HSDL-3612-007

HSDL-3612 LITEON | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 25

Technical content

Features

• Fully compliant to IrDA 1.0 physical layer specifica - tions – 9.6 kb/s to 115.2 kb/s operation
• Typical link distance > 1.5 m
• IEC825-Class 1 eye safe
• Low power operation range – 2.7 V to 5.25 V
• Small module size – 4.0 x 12.2 x 5.1 mm (HxWxD)
• Complete shutdown – TXD, RXD, PIN diode
• Low shutdown current – 10 nA typical
• Adjustable optical power management – Adjustable LED drive-current to maintain link integrity
• Integrated EMI shield – Excellent noise immunity
• Edge detection input – Prevents the LED from long turn-on time
• Interface to various super I/O and controller devices
• Designed to accommodate light loss with cosmetic window
• Only 2 external components are required
• Lead free package TXD (9) MD0 (4) MD1 (5) GND (7,3) AGND (2) VCC (1) VCC SP HSDL-3612 CX1 CX2 LEDA (10) RXD (8)

The HSDL-3612 contains a high-speed and high-effi- ciency 870 nm LED, a silicon PIN diode, and an integrat- ed circuit. The IC contains an LED driver and a receiver providing a single output (RXD) for all data rates sup- ported. The HSDL-3612 can be completely shut down to achieve very low power consumption. In the shut down mode, the PIN diode will be inactive and thus producing very little photo-current even under very bright ambient light. The HSDL-3612 also incorporated the capability for adjustable optical power. With two programming pins; MODE 0 and MODE 1, the optical power output can be adjusted lower when the nominal desired link distance is one-third or two-third of the full IrDA link. The HSDL-3612 front view options (HSDL-3612-007/- 037) and a top view packaging option (HSDL-3612- 008/-038) come with integrated shield that helps to ensure low EMI emission and high immunity to EMI field, thus enhancing reliable performance. Application Support Information The Application Engineering group is available to assist you with the technical understanding associated with HSDL-3612 infrared transceiver module. You can contact them through your local sales representatives for ad- ditional details.

Ordering Information

Package Option Package Part Number Standard Package Increment Front View HSDL-3612-007 400 Front View HSDL-3612-037 1800 Top View HSDL-3612-008 400 Top View HSDL-3612-038 1800

I/O Pins Configuration Table Pin Description Symbol

1 Supply Voltage VCC

2 Analog Ground AGND

3 Ground GND

4 Mode 0 MD0

5 Mode 1 MD1

6 No Connection NC

7 Ground GND

8 Receiver Data Output RXD

9 Transmitter Data Input TXD

10 LED Anode LEDA

Transceiver I/O Truth Table Transceiver Inputs Outputs Mode TXD EI LED RXD Active 1 X On Not Valid Active 0 High[1] Off Low[2] Active 0 Low Off High Shutdown X [3] Low Not Valid Not Valid X = Don’t Care EI = In-Band Infrared Intensity at detector Notes: 1. In-Band El ≤ 115.2 kb/s. 2. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 3. To maintain low shutdown current, TXD needs to be driven high or low and not left floating. Transceiver Control Truth Table Mode 0 Mode 1 RX Function TX Function 1 0 Shutdown Shutdown 0 0 SIR Full Distance Power 0 1 SIR 2/3 Distance Power 1 1 SIR 1/3 Distance Power 8 7 6 5 4 3 2 1910 BACK VIEW (HSDL-3612-007/-037) 8 7 6 5 4 3 2 1910 BOTTOM VIEW (HSDL-3612-008/-038)

Recommended Application Circuit Components Component Recommended Value R1 6.2 Ω ± 5%, 0.5 Watt, for 2.7 ≤ VCC ≤ 3.6 V operation 15.0 Ω ± 5%, 0.5 Watt, for 4.75 ≤ VCC ≤ 5.25 V operation CX1 [4] 0.47 µF ± 20%, X7R Ceramic CX2 [5] 6.8 µF ± 20%, Tantalum Notes: 4. CX1 must be placed within 0.7 cm of the HSDL-3612 to obtain optimum noise immunity. 5. In “HSDL-3612 Functional Block Diagram” on page 1 it is assumed that Vled and VCC share the same supply voltage and filter capacitors. In case the 2 pins are powered by different supplies CX2 is applicable for Vled and CX1 for VCC. In environments with noisy power supplies, including CX2 on the VCC line can enhance supply rejection performance. ILED vs. LEDA. Light Output Power (LOP) vs. ILED. Marking Information The HSDL-3612-007/-037 is marked “3612YYWW” on the shield where “YY” indicates the unit’s manufactur- ing year, and “WW” refers to the work week in which the unit is tested. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to dam- age from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.ILED (A) 0.7 LEDA VOLTAGE (V) 0.3 1.7 2.1 0.1 1.3 2.3 0.5 1.5 1.9 0.6 0.4 0.2 LOP (mW/sr) 200 ILED (mA) 120 270 0 300 160 30 150 180 120 100 90 18060 210 240 140

Absolute Maximum Ratings[6] Parameter Symbol Minimum Maximum Unit Conditions Storage Temperature T S –40 +100 °C Operating Temperature T A –20 +70 °C DC LED Current ILED(DC) 165 mA Peak LED Current ILED(PK) 750 mA ≤ 2 µs pulse width, ≤ 10% duty cycle LED Anode Voltage V LEDA –0.5 7 V Supply Voltage Vcc 0 7 V Transmitter Data ITXD(DC) –12 12 mA Input Current Receiver Data VO –0.5 Vcc+0.5 V |I O(RXD)| = 20 µA Output Voltage Note: 6. For implementations where case to ambient thermal resistance ≤ 50°C/W. Recommended Operating Conditions Parameter Symbol Minimum Maximum Unit Operating Temperature TA –20 +70 °C Supply Voltage VCC 2.7 5.25 V Logic High Input Voltage VIH 2 VCC/3 VCC V for TXD, MD0, MD1, and FIR_SEL Logic Low Transmitter Input Voltage VIL 0 VCC/3 V LED (Logic High) Current Pulse Amplitude I LEDA 180 300 mA Receiver Signal Rate 2.4 115.2 kb/s

Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test condi- tions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Unit Conditions Transceiver Supply Shutdown I CC1 10 200 nA V I(TXD) ≤ VIL or Current V I(TXD) ≥ VIH Idle ICC2 2.5 5 mA V I(TXD) ≤ VIL, EI = 0 Digital Input Logic IL/H –1 1 µA 0 ≤ VI ≤ VCC Current Low/High Transmitter Transmitter Logic High EI H 50 120 400 mW/sr V IH = 3.0 V Radiant Intensity I LEDA = 200 mA Intensity θ 1/2 ≤ 15° Peak λP 875 nm Wavelength Spectral ∆λ 1/2 35 nm Line Half Width Viewing Angle 2θ 1/2 30 60 ° Optical Pulse tpw (EI) 1.5 1.6 1.8 µs tpw(TXD) = 1.6 µs at Width 115.2 kb/s Rise and Fall t r (EI), 40 ns tpw(TXD) = 1.6 µs at Times tf (EI) 115.2 kb/s t r/f (TXD) = 10 ns Maximum tpw (max) 20 50 µs TXD pin stuck high Optical Pulse Width LED Anode VON(LEDA) 2.4 V I LEDA = 200 mA, On State Voltage V I(TXD) ≥ VIH LED Anode ILK(LEDA) 1 100 nA V LEDA = VCC = 5.25 V, Off State Leakage Current V I(TXD) ≤ VIL

Electrical & Optical Specifications Specifications hold over the Recommended Operating Conditions unless otherwise noted. Unspecified test condi- tions can be anywhere in their operating range. All typical values are at 25°C and 3.3 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Unit Conditions Receiver Receiver Logic Low [7] V OL 0 - 0.4 V I OL = 1.0 mA, Data Output EI ≥ 3.6 µW/cm2, Voltage θ1/2 ≤ 15° Logic High V OH V CC – 0.2 - V CC V I OH = –20 µA, EI ≤ 0.3 µW/cm2, θ1/2 ≤ 15° Viewing Angle 2θ 1/2 30 ° Logic High Receiver Input EI H 0.0036 500 mW/cm 2 For in-band signals ≤ Irradiance 115.2 kb/s[8] Logic Low Receiver Input EI L 0.3 µW/cm 2 For in-band signals [8] Irradiance Receiver Peak Sensitivity λ P 880 nm Wavelength Receiver SIR Pulse Width tpw (SIR) 1 4.0 µs θ 1/2 ≤ 15°[9], CL = 10 pF Receiver Latency Time tL 20 50 µs Receiver Rise/Fall Times tr/f (RXD) 25 ns Receiver Wake Up Time tW 100 µs [10] Notes: 7. Logic Low is a pulsed response. The condition is maintained for duration dependent on pattern and strength of the incident intensity. 8. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 9. For in-band signals ≤ 115.2 kb/s where 3.6 µW/cm 2 ≤ EI ≤ 500 mW/cm2. 10. Wake Up Time is the time between the transition from a shutdown state to an active state and the time when the receiver is active and ready to receive infrared signals.

Receiver Wake Up Time Definition (when MD0 π 1 and MD1 π 0) TXD “Stuck ON” Protection tpw (MAX.) TXD LED tf VOH 90% 50% 10%VOL tpw tr tf LED OFF 90% 50% 10% LED ON tpw tr RX LIGHT tw RXD VALID DATA

HSDL-3612-007 and HSDL3612-037 Package Outline with Dimension and Recommended PC Board Pad Layout PIN 1 MOUNTING CENTER 6.10 4.18 4.00 12.20 3.84 R 1.77R 2.00 4.05 4.95

10 CASTELLATION:

PITCH 1.1 ± 0.1 CUMULATIVE 9.90 ± 0.1 0.70 0.80 1.70 PIN 10 0.45 1.20 0.80 2.45 1.90 3.24 1.90 4.98 MID OF LAND 1.05 2.40 2.35 2.84 2.08 0.70 0.43 PIN 10PIN 1 MOUNTING CENTER TOP VIEW FRONT VIEW LAND PATTERNBACK VIEW SIDE VIEW ALL DIMENSIONS IN MILLIMETERS (mm). DIMENSION TOLERANCE IS 0.20 mm UNLESS OTHERWISE SPECIFIED. 1.17 PIN VCC AGND GND MD0 MD1 PIN NC GND RXD TXD LEDA FUNCTION FUNCTION

HSDL-3612-008 and HSDL3612-038 Package Outline with Dimension and Recommended PC Board Pad Layout 3.85 0.47 0.36 0.83 0.42 0.94 0.31 0.84 0.53 0.31 0.28 1.77 2.15 +0.05 -0.00 12.2 +0.10 -0.00 4.16 +0.05 -0.00 11.7 +0.05 -0.00 2.5 11.7 0.85 0.32.08 1.46 2.57 3.843.24 2.08 R2.3 R2.1 0.1 0.1 4.65 R2 R1.77 0.8 0.73 0.94 1.95

Tape and Reel Dimensions (HSDL-3612-007, -037) ALL DIMENSIONS IN MILLIMETERS (mm) R 1.00 2.00 ± 0.50 LABEL EMPTY PARTS MOUNTED LEADER EMPTY (400 mm MIN.) (40 mm MIN.) DIRECTION OF PULLING (40 mm MIN.) CONFIGURATION OF TAPE 13.00 ± 0.50 SHAPE AND DIMENSIONS OF REELS QUANTITY = 400 PIECES PER REEL (HSDL-3612-007)

1800 PIECES PER TAPE (HSDL-3612-037)

21.00 ± 0.80 12.50 ± 0.10 8.00 ± 0.10 4.00 ± 0.10 24.00 ± 0.30 1.75 ± 0.10 0.40 ± 0.10 4.25 ± 0.10 Æ1.55 ± 0.05 11.50 ± 0.10 2.00 ± 0.10 B B 5 (MAX.) 5 (MAX.) 5.20 ± 0.10 A A SECTION A-A SECTION B-B 3.8A A Æ1.5 ± 0.1 10 4 5 6 4.4 A A A

Tape and Reel Dimensions (HSDL-3612-008, -038) ALL DIMENSIONS IN MILLIMETERS (mm) R 1.00 2.00 ± 0.50 LABEL EMPTY PARTS MOUNTED LEADER EMPTY (400 mm MIN.) (40 mm MIN.) DIRECTION OF PULLING (40 mm MIN.) CONFIGURATION OF TAPE 13.00 ± 0.50 SHAPE AND DIMENSIONS OF REELS QUANTITY = 400 PIECES PER REEL (HSDL-3612-008)

1800 PIECES PER TAPE (HSDL-3612-038)

21.00 ± 0.80 BoW E T Ko F BDo P2 D1Po 5.4 ± 0.15 SYMBOL SPEC SYMBOL SPEC Ao 4.4 ± 0.10 Bo 12.50 ± 0.10 Ko 4.85 ± 0.10 Po 4.0 ±0.10 8.0 ± 0.10 2.0 ± 0.10 T 0.35 ± 0.10 E 1.75 ± 0.10 F 11.5 ± 0.10 Do 1.55 ± 0.10 1.5 ± 0.10 W 24.0 ± 0.3 10Po 40.0 ± 0.20 B 5 (MAX.) 5 (MAX.) A A SECTION A-A NOTES: 2. Corner camber shall be not more than 1 mm per 100 mm through a length of 250 mm. 3. Ao and Bo measured on a place 0.3 mm above the bottom of the pocket. 4. Ko measured from a place on the inside bottom of the pocket to top surface of carrier. 5. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. SECTION B-B 8 ± 0.10 Ao

If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In reels 60°C ≥ 48 hours In bulk 100°C ≥ 4 hours 125°C ≥ 2 hours 150°C ≥ 1 hour Baking should be done only once. Recommended Storage Conditions Storage 10°C to 30°C Temperature Relative below 60% RH Humidity Time from Unsealing to Soldering After removal from the bag, the parts should be sol- dered within three days if stored at the recommended storage conditions. If times longer than 72 hours are needed, the parts must be stored in a dry box. Moisture Proof Packaging All HSDL-3612 options are shipped in moisture proof package. Once opened, moisture absorption begins. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30 C, AND LESS THAN 60% RH PACKAGE IS OPENED LESS THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO NO YES

The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow sol- der process. The temperature profile is divided into four process zones, each with different ∆T/∆time tempera- ture change rates. The ∆T/∆time rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1 , the PC board and HSDL-3612 cas- tellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and HSDL-3612 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The tem- perature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections be- comes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and HSDL-3612 castellations to change dimen- sions evenly, putting minimal stresses on the HSDL- 3612 transceiver. Recommended Reflow Profile Process Zone Symbol DT Maximum DT/Dtime Heat Up P1, R1 25°C to 160°C 4°C/s Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s P3, R3 200°C to 255°C 4°C/s Solder Reflow (260°C at 10 seconds max.) P3, R4 255°C to 200°C -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s t-TIME (SECONDS) T – TEMPERATURE – ( C) 200 170 125 100 50 150100 200 250 300 150 183 230 HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN R3 R4 90 sec. MAX. ABOVE 183 C MAX. 245 C

Appendix A: HSDL-3612-007/-037 SMT Assembly Application Note

1.0 Solder Pad, Mask and Metal Solder Stencil Aperture

1.1 Recommended Land Pattern for HSDL-3612-007/-037

Figure 1.0. Stencil and PCBA. Figure 2.0. Top view of land pattern. Dim. mm Inches a 2.40 0.095 b 0.70 0.028 c (pitch) 1.10 0.043 d 2.35 0.093 e 2.80 0.110 f 3.13 0.123 g 4.31 0.170 METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN PCBA STENCIL APERTURE SOLDER MASK SHIELD SOLDER PAD a b f theta 10x PAD Y d e g Rx LENSTx LENS FIDUCIAL X c FIDUCIAL

1.2 Adjacent Land Keep-out and Solder Mask Areas

Dim. mm Inches h min. 0.2 min. 0.008 j 13.4 0.528 k 4.7 0.185 l 3.2 0.126

• Adjacent land keep-out is the maximum space oc- cupied by the unit relative to the land pattern. There should be no other SMD components within this area.
• “ h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads.
• It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid Photo-Imaginable solder resist/mask is recommended. Figure 3.0. HSDL-3612-007/-037 PCBA – Adjacent land keep-out and solder mask.

2.0 Recommended Solder Paste/Cream Volume for

Based on calculation and experiment, the printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). h l Rx LENSTx LENS DIM. m m I NCHES h j k l MIN. 0.2 13.4 4.7 3.2 MIN. 0.008 0.528 0.185 0.126 j SOLDER MASK LAND k • ADJACENT LAND KEEP-OUT IS THE MAXIMUM SPACE OCCUPIED BY THE UNIT RELATIVE TO THE LAND PATTERN. THERE SHOULD BE NO OTHER SMD COMPONENTS WITHIN THIS AREA.

• "h" IS THE MINIMUM SOLDER RESIST STRIP WIDTH REQUIRED TO AVOID SOLDER BRIDGING ADJACENT PADS.
• IT IS RECOMMENDED THAT 2 FIDUCIAL CROSS BE PLACED AT MID-LENGTH OF THE PADS FOR UNIT ALIGNMENT. Y

Allowable Misalignment Tolerance X – direction ≤ 0.2 mm (0.008 inches) Theta – direction ± 2 degrees

2.1 Recommended Metal Solder Stencil Aperture

It is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. The following combina- tion of metal stencil aperture and metal stencil thick- ness should be used:

3.0 Pick and Place Misalignment Tolerance and

Product Self-Alignment after Solder Reflow If the printed solder paste volume is adequate, the unit will self-align in the X-direction after solder reflow. Units should be properly reflowed in IR Hot Air convec- tion oven using the recommended reflow profile. The direction of board travel does not matter. See Fig 4.0 t, nominal stencil thickness l, length of aperture mm inches mm inches w, the width of aperture is fixed at 0.70 mm (0.028 inches) Aperture opening for shield pad is 2.8 mm x 2.35 mm as per land dimensions Figure 4.0. Solder paste stencil aperture. APERTURE AS PER LAND DIMENSIONS SOLDER PASTE l w t (STENCIL THICKNESS)

3.1 Tolerance for X-axis Alignment of Castellation

Misalignment of castellation to the land pad should not exceed 0.2 mm or approximately half the width of the castellation during placement of the unit. The castel- lations will completely self-align to the pads during solder reflow as seen in the pictures below. Photo 2.0. Castellation self-align to land pads after reflow. Photo 3.0. Unit is rotated before reflow.

3.2 Tolerance for Rotational (Theta) Misalignment

Units when mounted should not be rotated more than ± 2 degrees with reference to center X-Y as specified in Fig 2.0. Pictures 3.0 and 4.0 show units before and after reflow. Units with a Theta misalignment of more than 2 degrees do not completely self align after reflow. Units with ± 2 degree rotational or Theta misalignment self- aligned completely after solder reflow. Photo 1.0. Castellation misaligned to land pads in x-axis before reflow. Photo 4.0. Unit self-aligns after reflow.

3.3 Y-axis Misalignment of Castellation

In the Y-direction, the unit does not self-align after sol- der reflow. It is recommended that the unit be placed in line with the fiducial mark (mid-length of land pad.) This will enable sufficient land length (minimum of 1/2 land length.) to form a good joint. See Fig 5.0. Figure 5.0. Section of a castellation in Y-axis. Photo 5.0. Good solder joint.

3.4 Example of Good HSDL-3612-007/-037 Castella-

This joint is formed when the printed solder paste volume is adequate, i.e. 0.30 cubic mm and reflowed properly. It should be reflowed in IR Hot-air convection reflow oven. Direction of board travel does not matter.

4.0 Solder Volume Evaluation and Calculation

Geometry of an HSDL-3612-007/ -037 solder fillet. MINIMUM 1/2 THE LENGTH OF THE LAND PAD LENS EDGE FIDUCIAL Y 0.8 1.2 0.70 0.425 0.20 0.70.4

Figure 1. Stencil and PCBA.

2.0 Y-axis Misalignment of Castellation

length) to form a good joint. See Figure 2. Figure 2. Section of a castellation in Y-axis.

To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cone angles are met without vignetting. The maximum dimensions mini- mize the effects of stray light. The minimum size cor- responds to a cone angle of 300 and the maximum size corresponds to a cone angle of 60º. In the figure below, X is the width of the window, Y is the height of the window and Z is the distance from the HSDL-3612 to the back of the window. The distance from the center of the LED lens to the center of the photodiode lens, K, is 7.08mm. The equations for com- puting the window dimensions are as follows: X = K + 2*(Z+D)*tanA Y = 2*(Z+D)*tanA Appendix C: Optical Port Dimensions for HSDL-3612: The above equations assume that the thickness of the window is negligible compared to the distance of the module from the back of the window (Z). If they are comparable, Z’ replaces Z in the above equation. Z’ is defined as Z’=Z+t/n where ‘t’ is the thickness of the window and ‘n’ is the re- fractive index of the window material. The depth of the LED image inside the HSDL-3612, D, is 8mm. ‘A’ is the required half angle for viewing. For IrDA compliance, the minimum is 150 and the maximum is 300. Assuming the thickness of the window to be neg- ligible, the equations result in the following tables and graphs: Section of a castellation in Y-axis.

Aperture Width Aperture height (x, mm) (y, mm) Module Depth, (z) mm max. min. max. min. 0 16.318 11.367 9.238 4.287 1 17.472 11.903 10.392 4.823 2 18.627 12.439 11.547 5.359 3 19.782 12.975 12.702 5.895 4 20.936 13.511 13.856 6.431 5 22.091 14.047 15.011 6.967 6 23.246 14.583 16.166 7.503 7 24.401 15.118 17.321 8.038 8 25.555 15.654 18.475 8.574 9 26.710 16.190 19.630 9.110

Almost any plastic material will work as a window mate- rial. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the total optical loss of the window should be 10 percent or less for best optical performance. Light loss should be measured at 875 nm. Flat Window (First choice) Curved Front and Back (Second choice) Curved Front, Flat Back (Do not use) Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the ra- diation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or indus- trial design reasons, place the same curve on the back side of the window that has an identical radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radia- tion pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.

For company and product information, please go to our web site: WWW.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.