HSB857 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 1/3 HSB857 HSMC Product Specification HSB857 / 2SB857 PNP EPITAXIAL PLANAR TRANSISTOR
Description
Low frequency power amplifier. Absolute Maximum Ratings (Ta=25°C)
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -70 - - V IC=-10uA, IE=0 BVCEO -50 - - V IC=-50mA, IB=0 BVEBO -5 - - V IE=-10uA, IC=0 ICBO - - -1 uA VCB=-50V, IC=0 *VCE(sat) - - -1 V IC=-2A, IB=-0.2A *VBE(on) - - -1 V IC=-1A, VCE=-4V *hFE1 35 - - IC=-0.1A, VCE=-4V *hFE2 60 - 320 IC=-1A, VCE=-4V fT - 15 - MHz VCE=-4V, IC=-500mA, f=100MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE2 Rank B C D hFE 60-120 100-200 160-320
MICROELECTRONICS CORP. Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 2/3 HSB857 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 1 10 100 1000 10000 Collector Current (mA) hFE hFE @ VCE=4V Saturation Voltage & Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current (mA) Saturation Voltage (mV) VBE(sat) @ IC=10IB VBE(sat) @ IC=10IB Switching Time & Collector Current 0.01 0.10 1.00 10.00 0.1 1.0 10.0 Collector Current (A) Switching Times (us) VCC=30V, IC=10IB1= -10IB2 Tstg Tf Ton On Voltage & Collector Current 100 1000 10000 1 10 100 1000 10000 Collector Current (mA) On Voltage (mV) VBE(on) @ VCE=4V Capacitance & Reverse-Biased Voltage 100 1000 0.1 1 10 100 Reverse-Biased Voltage (V) Capacitance (pF) Cob Safe Operating Area 100 1000 10000 100000 1 10 100 Forward Voltage-VCE (V) Collector Current-IC (mA) PT=1ms PT=100ms PT=1s
MICROELECTRONICS CORP. Spec. No. : HE6705 Issued Date : 1995.01.27 Revised Date : 2001.09.13 Page No. : 3/3 HSB857 HSMC Product Specification TO-220AB Dimension *:Typical Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 A B E G I KM OP C N H D Style : Pin 1.Base 2.Collector 3.Emitter 3-Lead TO-220AB Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank