HSDL-3000-007

HSDL-3000-007 LITEON | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 14

Technical content

Features

• Fully compliant to IrDA 1.3 specifications: – 2.4 kbps to 115.2 kbps – Excellent nose-to-nose operation – Typical link distance > 1.5 m
• Guaranteed temperature performance, –20 to 70 °C – Critical parameters are guaranteed over tempera- ture and supply voltages
• Low power consumption – Low shutdown current (10 nA typical) – Complete shutdown for TXD, RXD, and PIN diode
• Small module size – 2.70 x 9.10 x 3.65 mm (HxWxD)
• Withstands >100 mVp-p power supply ripple typically
• VCC supply 2.7 to 5.5 volts
• LED stuck-high protection
• IEC 825-Class 1 eye safe
• Designed to accommodate light loss with cosmetic windows

Applications

• Data communication – PDAs – Notebooks – Printers
• Mobile telecom – Cellular phones – Pagers – Smart phones
• Digital imaging – Digital cameras – Photo-imaging printers
• Electronic wallet
• Medical and industry data collection HSDL-3000#007/017 IrDA® Data Compliant 115.2 kbps Infrared Transceiver Data Sheet

I/O Pins Configuration Table Pin Symbol Description Notes 1 LED A LED Anode Tied through external resistor, R1, to regulated VCC from 2.7 to 5.5 volts. 2 TXD Transmitter Data Input. Logic High turns on the LED. If held high longer than ~ 50 µs, the LED is turned Active High. off. TXD must be either driven high or low. Do NOT float the pin. 3 RXD Receiver Data Output. Output is a low pulse response when a light pulse is seen. Active Low. 4 SD Shutdown. Complete shutdown TXD, RXD, and PIN diode. Active High. 5 VCC Supply Voltage Regulated, 2.7 to 5.5 volts. 6 GND Ground Connect to system ground. – SHIELD EMI Shield Connect to system ground via a low inductance trace. For best performance, do not connect to GND directly at the part. Pinout Recommended Application Circuit Components Component Recommended Value R1 2.2 Ω ± 5%, 0.25 Watt, for 2.7 ≤ VCC ≤ 3.3 V operation Watt, for 4.5 ≤ VCC ≤ 5.5 V operation CX1[1] 0.47 µF ± 20%, X7R Ceramic CX2[2] 6.8 µF ± 20%, Tantalum Caution: The BiCMOS inherent to the design of this component increases the component’s susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken during han- dling and assembly of this component to prevent damage and/or degradation, which may be induced by ESD. Notes: 1. CX1 must be placed within 0.7 cm of HSDL-3000 to obtain optimum noise immunity. 2. In environments with noisy power supplies, supply rejection can be enhanced by including CX2 as shown in ”HSDL-3000 Functional Block Diagram“on page 2. GND (6) VCC (5) LEDA (1) VCC TRANSMITTER HSDL-3xxx CX1 TXD (2) SHIELD SD (4) RXD (3) CX2 RECEIVER 6 5 4 3 2 1 REAR VIEW Marking Information The HSDL-3000#007/017 is marked with a number “0” and “YWWLL ” on the shield where ‘Y’ indicates the unit’s manufacturing year, ‘WW’ refers to the work week and ‘LL ’ is the lot information.

For implementations where case to ambient thermal resistance is ≤ 50°C/W. Parameter Symbol Min. Max. Units Conditions Storage Temperature TS –40 100 °C Operating Temperature TA –20 70 °C LED Supply Voltage VLED 0 7 V Supply Voltage VCC 0 7 V Output Voltage: RXD VO –0.5 7 V LED Current Pulse Amplitude ILED 500 mA ≤ 90 µs Pulse Width ≤ 20% Duty Cycle Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature TA –20 70 °C Supply Voltage VCC 2.7 5.5 V Logic Input Logic High VIH 2/3 VCC VCC V Voltage for TXD Logic Low VIL 0 1/3 VCC V Receiver Input Logic High EIH 0.0036 500 mW/cm2 For in-band signals ≤ 115.2 kbps[1] Irradiance Logic Low EIL 0.3 µW/cm2 For in-band signals[1] TXD Pulse Width (SIR) tTPW (SIR) 1.5 1.6 µs tPW (TXD) = 1.6 µs at 115.2 kbps Receiver Data Rate 2.4 115.2 kbps Ambient Light See Test Methods on page 16 for details.

Electrical & Optical Specifications Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be any- where in their operating range. All typical values (Typ.) are at 25°C with VCC set to 3.0 V unless otherwise noted. Parameter Symbol Min. Typ. Max. Units Conditions Receiver Viewing Angle 2φ1/2 30 ° Peak Sensitivity λp 875 nm Wavelength RXD Output Voltage Logic High VOH VCC –0.2 VCC V IOH = –200 µA, EI ≤ 0.3 µW/cm2 Logic Low VOL 0 0.4 V RXD Pulse Width (SIR)[2] tRPW (SIR) 1 7.5 µs θ1/2 ≤ 15°, CL = 9 pF RXD Rise and Fall Times tr, tf 25 100 ns CL = 9 pF Receiver Latency Time[3] tL 25 50 µs Receiver Wake Up Time[4] tRW 18 100 µs EI = 10 mW/cm2 Transmitter Radiant Intensity IEH 44 75 mW/sr ILEDA = 350 mA, θ1/2 ≤ 15°, TXD ≥ VIH, TA = 25°C Viewing Angle 2θ1/2 30 60 ° Peak Wavelength λp 875 nm TXD Logic Levels High VIH 2/3 VCC VCC V Low VIL 0 1/3 VCC V TXD Input Current High IH 0.02 1 µA VI ≥ VIH Low IL –1 –0.02 1 µA 0 ≤ VI ≤ VIL LED Current Shutdown IVLED 20 1000 NA VI (SD) ≥ VIH, TA = 25°C Wakeup Time[5] tTW 30 100 ns Maximum Optical tPW(Max) 25 50 µs Pulse Width[6] TXD Rise and tr, tf 600 ns Fall Time (Optical) LED Anode on State VON (LEDA) 2.2 V ILEDA = 350 mA, VI (TXD) ≤ VIL Voltage

High IH 0.01 1 µA VI ≥ VIH Low IL –1 -0.02 1 µA 0 ≤ VI ≤ VIL Supply Current Shutdown ICC1 0.01 1 µA VSD ≥ VCC – 0.5, TA = 25°C Idle ICC2 290 450 µA VI(TXD) ≤ VIL, EI = 0 Active ICC3 2 8 mA VI(TXD) ≥ VIL Notes: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification. 3. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity. 4. Receiver wake up time is measured from VCC power on to valid RXD output. 5. Transmitter wake up time is measured from VCC power on to valid light output in response to a TXD pulse. 6. Maximum optical pulse width is defined as the maximum time that the LED will remain on. This is to prevent the long turn on time for the LED. Electrical & Optical Specifications (Continued) Parameter Symbol Min. Typ. Max. Units Conditions ILED (mA) 500 VCC (V) HSDL-3000 Graph 1 3.9 4.8 290 320 470 2.4 5.7 410 2.7 4.2 380 3.3 3.6 4.5 5.4 350 440 3.0 5.1 2.2 Ω 6.8 Ω 2.7 Ω ILED (mA) 500 VON (LEDA) HSDL-3000 Graph 2 1.95 2.05 290 320 470 1.80 2.20 410 1.85 380 1.90 2.00 2.15 350 440 2.10 IEH (mW/sr) 110 ILED (mA) HSDL-3000 Graph 3 300 380 100 1.80 500 220 260 340 460 420

HSDL-3000#007 and HSDL-3000#017 Package Outline with Dimension and Recommended PC Board Pad Layout RECOMMENDED LAND PATTERN

0.55 DIMENSIONS

HEIGHT: WIDTH: DEPTH: 8.60 1.20 0.60 (2 PLACES)PITCH 1.55 (5X) 3.652.95 0.25 6 5 4 3 2 1 1.55 0.85 3.05 1.10 9.10 ± 0.15 5.801.25 1.55 1.35 2.70 ± 0.15 UNLESS OTHERWISE STATED, TOLERANCES ± 0.2 mm 2.70 ± 0.15 mm 9.10 ± 0.15 mm 3.65 ± 0.20 mm 1 2 3 4 5 6 2.30 0.50 2.602.65 0.70 0.425 0.65 (4 PLACES) 3.13

16.40 + 2.00 B C 2.00 ± 0.50 3.46 8.00 ± 0.10 4.00 ± 0.10 16.00 ± 0.30 1.75 ± 0.10 1.55 ± 0.05 0.40 ± 0.10 3.00 ± 0.10 POLARITY EMPTY PARTS MOUNTED LEADER EMPTY (40 mm MIN.) (40 mm MIN.) (40 mm MIN.) 1.13 ± 0.10 PROGRESSIVE DIRECTION "B" "C" QUANTITY PIN 6: GND PIN 1: VLED +0.10 3.30+0.10 7.50 ± 0.10 R 1.00 2.00 ± 0.50 DIA. 13.00 ± 0.50 21.00 ± 0.80 LABEL DETAIL A DETAIL A 330 80 2500 9.50 ± 0.10 5.00 (MAX.) 1 2 3 4 5 6 3.40 ± 0.20 4.20 ± 0.20 8.00 (MAX.) MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT ACTIVATED ADHESIVE UNIT: mm HSDL-3000#007 and HSDL-3000#017 Tape and Reel Dimensions

The HSDL-3000 is shipped in moisture proof packaging. Once opened, moisture absorption begins. Recommended Storage Conditions Storage Temperature 10°C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. Baking If the parts are not stored in a dry environment, they must be baked before reflow process to prevent damage to parts. Baking should be done only once. Packaging Baking Temperature Baking Time In Reel 60°C ≥ 48 hours In Bulk 100°C ≥ 4 hours 125°C ≥ 2 hours 150°C ≥ 1 hour

(SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (°C) R3 R4 217 MAX 260°C 60 sec to 150 sec Above 217°C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow sol- der process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates or duration. The ∆T/∆time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1 , the PC board and HSDL-3000 pins are heated to a temperature of 150 °C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3 °C per second to allow for even heating of both the PC board and HSDL-3000 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255 °C (491 °F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections be - comes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6 °C per second maxi - mum. This limitation is necessary to allow the PC board and HSDL-3000 pins to change dimensions evenly, put - ting minimal stresses on the HSDL-3000. It is recommended to perform reflow soldering no more than twice. Recommended Reflow Profile Process Zone Symbol T Maximum ∆T/ time or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 60s to 180s Solder Reflow P3, R3P3, R4 200°C to 255°C 255°C to 200°C 3°C/s-6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s Time maintained above 217°C > 217°C 60s to 150s Peak Temperature 260°C Time within 5°C of actual Peak Temperature > 255°C 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins max.

1.0 Solder Pad, Mask and Metal Solder Stencil Aperture

Figure 1. Stencil and PCBA.

1.1 Recommended Land Pattern for HSDL-3000

Figure 2. Top view of land pattern.

1.2 Adjacent Land Keep-out and Solder Mask Areas

Figure 3. HSDL-3000#007/#017 PCBA – Adjacent land keep-out and solder mask.

• Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area.
• “h” is the minimum solder resist strip width required to avoid solder bridging adjacent pads.
• It is recommended that 2 fiducial cross be placed at mid-length of the pads for unit alignment. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. HSDL-3000 fig 3.0 PCBA Land Keep-Out h l Tx LENSRx LENS j SOLDER MASKLAND k Y X

2.0 Recommended Solder Paste/Cream Volume for

60 to 65% solid content by volume).

2.1 Recommended Metal Solder Stencil Aperture

w, the width of aperture, is fixed at 0.85 mm (0.034 inches). Figure 4. Solder paste stencil aperture.

Appendix B: HSDL-3000#007/#017 – Recommended Optical Port Design Z X Y To insure IrDA compliance, some constraints on the height and width of the window exist. The minimum di- mensions ensure that the IrDA cone angles are met with- out vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 degrees, the maximum, to a cone angle of 60 degrees. X is the width of the window, Y is the height of the win - dow, and Z is the distance from the HSDL-3000 to the back of the window. The distance from the center of the LED lens to the cen - ter of the photodiode lens is 5.80 mm. The equations for the size of the window are as follows: X = 5.80 +2(Z + D) tan θ Y = 2(Z + D) tan θ Where θ is the required half angle for viewing. For the IrDA minimum, it is 15 degrees, for the IrDA maximum it is 30 degrees. (D is the depth of the LED image inside the part, 3.2 mm from the Tx lens vertex). These equations result in the following tables and graphs: Minimum and Maximum Window Sizes Depth (Z) mm X min. Y min. X max. Y max. 0 7.34 1.71 9.33 3.70 1 7.88 2.25 10.48 4.85 2 8.42 2.79 11.63 6.00 3 8.95 3.32 12.79 7.16 4 9.49 3.86 13.94 8.31 5 10.02 4.39 15.10 9.47 6 10.56 4.93 16.25 10.62 7 11.10 5.47 17.41 11.78 8 11.63 6.00 18.56 12.93 9 12.17 6.54 19.72 14.09 10 12.70 7.07 20.87 15.24 11 13.24 7.61 22.03 16.40 12 13.77 8.14 23.18 17.55 13 14.31 8.68 24.34 18.71 14 14.85 9.22 25.49 19.86 15 15.38 9.75 26.65 21.01 16 15.92 10.29 27.80 22.17 17 16.46 10.83 28.95 23.32 18 16.99 11.36 30.11 24.48 19 17.53 11.90 31.26 25.63 20 18.06 12.43 32.42 26.79 Dimensions are in mm. Window width X vs. module depth Z. Window height Y vs. module depth Z.WINDOW WIDTH X – mm MODULE DEPTH Z – mm HSDL-3000 Width vs Depth 4 8 0 10 2 6 20 X MAX. X MIN. WINDOW HEIGHT Y – mm MODULE DEPTH Z – mm HSDL-3000 Window Ht vs Module Depth 4 8 0 10 2 6 ACCEPTABLE RANGE Y MAX. Y MIN.

(first choice) Curved Front, Flat Back (do not use) Curved Front and Back (second choice) Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the ra- diation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical design rea- sons, place a curve on the back side of the window that has the same radius as the front side. While this will not completely eliminate the lens effect of the front curved surface, it will reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. HSDL-3000 Flat Window HSDL-3000 Curved Window HSDL-3000 Curved/Flat Window

Background Light and Electro-magnetic Field There are four ambient interference conditions in which the receiver is to operate correctly. The conditions are to be applied separately: 1. Electromagnetic field:

3 V/m maximum (please refer to IEC 61000-4-3 severity

level 3 for details). 2. Sunlight: 10 kilolux maximum at the optical port. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 µW/ cm2 (with no modulation) at the optical port. The light source faces the optical port. This simulates sunlight within the IrDA spectral range. The effect of longer wavelength radation is covered by the incandescent condition. 3. Incandescent Lighting: 1000 lux maximum. This is produced with general service, tungsten-filament, gas-filled, inside frosted lamps in the 60 Watt to 100 Watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The source is expected to have a filament temperature in the 2700 to 3050 Kelvin range and a spectral peak in the 850 to 1050 nm range. 4. Fluorescent Lighting: 1000 lux maximum. This is simulated with an IR source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 µW/cm2 minimum and 0.3 µW/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. The light sources are above the test area. The frequency of the optical signal is swept over the frequency range from 20 kHz to 200 kHz. Due to the variety of fluorescent lamps and the range of IR emissions, this condition is not expected to cover all circum- stances. It will provide a common floor for IrDA operation. For company and product information, please go to our web site: WWW.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx Data subject to change. Copyright © 2007 Lite-On Technology Corporation. All rights reserved.