HSD1159 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6706-B Issued Date : 1993.01.13 Revised Date : 1999.08.01 Page No. : 1/3 HSMC Product Specification HSD1159 NPN EPITAXIAL PLANAR TRANSISTOR
Description
Capable of efficient drive with small internal loss due to excellent tf. Absolute Maximum Ratings (Ta=25°C)
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO 200 - - V IC=5mA, IE=0 BVCEO 60 - - V IC=5mA, IB=0 BVEBO 6 - - V IE=5mA, IC=0 ICBO - - 0.1 mA VCB=40V, IE=0 IEBO - - 0.1 mA VEB=5V, IC=0 *VCE(sat) - 0.5 1 V IC=4A, IB=0.4A *VBE(sat) - - 1.5 V IC=4A, IB=0.4A *hFE1 30 - 160 IC=1A, VCE=5V *hFE2 25 - - IC=4A, VCE=5V ft - 10 - MHz VCE=5V, IC=1A *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
MICROELECTRONICS CORP. Spec. No. : HE6706-B Issued Date : 1993.01.13 Revised Date : 1999.08.01 Page No. : 2/3 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1 10 100 1000 10000 Collector Current (mA) hFE hFE @ VCE=5V Saturation Voltage & Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current (mA) Saturation Voltage (mV) VBE (sat) @ IC=10IB VCE (sat) @ IC=10IB On Voltage & Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current (mA) On Voltage (mV) VBE (on) @ VCE=4V Switching Time & Collector Current 0.01 0.1 0.1 1.0 10.0 Collector Current (A) Switching Times (us) Ton Tstg Tf Capacitance & Reverse-Biased Voltage 100 1000 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Safe Operating Area 100 1000 10000 100000 1 10 100 1000 Forward Voltage-VCE (V) Collector Current-IC (mA) PT=1 ms PT=100 ms PT=1 s
MICROELECTRONICS CORP. Spec. No. : HE6706-B Issued Date : 1993.01.13 Revised Date : 1999.08.01 Page No. : 3/3 HSMC Product Specification TO-220AB Dimension *:Typical Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A B E G I KM OP C N H D Style : Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-220AB Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank