HSB562 HSMC | Alldatasheet
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MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 1/4 HSMC Product Specification HSB562 PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSB562 is designed for general purpose low frequency power amplifier applications. Absolute Maximum Ratings
- Maximum Temperatures
- Maximum Power Dissipation
- Maximum Voltages and Currents (Ta=25°C) Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -25 - - V IC=-10uA, IE=0 BVCEO -20 - - V IC=-1mA, IB=0 BVEBO -5 - - V IE=-10uA, IC=0 ICBO - - -1 uA VCB=-20V, IE=0 *VCE(sat) - - -500 mV IC=-800mA, IB=-80mA VBE(on) - - -1 V IC=-500mA, VCE=-2V *hFE 85 - 240 VCE=-2V, IC=-500mA fT - 350 - MHz VCE=-2V, IC=-500mA Cob - 38 - pF VCB=-10V, f=1MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% Classification Of hFE Rank B C Range 85-170 120-240
MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 2/4 HSMC Product Specification Characteristics Curve Current Gain & Collector Current 100 1000 0.1 1 10 100 1000 Collector Current (mA) hFE VCE=2 V Saturation Voltage & Collector Current 100 1000 0.1 1 10 100 1000 10000 Collector Current (mA) Saturation Voltage (mV)VCE(sat) @ IC=30IB VCE(sat) @ IC=10IB On Voltage & Collector Current 100 1000 10000 0.1 1 10 100 1000 10000 Collector Current (mA) On Voltage (mV) VBE(on) @ VCE=2V Cutoff Frequency & Collector Current 100 1000 1 10 100 1000 Collector Current (mA) Cutoff Frequency (MHz) VCE=2V Capacitance & Reverse-Biased Voltage 100 1000 0.1 1 10 100 Reverse Biased Voltage (V) Capacitance (pF) Cob Safe Operating Area 100 1000 10000 1 10 100 Forward Voltage-VCE (V) Collector Current-IC (mA) PT=1ms PT=100ms PT=1s
MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 3/4 HSMC Product Specification Power Derating 100 200 300 400 500 600 700 800 900 1000 0 20 40 60 80 100 120 140 160 Ambient Temperature-Ta(oC) Power Dissipation-PD(mW)
MICROELECTRONICS CORP. Spec. No. : HE6513-B Issued Date : 1993.01.15 Revised Date : 2000.10.01 Page No. : 4/4 HSMC Product Specification TO-92 Dimension *:Typical D 0.0142 0.0220 0.36 0.56 α1 - *5° - *5° F 0.1323 0.1480 3.36 3.76 α3 - *2° - *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material :
- Lead : 42 Alloy ; solder plating
- Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
- All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
- HSMC reserves the right to make changes to its products without notice.
- HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
- HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 Tel : 886-3-5983621~5 Fax : 886-3-5982931 Tel : 886-3-5977061 Fax : 886-3-5979220 A D B C I α 1 E F α 2 α 3 GH Style : Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package Marking : HSMC Logo Part Number Date Code Product Series Rank Laser Mark HSMC Logo Part Number Product Series Ink Mark