HSDL-3208 LITEON | Alldatasheet

Document overview

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Technical content

Features

  • Fully compliant to IrDA 1.4 low power specification from 9.6 kbit/s to 115.2 kbit/s
  • Miniature package – Height: 1.60 mm – Width: 7.00 mm – Depth: 2.80 mm
  • Miniature package (with shield) – Height: 1.80 mm – Width: 7.40 mm – Depth: 2.90 mm
  • Guaranteed temperature performance, -25 to +70°C – Critical parameters are guaranteed over temperature and supply voltage
  • Low power consumption – Low shutdown current (1 nA typical) – Complete shutdown of TXD, RXD, and PIN diode
  • Withstands >100 mVp-p power supply ripple typically
  • Excellent EMI performance without shield CC supply 2.4 to 3.6 volts
  • LED stuck-high protection
  • Designed to accommodate light loss with cosmetic windows
  • IEC 825-class 1 eye safe
  • Lead-free and RoHS compliant

Applications

  • IRFM
  • Mobile telecom – Cellular phones – Pagers – Smart phones
  • Data communication – PDAs – Portable printers
  • Digital imaging – Digital cameras – Photo-imaging printers HSDL-3208 Ultra Small Profile Package IrDA® Data Compliant Low Power 115.2 kbit/s Infrared Transceiver Data Sheet

The Application Engineering group in Lite-On Technology is available to assist you with the Order Information Part Number Packaging Type Package Quantity HSDL-3208-021 Tape and Reel Front View 2500 Recommended Application Circuit Components Component Recommended Value Notes R1 30 Ω ± 5%, 0.25 Watt for 2.4 <= V CC <= 3.6 V CX1 0.47 µF ± 20%, X7R Ceramic 8 CX2 6.8 µF ± 20%, Tantalum 9 Notes: 8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity. 9. In environments with noisy power supplies, supply rejection performance can be enhanced by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1. technical understanding associated with HSDL-3208 infrared transceiver module. You can contact them through your local Lite-On sales representatives for additional details. I/O Pins Configuration Table Pin Symbol Description I/O Type Notes

1 LED A LED Anode Input 1

2 LED C LED Cathode 2

3 TXD Transmit Data Input, Active High 3

4 RXD Receive Data Output, Active Low 4

5 SD/Mode Shutdown Input, Active High 5

6V CC Supply Voltage Supply Voltage 6

7 GND Ground Ground 7

Notes: 1. This pin can be connected directly to V CC (i.e. without series resistor) at less than 3 V. 2. Leave this pin unconnected. 3. This pin is used to transmit serial data when SD pin is low. Do not float the pin. This pin has an internal 500 k Ω pulldown with a typical input capacitance of 2 pF. 4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state mode when the transceiver is in shutdown mode. This pin tristates with a weak 500 k Ω pullup resistor. 5. The transceiver is in shutdown mode if this pin is high. Do not float the pin. 6. Regulated, 2.4 to 3.6 volts. 7. Connect to system ground. Marking Information The unit is marked with ‘YWL’ on the back of the PCB for front option without shield. Y = year W = work week L = lot information

For implementations where case to ambient thermal resistance is ≤ _50°C/W. Parameter Symbol Min. Max. Units Notes Storage Temperature T S -40 +100 °C Operating Temperature T A -25 +85 °C LED Anode Voltage V LEDA 0 6.5 V Supply Voltage V CC 0 6.5 V Input Voltage: TXD, SD/Mode V I 0 6.5 V Output Voltage: RXD V O 0 6.5 V DC LED Transmit Current I LED (DC) 50 mA Peak LED Transmit Current I LED (PK) 250 mA 10 Note: 10. ≤ 20% duty cycle, ≤ 90 µs pulse width. CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from the electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Units Conditions Operating Temperature T A -25 70 °C Supply Voltage V CC 2.4 3.6 V Logic Input Voltage Logic High V IH 2/3 VCC VCC V Logic Low V IL 0 1/3 V CC V Receiver Input Logic High EI H 0.0081 500 mW/cm 2 For in-band signals ≤ 115.2kbit/s[11] Logic Low EI L 1 µW/cm2 For in-band signals[11] LED (Logic High) Current I LEDA 50 mA Pulse Amplitude Receiver Data Rate 9.6 115.2 kbit/s Note: 11. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4. for TXD, SD/Mode Irradiance

Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver Viewing Angle 2 θ 30 ° Peak Sensitivity Wavelength λp 880 nm RXD Output Logic High V OH VCC-0.2 V CC VI OH = -200 µA, EI ≤ 1 µW/cm2 Logic Low V OL 0 0.4 V I OL = 200 µA, EI ≥ 8.1 µW/cm2 RXD Pulse Width (SIR) t PW (SIR) 1 4.0 µs θ ≤ 15°, CL =12 pF RXD Rise and Fall Times t r, tf 50 ns C L =12 pF Receiver Latency Time t L 70 µs Receiver Wake Up Time t W 90 µs Transmitter Radiant Intensity High Power IE H 4 8 mW/sr I LEDA = 50 mA, θ ≤ 15°, VTXD ≥ VIH T = 25 °C Low Power IE H 2.4 4.8 mW/sr I LEDA = 30 mA, θ ≤ 15°, VTXD ≥ VIH T = 70°C, VCC = 2.4 V Viewing Angle 2 θ 30 60 ° Peak Wavelength λp 875 nm Spectral Line Half Width ∆λ 35 nm TXD Input Current High I H 0.02 10 µAV I ≥ VIH Low I L -10 -0.02 10 µA0 ≤ VI _≤ VIL LED Current On I VLED 50 mA V I (TXD) ≥ VIH, VI (SD) ≤ VIL Shutdown I VLED 20 100 nA V I (SD) ≥ VIH Maximum Optical PW tPW(max.) 25 100 µs TXD Rise and Fall Time (Optical) t r, tf 600 ns tpw (TXD) = 1.6 µs LED Anode High Power V ON(LEDA) 1.7 1.8 V I LEDA = 50 mA, VI(TXD) ≥ VIH on State Voltage Low Power V ON(LEDA) 2.1 2.25 V I LEDA = 30 mA, VI(TXD) ≥ VIH T = 70°C, VCC = 2.4 V LED Anode Current Low Power I LEDA 32 42 mA max. current measured at V LED = 4.3 V and R = 33 Ω Transceiver Supply Current Shutdown I CC1 0.001 1 µAV SD ≥ VCC -0.5, TA = 25°C Idle I CC2 100 200 µAV I (TXD) ≤ VIL, EI = 0 Active I CC3 0.8 3.1 mA V CC = 3.6 V, V I(TXD)≤ 1/3 V CC[12] Receiver Notes: 12. Typical value is at EI = 10 mW/cm 2, maximum value is at EI = 500 mW/cm 2. Voltage

Figure 12. Package outline dimensions. (Unit: mm, Tolerance: ± 0.2 mm)

3.50 MOUNTING CENTER

Figure 13. Tape and reel dimensions.

HSDL-3208 (Shielded) Package Dimensions Figure 14a. Package outline dimensions. 1. Unless otherwise stated, dimension tolerance: ± 0.2 mm. The specification is: 0.63 ± 0.03 mm. 321 2.9 0.95 0.950.64 0.6 75 64 0.63 ± 0.03 7.40 ± 0.10 6.96 3.7 1.80 ± 0.05 0.8 0.99 0.950.95 5.1 R1.1 0.6 1.6 1.97 0.2 COPLANARITY = –0.1 mm to 0.0 mm EMITTER MOUNTING CENTER RECEIVER 2.02.5 7.00+0.03 –0.00 0.15+0.02 –0.01

Figure 15. Tape dimensions.

Baking should only be done once. Figure 16. Baking conditions chart.

convective reflow solder process. printed circuit board connections. Figure 17. Reflow graph.

1.0 Solder Pad, Mask and Metal

Figure 18. Stencil and PCBA.

1.1 Recommended Land Pattern

Figure 19. Stencil and PCBA.

1.3 Adjacent Land Keepout and

Figure 21. Adjacent land keepout and solder mask areas.

1.2 Recommended Metal Solder

thickness that should be used. Figure 20. Solder stencil aperture.

2.0 Solder Pad, Mask and Metal

Figure 22. Stencil and PCBA.

2.1 Recommended Land Pattern

Figure 23. Land Pattern.

2.3 Adjacent Land Keepout and

Figure 25. Adjacent land keepout and solder mask areas.

2.2 Recommended Metal Solder

thickness that should be used. Figure 24. Solder stencil aperture.

Figure 26. PCB layout suggestion. trace, unlike the other transceivers. connected to the ground plane.

  1. C1 and C2 are optional supply
  2. VLED can be connected to either

which carries a high current.

  1. Preferably a multi-layered board

ground connected board layers. an example of a 4-layer board. GROUND PIN TO BOTTOM GROUND LAYER.

Appendix C : General Application Guide for the HSDL-3208 Infrared IrDA Compliant 115.2 kb/s Transceiver

Description

The HSDL-3208 is an ultra-small low-cost infrared transceiver module that provides the interface between logic and infrared (IR) signals for through air, serial, half-duplex IR data link. The device is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It is Minimum Peak Pulse Recommended R1 V CC Intensity LED Current 30 Ω 3.3 V 9 mW/Sr 50 mA Figure 27. IR layout in mobile phone platform.

  • Low passive component count
  • Shutdown mode for low power consumption requirement Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of V CC as shown in the table below. TRANSCEIVER MOD/ DE-MODULATOR SPEAKER RF INTERFACE AUDIO INTERFACE USER INTERFACE MICROCONTROLLER DSP CORE ASIC CONTROLLER IR MICROPHONE HSDL-3208 Interface to Recommended I/O Chips The HSDL-3208’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The diagram below shows how the IR port fits into the mobile phone platform and PDA platform.

Figure 28. IR layout in PDA platform. 40 cm has been demonstrated.

index of the window material. Figure 29. Window design diagram.

Polycarbonate is recommended. Note: 920A and 940A are more flame retardant than 141L. Recommended Dye: Violet #21051 (IR transmissant above 625 nm). significantly reduce the effects. the back surface to the transceiver. Figure 32. Shape of windows.

For company and product information, please go to our web site: WWW.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.