HSDL-3002 AVAGO | Alldatasheet
Document overview
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Technical content
Features
- Guaranteed temperature performance, –20 to 70°C – Critical parameters are guaranteed over temperature and supply voltage
- Low power consumption
- Small module size – Height: 2.70 mm – Width: 9.10 mm – Depth: 3.65 mm
- Withstands >100 mV p-p power supply ripple typically
- V CC supply 2.7 to 5.5 volts
- Integrated EMI shield
- Designed to accommodate light loss with cosmetic windows
- IEC 825-class 1 eye safe IrDA Data Features
- Fully compliant to IrDA physical layer specifications version 1.4 from 9.6 kbit/s to 115.2 kbit/s – Excellent nose-to-nose operation – Link distance up to 50 cm
- Complete shutdown for TXD(IrDA), RXD(IrDA), and PIN diode
- Low shutdown current (10 nA typical)
- LED stuck-high protection Remote Control Features
- High radiant intensity
- Spectrally suited to remote control receiver
- Typical link distance at 6 m
Applications
- Mobile data communication and universal remote control – PDAs – Mobile phone HSDL-3002 IrDA® Data Compliant Low Power 115.2 kbit/s with Remote Control Transmission Infrared Transceiver Data Sheet
Ordering Information
Part Number Packaging Type Package Quantity HSDL-3002-007 Tape and Reel Front View 2500 Application Support Information The Application Engineering Group is available to assist you with the application designs associated with the HSDL-3002 infrared transceiver module. You can contact them through your local sales representatives for additional details. Figure 1. Functional block diagram of HSDL-3002. Figure 2. Rear view diagram with pin-out.
Recommended Application Circuit Components Component Recommended Value R1[1] 2.2 Ω ± 5%, 0.25 Watt for 2.7 ≤ VCC ≤ 3.3 V 2.7 Ω ± 5%, 0.25 Watt for 3.0 ≤ VCC ≤ 3.6 V 6.8 Ω ± 5%, 0.25 Watt for 4.5 ≤ VCC ≤ 5.5 V R2 0 Ω , 0.25 Watt for 4.5 ≤ VCC ≤ 5.5 V CX1[2] 0.47 µF ± 20%, X7R Ceramic CX2[3] 6.8 µF ± 20%, Tantalum Q1 N-Channel Logic Level MOSFET (Philip’s BSH103) with less than 1 Ω ‘ON’ resistance Notes: 1. R1 is used to optimize the performance of the 870 nm LED, while R2 is the current limiting resistor for the 940 nm RC LED. 2. CX1 must be placed within 0.7 cm of HSDL-3002 to obtain optimum noise immunity. 3. In environment with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in Figure 1. I/O Pins Configuration Table Pin Symbol I/O Description Notes
1 LED A I IR and Remote Control Tied through external resistor, R1,
LED Anode to regulate V CC from 2.7 to 5.5 Volt 2 V(RC) I Remote Control LED Cathode Connected to an external switching transistor. Do not float the input pin of the swithcing transistor. 3 TXD (IrDA) I IrDA Transmitter Data Input. Logic high turns on the LED. If held high longer than Active High ~50 µs, the LED is turned off. TXD (IrDA) must be driven either high or low. DO NOT leave the pin floating. 4 RXD (IrDA) O IrDA Receiver Data Output. Output is at low pulse response when light pulse is seen. Active Low 5 SD I Shutdown. Active High Complete shutdown TXD(IrDA), RXD(IrDA), and PIN diode 6V CC I Supply Voltage Regulated, 2.7 to 5.5 Volt
7 NC - No internal connection
8 GND I Connect to system ground Connect to system ground
- SHIELD - EMI Shield Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part.
For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Symbol Min. Max. Units Conditions Storage Temperature T S –40 100 °C Operating Temperature T A –20 70 °C LED Supply Voltage V LED 07 V Supply Voltage V CC 07 V Output Voltage: RXD V O –0.5 7 V LED Current Pulse Amplitude ILED 500 mA ≤ 90 µs Pulse Width ≤ 20% duty cycle Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature T A –20 70 °C Supply Voltage V CC 2.7 5.5 V Logic Input Voltage for TXD Logic High V IH 2/3 VCC VCC V Logic Low V IL 0 1/3 V CC V Receiver Input Irradiance Logic High EI H 0.0081 500 mW/cm 2 For in-band signals ≤ 115.2 kbps[7] Logic Low EI L 0.3 mW/cm 2 For in-band signals[7] TXD Pulse Width (SIR) t TPW (SIR) 1.5 1.6 µst PW (TXD) = 1.6 µs at 115.2 kbps Receiver Data Rate 9.6 115.2 kbps Transceiver I/O Truth Table Inputs Outputs Transceiver Mode Shutdown IrDA (TXD) Remote Control Input EI IR LED RC LED RXD Active 0 0 0 High [4] Off Off Low [5] Active 0 0 0 Low Off Off High Active 0 0 1 X Off On Not Valid Active 0 1 0 X On Off Not Valid Active 0 1 1 X On On Not Valid Shutdown 1 X [6] X[6] Low Not Valid Not Valid Not Valid X = Don’t Care EI = In-Band Infrared Intensity at detector Notes: 4. In-Band EI ≤ 115.2 kb/s. 5. Logic Low is a pulsed response. The condition is maintained for duration dependent on the pattern and strength of the incident intensity. 6. To maintain low shutdown current, TXD need to be driven high or low and not left floating. The Remote Control Input should be tied low. CAUTION: The BiCMOS inherent to this design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD.
Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver Viewing Angle 2 θ1/2 30 ° Peak Sensitivity Wavelength λp 875 nm RXD Output Voltage Logic High V OH VCC -0.2 V CC VI OH=-200 µA, EI ≤ 0.3 µW/cm2 Logic Low V OL 0 0.4 V RXD Pulse Width (SIR)[8] tRPW (SIR) 1 7.5 µs θ1/2 ≤ 15°, CL = 9 pF RXD Rise and Fall Times t r, tf 25 100 ns C L = 9 pF Receiver Latency Time[9] tL 25 50 µs EI = 4 µW/cm2 Receiver Wake Up Time [10] tRW 18 100 µs EI = 10 mW/cm 2 IR Transmitter IR Radiant Intensity IE H 10 40 mW/sr I LEDA = 350 mA, θ1/2 ≤ 15°, TXD ≥ VIH. TA = 25°C, V(RCI) ≤ VIL IR Viewing Angle 2 θ1/2 30 60 ° IR Peak Wavelength λp 875 nm TXD Logic Levels High V IH 2/3 VCC VCC V Low V IL 0 1/3 V CC V TXD Input Current High I H 0.02 1 µAV I ≥ VIH Low I L –1 -0.02 1 µA0 ≤ VI ≤ VIL LED Current Shutdown I VLED 20 1000 nA V I(SD) ≥ VIH, TA = 25°C Wakeup Time[11] tTW 30 100 ns Maximum Optical PW[12] tPW(Max)2 5 5 0 µs TXD Rise and Fall Time (Optical) t r, tf 600 ns LED Anode on State Voltage V ON(LEDA) 2.2 V I LEDA = 350 mA, VI(TXD) ≥ VIH, V(RCI) ≤ VIL RC Transmitter Remote Control (RC) IE H 5 20 mW/sr I LEDA = 400 mA, θ1/2 ≤ 15°, Radiant Intensity[13] TXD ≤ VIL, TA = 25°C, V(RCI) ≥ VIH RC Viewing Angle 2 θ1/2 30 60 ° RC Peak Wavelength λp 940 nm Transceiver Input Current High I H 0.01 1 µAV I ≥ VIH Low I L –1 –0.02 1 µA0 ≤ VI ≤ VIL Supply Current Shutdown I CC1 0.01 1 µAV SD ≥ VCC - 0.5; TA = 25°C Idle I CC2 290 450 µAV I(TXD) ≤ VIL, EI = 0 Active I CC3 28 m A V I(TXD) ≥ VIL
ALL DIMENSIONS IN MILLIMETERS (mm). Figure 12. Package outline dimension.
Figure 13. Tape and reel dimensions.
Baking should only be done once. Figure 14. Baking conditions chart.
convective reflow solder process. printed circuit board connections. seconds) to dry the solder paste. Figure 15. Reflow graph.
1.0 Solder Pad, Mask and Metal
Figure 16. Stencil and PCBA.
1.1 Recommended Land Pattern
Figure 17. Land pattern.
1.3 Adjacent Land Keepout and
Figure 19. Adjacent land keepout and solder mask areas.
1.2 Recommended Metal Solder
thickness that should be used. Figure 18. Solder stencil aperture.
- The ground plane should be
- The shield trace is a wide, low
- The AGND pin should be con-
- C1 and C2 are optional supply
Figure 20. PCB layout suggestion.
Appendix C : General Application Guide for the HSDL-3002 Infrared IrDA Compliant 115.2 Kb/s Transceiver
Description
The HSDL-3002, a wide voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile Minimum Peak Recommended R1 V CC Intensity Pulse LED Current Conditions 2.2 Ω 3.0 V 40 mW/sr 350 mA Turn on 870 nm LED only TxD ≥ VIH, V(RC) ≤ VIL 20 mW/sr 400 mA Turn on 940 nm LED only TXD ≤ VIL, V(RC) ≥ VIH The resistor value chosen above is for optimal IrDA operation. For optimized remote control performance, it is recommended to turn on both the 870 nm and 940 nm LEDs. Moreover, separate power control feature can be incorporated for remote control operation by implement- ing device as shown in Figure 3. computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It also includes a 940 nm LED to support universal remote control applications. It is fully compliant to IrDA 1.4 low power specifica- tion from 9.6 kb/s to 115.2 kb/s, and supports most remote control codes. The design of the HSDL- 3002 also includes the following unique features:
- An additional spectrally suited 940 nm LED
- Low passive component count.
- Shutdown mode for low power consumption requirement. Selection of Resistor R1 Resistor R1 should be selected to provide the appropriate peak pulse LED current over different ranges of V CC as shown in the table below. Interface to Recommended I/O Chips The HSDL-3002’s TXD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s up to 115.2 kb/s is available at the RXD pin. The V(RC), pin 2, in conjunction with TxD (IrDA), pin 3, can be used to send remote control codes. Pin 2 is driven through a switching FET transistor with a very low on- resistance capable of driving 400 mA of current for remote control operation. The block diagram below shows how the IrDA port fits into a mobile phone and PDA platform.
Figure 21. IR layout in mobile phone platform.
Figure 22. IR layout in PDA platform.
index of the window material. Figure 23. Window design diagram.
Polycarbonate is recommended. Note: 920A and 940A are more flame retardant than 141L. Module Depth (z) mm Max. Min. Max. Min. should be measured at 875 nm.
Figure 26. Shape of windows. effect of the front surface curve.
For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countrie s. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. Obsoletes 5988-7424EN 5988-4165EN May 27, 2006