HSBR10100CT HSMC | Alldatasheet

Document overview

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Technical content

Features

  • Low Forward Voltage Drop
  • High Current Capability
  • High Reliability
  • High Surge Current Capability
  • High ESD capability; Mechanical Data
  • Cases: TO-220 molded plastic body
  • Epoxy: UL 94V-0 rate flame retardant
  • Lead: Axial leads, solderable per MIL-STD-750, Method 2026 guaranteed
  • High temperature soldering guaranteed: 250°C/10seconds/.375”(9.5mm) lead lengths at 5lbs.(2.3kg) tension
  • Weight: 2.05gram Maximum Ratings & Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load. Derate current by 20%. Ratings Symbol HSBR 10100CTE HSBR 10100CTF HSBR 10150CTE HSBR 10150CTF Unit Repetitive Peak Reverse Voltage VRRM 100 150 V Surge Peak Reverse Voltage VRSM 70 105 V DC Blocking Voltage VDC 100 150 V Average Forward Rectified Current (TA=75oC) I FAV 10 10 A Peak Forward Surge Current, 50Hz Half Sine-wave (TA=25oC) IFSM 175 175 A Repetitive Peak Forward C (f>15Hz) IFRM 5 5 A Instantaneous Forward Voltage@5.0A VF 0.85 0.90 V Leakage Current (TJ=25oC, VR=VRRM) 0.2 0.2 mA Leakage Current (TJ=100oC, VR=VRRM) IR 20 20 mA Typical thermal resistance RθJC 2.4 3.5 2.4 3.5 °C/W Operating Junction Temperature Range TJ -65 to +150 °C Storage Temperature Range TSTG -65 to +150 °C

MICROELECTRONICS CORP. Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 2/4 HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification Characteristics Curve Maximum Non-repetitive Peak Forw ard Surge Current 100 120 140 160 180 200 1 10 100 Number of Cycles at 50Hz Peak Forward Surge Current(A) T j=T jmax.8.3ms single half sine-wave(JEDEC Method) Maximum Non-repetitive Peak Forw ard Surge Current 100 120 140 160 180 200 1 10 100 Number of Cycles at 50Hz Peak Forward Surge Current(A) T j=T jmax.8.3ms single half sine-wave(JEDEC Method) Typical Instantaneous Forw ard Characteristics 0.001 0.01 0.1 0 0.2 0.4 0.6 0.8 1 VF,Forward Voltage(V) IF,Forward Current 150V100V Ta=25℃ Typical Reverse Characteristics 0.0001 0.001 0.01 0.1 02 0 4 0 6 0 8 0 1 0 0 1 2 Percent of Rated Peak Reverse Voltage(V) Instantaneous Reverse Curre Typical Reverse Characteristics 0.0001 0.001 0.01 0.1 0 50 100 150 Percent of Rated Peak Reverse Voltage(V) Instantaneous Reve Current(mA) Tj=150℃ 100V n Tj=25℃ Tj=150℃ Tj=125℃ Tj=100℃ Tj=75℃ 150V Tj=120℃ Tj=100℃ Tj=75℃ Tj=25℃ Forw ard Current Derating Curve 0 25 50 75 100 125 150 175 Lead Temperature(℃) Average Forward Curren Resistive or Inductive Load 0.375"(9.5mm)lead length

MICROELECTRONICS CORP. Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 3/4 HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification TO-220AB Dimension DIM Min. Max. A 5.58 7.49 B 8.38 8.90 C 4.40 4.70 D 1.15 1.39 E 0.35 0.60 F 2.03 2.92 G 9.66 10.28 H - *16.25 I - *3.83 J 3.00 4.00 K 0.75 0.95 L 2.54 3.42 M 1.14 1.40 N - *2.54 O 12.70 14.27 P 14.48 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package A B E G I KM OP C N H D Tab F JL Marking: Note: Green label is used for pb-free packing Pin Style: 1.Anode 2.Cathode 3.Anode Material:

  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 5.58 7.49 B 8.38 8.90 C 4.40 4.70 D 1.15 1.39 E 0.35 0.60 F 2.03 2.92 G 9.66 10.28 H - *16.25 I - *3.83 J 3.00 4.00 K 0.75 0.95 L 2.54 3.42 M 1.14 1.40 N - *2.54 O 12.70 14.27 P 14.48 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package A B E G I KM OP C N H D Tab F JL Marking: Note: Green label is used for pb-free packing Pin Style: 1.Anode 2.Cathode 3.Anode Material:
  • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

MICROELECTRONICS CORP. Spec. No. : HE200802 Issued Date : 2008.08.19 Revised Date :2009.11.06 Page No. : 4/4 HSBR10100CT Series ~HSBR10150CT Series HSMC Product Specification TO-220FP Dimension A B D F G H I K LM C J N E O Marking: 3-Lead TO-220FP Plastic Package Style: 1.Anode 2.Cathode 3.Anode F 0.3980 0.4039 10.11 10.26 α1 - -2° - *2° G 0.1083 0.1122 2.75 2.85 α2 - *5° - *5° H 0.3386 0.3425 8.60 8.70 α3 - *15° - *15° Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material:

  • Lead: 42 Alloy; solder plating
  • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
  • HSMC reserves the right to make changes to its products without notice.
  • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: Tel: 886-2-25212056 Fax: 886-2-25632712