HSD965 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6537 Issued Date : 1992.11.25 Revised Date : 2002.02.22 Page No. : 1/3 HSD965 HSMC Product Specification HSD965 NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSD965 is suited for use as AF output amplifier and flash unit. Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 40 - - V IC=100uA, IE=0 BVCEO 20 - - V IC=1mA, IB=0 BVEBO 7 - - V IE=10uA, IC=0 ICBO - - 0.1 uA VCB=10V, IE=0 IEBO - - 0.1 uA VEB=7V, IC=0 *VCE(sat) - 0.35 1 V IC=3A, IB=100mA *hFE1 230 - 800 VCE=2V, IC=0.5A *hFE2 150 - - VCE=2V, IC=2A fT - 150 - MHz VCE=6V, IE=50mA Cob - - 50 pF VCB=20V, f=1MHz, IE=0 *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE Rank Q R S Range 230-380 340-600 560-800 TO-92
MICROELECTRONICS CORP. Spec. No. : HE6537 Issued Date : 1992.11.25 Revised Date : 2002.02.22 Page No. : 2/3 HSD965 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 10000 10 100 1000 10000 Collector Current-IC (mA) HFE 25oC o C 125oC hFE @ VCE=2V Saturation Voltage & Collector Current 100 1000 1 10 100 1000 10000 Collector Current-IC (mA) Saturation Voltage (mV) 25oC 75oC 125oC VCE(sat) @ IC=30IB Capacitance & Reverse-Biased Voltage 100 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Cutoff Frequency & Collector Current 100 1000 1 10 100 1000 Collector Current-IC (mA) Cutoff Frequency (MHz)... VCE=6V Safe Operating Area 100 1000 10000 1 10 100 Forward Biased Voltage-VCE (V) Collector Current-I C (mA) PT=1ms PT=100ms PT=1s Power Derating 100 200 300 400 500 600 700 800 0 50 100 150 200 Ambient Temperature-Ta (oC) Power Dissipation-PD (mW)
MICROELECTRONICS CORP. Spec. No. : HE6537 Issued Date : 1992.11.25 Revised Date : 2002.02.22 Page No. : 3/3 HSD965 HSMC Product Specification TO-92 Dimension *: Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:
- Lead: 42 Alloy; solder plating
- Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Tel: 886-3-5983621~5 Fax: 886-3-5982931 A D B C I α 1 E F α 2 α 3 GH Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package Marking: HD 695 Date Code Control Code S Rank