA Fig. 11 ± 10 mA

HSDL-54xx Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Power Dissipation P DISS 150 mW Reverse Voltage (IR = 100 µA) V R 40 V Operating Temperature T O -40 85 °C Storage Temperature T S -55 100 °C Junction Temperature T J 110 °C Lead Solder Temperature [1.6 mm (0.063 in.) from body] 260/5 s °C Reflow Soldering Temperatures Convection IR 235/90 s °C Vapor Phase 215/180 s °C HSDL-54xx Electrical Characteristics at T A = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Forward Voltage V F 0.8 V I FDC = 1 mA Breakdown Voltage V BR 40 V I R = 100 µA, Ee = 0 mW/cm2 Reverse Dark Current I D 15 n A V R = 5 V, Fig. 12 Ee = 0 mW/cm2 Series Resistance R S 2000 Ω VR = 5 V, Ee = 0 mW/cm2 Diode Capacitance C O 5p F V R = 0 V, Fig. 16 Ee = 0 mW/cm2 f = 1 MHz Open Circuit Voltage V OC 375 mV E e = 1 mW/cm2 lPK = 875 nm Temperature Coefficient of V OC ∆VOC/∆T -2.2 mV/K E e = 1 mW/cm2 lPK = 875 nm Short Circuit Current I SC Ee = 1 mW/cm2 HSDL-5400 1.6 µA lPK = 875 nm HSDL-5420 4.3 µA Temperature Coefficient of I SC ∆ISC/∆T 0.16 %/K E e = 1 mW/cm2 lPK = 875 nm Thermal Resistance, R qjp 170 °C/W Junction to Pin

HSDL-54xx Optical Characteristics at T A = 25°C Parameter Symbol Min. Typ. Max. Unit Condition Ref. Photocurrent Ee = 1 mW/cm2 Fig 14, HSDL-5400 I PH 0.8 1.6 µA lPK = 875 nm 15 HSDL-5420 3.0 6.0 V R = 5 V Temperature Coefficient of I PH ∆IPH/∆T 0.1 %/K E e = 1 mW/cm2 Fig. 13 lPK = 875 nm VR = 5 V Radiant Sensitive Area A 0.15 mm 2 Absolute Spectral Sensitivity S 0.5 A/W E e = 1 mW/cm2 lPK = 875 nm VR = 5 V Viewing Angle HSDL-5400 2 q1/2 110 deg Fig. 18 HSDL-5420 28 Fig. 19 Wavelength of Peak Sensitivity lPK 875 nm E e = 1 mW/cm2 Fig. 17 VR = 5 V Spectral Bandwidth ∆l 770- nm E e = 1 mW/cm2 Fig. 17

1000 V R = 5 V

Quantum Efficiency h 70 % E e = 1 mW/cm2 lPK = 875 nm, VR = 5 V Noise Equivalent Power NEP 6.2 x W/Hz 1/2 VR = 5 V 10-15 lPK = 875 nm Detectivity D 6.3 x cm* V R = 5 V

1012 Hz1/2/W lPK = 875 nm

Optical Rise and Fall Times, 10%-90% t r/tf 7.5 ns V R = 5 V RL = 1 kΩ lPK = 875 nm Bandwidth f c 50 MHz V R = 5 V RL = 1 kΩ lPK = 875 nm

15 RELATIVE RADIANT INTENSITY

Figure 3. Forward voltage vs. ambient Figure 5. Normalized radiant intensity vs. peak forward current (0 to 10 mA). Figure 8. Maximum peak forward current vs. Figure 1. Relative radiant intensity vs. Figure 2. Peak forward current vs. forward Figure 4. Normalized radiant intensity vs. Figure 6. Maximum DC forward current vs. Figure 7. Maximum peak forward current vs.

Figure 12. Reverse dark current vs. ambient Figure 13. Relative reverse light current vs. Figure 10. Relative radiant intensity vs. angular displacement HSDL-4420.

0.9 IF = 50 mA

Figure 9. Relative radiant intensity vs. angular displacement HSDL-4400. Figure 11. Relative radiant intensity vs.

9 MHz

Figure 20. Evaluation soldering profiles (polyled). Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.